WO2011071626A1 - Power electronic assembly with slotted heatsink - Google Patents
Power electronic assembly with slotted heatsink Download PDFInfo
- Publication number
- WO2011071626A1 WO2011071626A1 PCT/US2010/055794 US2010055794W WO2011071626A1 WO 2011071626 A1 WO2011071626 A1 WO 2011071626A1 US 2010055794 W US2010055794 W US 2010055794W WO 2011071626 A1 WO2011071626 A1 WO 2011071626A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- thermally conductive
- conductive plates
- semiconductor switching
- aperture
- region
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- SVC static VAR compensator
- An SVC typically includes valves or switching elements in the form of thyristor-switched capacitors (TSC) and thyristor switched reactors (TSR). These semiconductor switching elements are packaged in a cylindrical ceramic "press-pack" and arranged in pairs between two flat, copper plates.
- the plates are electrically and thermally conductive members, and are used as heat sinks for the semiconductor switching elements, as well as to apply an external clamping pressure to the press-pack, which is required to permit the silicon semiconductor within the package to make electrical and thermal contact with the soft copper pole faces of the package.
- Multiple assemblies of switching element pairs sandwiched between plate pairs are required to be connected in series to conduct and/or control both polarities of the AC current.
- multiple assemblies are stacked to facilitate the series connection of multiple lower voltage rated devices to achieve compensation for the higher system voltage.
- the resulting valve is operated under dielectric oil which serves as high voltage insulation and as a thermal heat transfer fluid.
- the plates which sandwich the semiconductor switching elements serve as heat sinks to transfer heat generated in the power semiconductors to the oil.
- the plates establish the electrical connection between semiconductor switching element pairs of a given assembly.
- a power electronic assembly includes a pair of thermally conductive plates and semiconductor switching elements positioned between contact surfaces of the pair of thermally conductive plates.
- a first of the semiconductor switching elements is positioned at a first region of the thermally conductive plates and a second of the semiconductor switching elements is positioned at a second region of the thermally conductive plates.
- at least one of the thermally conductive plates includes an aperture positioned between the first region and the second region of the thermally conductive plates, such that in a
- a contact surface of the at least one of the thermally conductive plates associated with the first region is substantially parallel to and offset from that of the second region in a direction parallel to the direction of compression.
- the power electronic assembly may include one or more of the following features.
- At least one of the thermally conductive plates comprises the contact surface and a second surface that is opposed to the contact surface, and the aperture extends from the contact surface to the second surface.
- Both plates of the pair of thermally conductive plates include an aperture positioned between the first region and the second region.
- the aperture is elongated in the plane of the at least one of the thermally conductive plates.
- the aperture includes substantially parallel long sides connected at each end by short sides, and the ratio of length of long sides to short sides is about 50 to 1.
- the aperture includes substantially parallel long sides connected at each end by short sides, and the ratio of length of long sides to short sides is about 200 to 1.
- the aperture is elongated, and extends along a line substantially perpendicular to a line joining the first and the second of the semiconductor switching elements.
- the aperture includes long aperture sides joined by short aperture sides, and the first and the second semiconductor switching elements are located at a position spaced from the short aperture sides.
- the aperture includes long aperture sides joined by short aperture sides, and a line that connects the first and second semiconductor switching elements intersects the aperture at a location Attorney Docket No. 30020-245WO1 substantially midway between the short aperture sides.
- the aperture is linear. At least one of the thermally conductive plates provides an electrical connection between the first of the semiconductor switching elements and the second of the semiconductor switching elements.
- Each of the first and second semiconductor switching elements includes a positive terminal and a negative terminal, and wherein one of the pair of thermally conductive plates provides an electrical connection between the positive terminal of the first semiconductor switching element and the negative terminal of the second semiconductor switching element, and the other of the pair of thermally conductive plates provides an electrical connection between the negative terminal of the first
- At least two assemblies are provided, wherein the at least two assemblies are arranged so that the respective apertures are substantially aligned along a longitudinal axis of the valve.
- a power electronic assembly includes a pair of thermally conductive plates and semiconductor switching elements positioned between contact surfaces of the pair of thermally conductive plates.
- a first of the semiconductor switching elements is positioned at a first region of the thermally conductive plates and a second of the semiconductor switching elements is positioned at a second region of the thermally conductive plates.
- at least one of the thermally conductive plates is configured so that in a compressed state, a contact surface of the at least one of the thermally conductive plates associated with the first region is substantially parallel to and offset from that of the second region in a direction parallel to the direction of compression due to resiliency of the at least one of the thermally conductive plates.
- slotted heat sink plates is advantageous since it decouples the regions of contact of the respective semiconductor switching elements.
- the slot is an elongated opening through the plate that is disposed between the respective
- the semiconductor switching element pair can be clamped between common heat sinks. This automatically establishes an electrical connection between the switching elements, and thus avoids added material and labor expense associated with providing separate heat sinks and electrical connections for each switching element. Moreover, the resultant assembly is substantially smaller than the prior art of separately clamping and providing heatsinks for each series-connected set of semiconductor switching elements.
- Fig. 1 is a side view of the semiconductor switching elements of a thyristor switched capacitor valve.
- Fig. 2 shows the electrical connections between assemblies for a four-assembly portion of the valve during one half of the AC line cycle, illustrating the current path through the valve during the one half AC line cycle.
- Fig. 3 is a side view of a press pack.
- Fig. 4 is an end view of the press pack of Fig. 3 as seen along line 4— 4.
- FIG. 5 is a top perspective view of a slotted heat sink plate.
- Fig. 6 is a sectional view of the slotted heat sink plate of Fig. 5 as seen along line
- Fig. 7 is a sectional view of the slotted heat sink plate of Fig. 5 as seen along line Attorney Docket No. 30020-245WO1
- Fig. 8 is a sectional view of a portion of an assembly of a thyristor-diode pair disposed between slotted heat sink plates.
- Fig. 9 is an illustration of the calculated pressure distribution across a pole face of each of the thyristor (left) and diode (right) for a height mismatch of 0.02 inches between the thyristor (shorter) and diode (taller) for an assembly employing slotted heat sink plates.
- Fig. 10 is an illustration of the calculated pressure distribution across a pole face of each of the diode (left) and thyristor (right) for a height mismatch of 0.02 inches between the diode (taller) and thyristor (shorter) for an assembly employing non-slotted heat sink plates.
- Fig. 11 is a top plan view of the slotted heat sink plate of Fig. 5 illustrating the current path through the plate.
- Fig. 12 is another embodiment of the slotted heat sink plate.
- Fig. 13 is another embodiment of the slotted heat sink plate.
- Fig. 14 is another embodiment of the slotted heat sink plate.
- a thyristor-switched capacitor includes a series of stacked assemblies 10 of semiconductor switching element pairs.
- Each assembly 10 includes a semiconductor switching element pair disposed between a two substantially parallel plates 12a, 12b.
- Platesl2a, 12b are configured to provide heat transfer and current flow between the respective switching elements and the plates 12a, 12b.
- plates 12a, 12b include features which provide improved symmetry and uniformity in the clamping pressure to the switching elements, resulting in improved heat transfer and current flow.
- the semiconductor switching element pair includes a thyristor 30 and a diode 50.
- Multiple assemblies 10 are stacked side -by-side to form a valve 200.
- each assembly 10 is placed adjacent to another assembly 10 so that the plates 12a, 12b of one assembly 10 are substantially parallel to the plates 12a, Attorney Docket No. 30020-245WO1
- assemblies 10 including a paired thyristor 30 and diode 50 are generally not of equal heights.
- a device height mismatch frequently occurs due to the differences in respective device heights of thyristor 30 and diode 50.
- the semiconductor switching element pair includes a pair of thyristors 30 having the same nominal height, normal manufacturing tolerances can result in a subtle height mismatch.
- a significant pressure variation exists across the pole faces of each respective device.
- each assembly 10 is spaced apart from, and serially electrically connected to, an adjacent assembly 10 via cylindrical copper stubs 70 disposed between plates 12a, 12b of adjacent pairs.
- the thyristor 30 and the diode 50 are electrically connected in inverse parallel.
- the cathode of the diode 50 is connected to the anode of the thyristor 30 via the plate 12a or 12b.
- the semiconductor switching elements 30, 50 are packaged in cylindrical press-packs 60, in which the semiconductor wafer floats within the interior space of the package, and axial compression of the press pack 60 is required to achieve an electrical and thermal connection of the semiconductor wafer with the opposed pole faces (terminals) 64, 66 of the press pack 60.
- the thyristor 30 may be a silicon controlled rectifier such as Type K0769NC650 Medium Voltage
- Thyristor sold by Westcode Semiconductors Ltd
- the diode 50 may be a rectifier Attorney Docket No. 30020-245WO1 diode Type W1032LC600 sold by Westcode Semiconductors Ltd.
- the valve 200 is loaded under compression, so that sufficient compression force is applied to the plates 12a, 12b of each assembly 10 to achieve electrical and thermal connection of the thyristor 30 and diode 50 with the respective plates 12a, 12b.
- a pair of threaded clamping rods 72 extend through rod openings 22 in the plates 12a, 12b.
- the clamping rods 72 extend through the plates 12a, 12b from one end 202 of the valve 200 to the opposed end 204, and serve to maintain the plates 12a, 12b in the stacked configuration and also to apply a compression force to the valve 200 as discussed further below.
- Each clamping rod 72 is housed in an insulating conduit 78 that insulates the clamping rods 72 from the plates 12a, 12b.
- support tubes 74 extend through tube openings 20 in the plates 12a, 12b.
- the support tubes 74 extend through the plates 12a, 12b from one end 202 of the valve 200 to the other 204.
- the support tubes 74 support other components of the assembly 10 between the plates 12a, 12b.
- conduits 74 are used to support toroid shaped transformers 76 which provide the gate drive signals to the thyristor 30.
- the conduits 78 and support tubes 74 are laminated with glass insulation so as to be thermally and electrically insulated from the plates 12a, 12b.
- each plate 12 is a thermally and electrically conductive member.
- the plate 12 is flat, substantially uniform in thickness, and generally rectangular in peripheral shape.
- the plate 12 is formed of copper.
- Each plate 12 includes a first surface 14, and a second surface 16 opposed to the first surface 14 and separated from the first surface by the thickness of the plate.
- the plate 12 also includes the openings 20, 22 through which clamping rods 72 and support tubes 74 respectively extend.
- the openings 20, 22 are distributed outside a mid region of the plate.
- the clamping rods 72 are generally midway between a center of the plate 12 and its peripheral edge 18, and the support tubes 72 are disposed adjacent the peripheral edge 18.
- Each plate 12 also includes an elongate aperture or slot 80 that extends Attorney Docket No. 30020-245WO1 completely through the plate 12 from the first surface 14 to the second surface 16.
- the slot 80 is elongated in the plane of the plate 12, and includes substantially parallel long sides 82, 84 that are connected at each end by short sides 86, 88.
- the slot 80 is thin, that is, the long sides of the slot 82, 84, which correspond to the slot length, are much longer than the short sides of the slot 86, 88, which correspond to slot width.
- the ratio of slot length to slot width is about 3 to 1.
- the ratio of slot length to slot width is about 50 to 1.
- the ratio of slot length to slot width is about 200 to 1.
- the slot width generally corresponds to that of the thickness of the plates 12a, 12b and the slot length is maximized in accordance with constraints discussed below.
- the slot 80 extends substantially linearly in the plane of the plate 12 such that the short sides 86, 88 are adjacent to, but spaced apart from, opposed portions of the peripheral edge 18 of the plate 12. That is, the slot 80 extends across the mid portion of the plate 12 but does not extend to the peripheral edge 18, whereby the plate 12 is continuous in the vicinity of the peripheral edge 18. This continuity of the periphery of the plate 12 is important to provide sufficient cross sectional area to permit adequate current flow between the respective terminals of the thyristor 30 and diode 50 without generating hot-spots within the plate 12.
- the slot 80 is made as long possible while maintaining plate integrity and adequate current flow area.
- the slot 80 decouples a first region 96 of the plate 12 associated with one of the semiconductor switching elements, such as the thyristor 30, from a second region 98 of the plate 12 associated with the other of the semiconductor switching elements, in this case the diode 50.
- the length of the slot 80 is made as long as possible, the mechanical decoupling of the first region 96 from the second region 98 is maximized.
- the thyristor 30 and diode 50 are disposed in the mid portion of the plate, and are spaced apart from each other.
- the slot 80 is located between the thyristor 30 and diode Attorney Docket No. 30020-245WO1
- an imaginary line L that connects the thyristor 30 and the diode 50 intersects the slot 80 at a location between the short sides 86, 88 of the slot. That is, the semiconductor switching elements 30, 50 are located at a position spaced from the slot ends 86, 88. In some embodiments, the line L that connects the thyristor 30 and the diode 50 intersects the slot 80 at a location substantially midway between the short sides 86, 88 of the slot. In some embodiments, the line L that connects the thyristor 30 and the diode 50 intersects and is perpendicular to the slot 80.
- the valve 200 includes eight individual assemblies 10, each of which includes the thyristor 30 and diode 50 sandwiched between plates 12a, 12b.
- the assemblies are arranged side -by-side as described above, and a compression load is applied to the opposed ends 202, 204 of the valve 200.
- This can be accomplished, for example, by sandwiching the valve 200 between a fixed base 208 and a movable base 210, each mounted on the clamping rods 72 in parallel with the plates 12a, 12b of the assemblies 10.
- the movable base 210 is driven toward the fixed base 208 by tightening nuts engaged with the threaded ends of the clamping rods 72.
- each assembly 10 is loaded in compression.
- sufficient compression force is applied to each assembly 10 to achieve electrical and thermal connection of the thyristor 30 and diode 50 with the respective plates 12a, 12b.
- the applied compression force may be about 20 kN.
- the valve 200 is enclosed in a tank (not shown) and is operated in dielectric oil which serves as a high voltage insulation and as a thermal heat transfer fluid. Because of the high thermal conductivity of the dielectric oil, the flat copper plates 12a, 12b serve not only as electrical conductors between the thyristor-diode pairs of a given assembly 10, but also serve as heat sinks to transfer heat generated in the semiconductor switching devices to the oil. In use, the valve 200 is arranged so that the plates 12a, 12b of each assembly lie in a vertical plane so as to promote efficient heat convection through the dielectric oil.
- the plate stiffness is Attorney Docket No. 30020-245WO1 reduced in the vicinity of the slot 80.
- the slot 80 positioned between the first region 96 and the second region 98 of each of the plates 12a, 12b, permits a contact surface of plates 12a, 12b associated with the first region to be oriented substantially parallel to and offset a distance x from that of the second region in a direction parallel to the direction of compression.
- FIG. 9 represents the calculated pressure distribution across the pole face of each of the thyristor (left) and diode (right) for a height mismatch of 0.02 inches, where the axial length of the diode is greater than that of the thyristor, and the plates 12a, 12b include slots as described above.
- Fig. 10 represents the calculated pressure distribution across the pole face of each of the diode (left) and thyristor (right) for a height mismatch of 0.02 inches, where the heat sink plates 12a, 12b are formed without a slot.
- the pressure is disproportionately distributed over the pole face of the device such that pressure is concentrated to one side of the device surface.
- the pole face of the thyristor experiences
- This alternating placement of the devices 30, 50 nulls the cumulative nominal differential thickness of semiconductor switching elements from one end 202 of the valve 200 to the other end 202.
- This necessary current transfer requires that there be sufficient cross-sectional area between the end of the slot at 86 and 88 and other plate features such as the opening 20 and the peripheral edges 18.
- the slot 80 is not limited to this configuration.
- the slot 80 may extend along the plate 12 in a non linear form, such as single smooth curve (280, Fig. 13), a serpentine (180, Fig. 12) or a zig-zag (380, Fig. 14).
- the aperture may be irregularly shaped, for example, it may be non-symmetric about a midpoint thereof or of non-uniform width.
- the shape of the slot 80 may determined by forming a slot 80 of sufficient length while also providing a shape which provides sufficient distance from other plate features, such as the openings 20, 22, to permit adequate current flow without formation of hot spots.
- slotted heat sink plates 12 as applied to the thryristor switched capacitor, it is understood that the slotted heat sink plates 12 would have application to other switching systems including, but not limited to thyristor switched reactors.
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP10778796A EP2510543A1 (en) | 2009-12-07 | 2010-11-08 | Power electronic assembly with slotted heatsink |
AU2010328561A AU2010328561A1 (en) | 2009-12-07 | 2010-11-08 | Power electronic assembly with slotted heatsink |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/632,379 | 2009-12-07 | ||
US12/632,379 US8189324B2 (en) | 2009-12-07 | 2009-12-07 | Power electronic assembly with slotted heatsink |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2011071626A1 true WO2011071626A1 (en) | 2011-06-16 |
Family
ID=43502677
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2010/055794 WO2011071626A1 (en) | 2009-12-07 | 2010-11-08 | Power electronic assembly with slotted heatsink |
Country Status (4)
Country | Link |
---|---|
US (1) | US8189324B2 (en) |
EP (1) | EP2510543A1 (en) |
AU (1) | AU2010328561A1 (en) |
WO (1) | WO2011071626A1 (en) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101452927B (en) * | 2008-12-31 | 2010-06-02 | 中国电力科学研究院 | A self-cooling type thyratron transistor valve |
JP5158176B2 (en) * | 2010-02-05 | 2013-03-06 | 株式会社デンソー | Power converter |
JP5327195B2 (en) * | 2010-02-05 | 2013-10-30 | 株式会社デンソー | Power converter |
JP5423655B2 (en) * | 2010-02-05 | 2014-02-19 | 株式会社デンソー | Power converter |
JP5423654B2 (en) * | 2010-02-05 | 2014-02-19 | 株式会社デンソー | Power converter |
JP4924750B2 (en) * | 2010-02-05 | 2012-04-25 | 株式会社デンソー | Power converter |
JP2014532998A (en) * | 2011-11-04 | 2014-12-08 | パーカー・ハニフィン・コーポレーション | Apparatus and method for cooling a random access memory (RAM) module |
US8896023B2 (en) * | 2013-02-20 | 2014-11-25 | Alstom Technology Ltd | Silicon devices/heatsinks stack assembly and a method to pull apart a faulty silicon device in said stack assembly |
CN103354234B (en) * | 2013-06-26 | 2015-11-04 | 许继电气股份有限公司 | A kind of thyristor converter valve module |
EP2825009B8 (en) * | 2013-07-09 | 2016-11-23 | ABB Schweiz AG | Electric converter with compact module arrangement for subsea applications |
EP2887787A3 (en) * | 2013-12-13 | 2015-08-19 | Hitachi, Ltd. | Cooling structure for heating element and power converter |
AU2015393305B2 (en) * | 2015-04-27 | 2018-11-15 | Toshiba Energy Systems & Solutions Corporation | Pressure-contact type semiconductor element stack |
EP3206468B1 (en) * | 2016-02-15 | 2018-12-26 | Siemens Aktiengesellschaft | Converter with an intermediate d.c. circuit |
US9955613B2 (en) * | 2016-09-13 | 2018-04-24 | Denso International America, Inc. | Cooler and power electronic module having the same |
FR3063386B1 (en) * | 2017-02-28 | 2019-04-12 | Alstom Transport Technologies | POWER MODULE WITH ELECTRONIC CARD COOLING SYSTEM |
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US6320268B1 (en) * | 1999-01-27 | 2001-11-20 | Abb (Schweiz) Ag | Power semiconductor module |
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WO2009132723A1 (en) * | 2008-04-29 | 2009-11-05 | Siemens Ag Österreich | Cooling arrangement comprising two semiconductor components disposed next to one another |
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SE441047B (en) * | 1983-10-06 | 1985-09-02 | Asea Ab | Semi-conductor valve for high voltage with voltage divider sections including resistance |
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-
2009
- 2009-12-07 US US12/632,379 patent/US8189324B2/en not_active Expired - Fee Related
-
2010
- 2010-11-08 EP EP10778796A patent/EP2510543A1/en not_active Withdrawn
- 2010-11-08 WO PCT/US2010/055794 patent/WO2011071626A1/en active Application Filing
- 2010-11-08 AU AU2010328561A patent/AU2010328561A1/en not_active Abandoned
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US3573574A (en) * | 1969-08-12 | 1971-04-06 | Gen Motors Corp | Controlled rectifier mounting assembly |
DE2529954B1 (en) * | 1975-07-04 | 1976-11-25 | Siemens Ag | DIRECTOR VALVE |
US6320268B1 (en) * | 1999-01-27 | 2001-11-20 | Abb (Schweiz) Ag | Power semiconductor module |
EP1494278A1 (en) * | 2003-07-04 | 2005-01-05 | Siemens Aktiengesellschaft | Electronic power module with rubber seal, and corresponding manufacturing method |
US20060138452A1 (en) * | 2004-12-16 | 2006-06-29 | Abb Research Ltd | Power semiconductor module |
WO2009132723A1 (en) * | 2008-04-29 | 2009-11-05 | Siemens Ag Österreich | Cooling arrangement comprising two semiconductor components disposed next to one another |
Also Published As
Publication number | Publication date |
---|---|
US20110134609A1 (en) | 2011-06-09 |
AU2010328561A1 (en) | 2012-06-21 |
EP2510543A1 (en) | 2012-10-17 |
US8189324B2 (en) | 2012-05-29 |
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