WO2011160046A3 - Apparatus for use downhole including devices having heat carrier channels - Google Patents

Apparatus for use downhole including devices having heat carrier channels Download PDF

Info

Publication number
WO2011160046A3
WO2011160046A3 PCT/US2011/040924 US2011040924W WO2011160046A3 WO 2011160046 A3 WO2011160046 A3 WO 2011160046A3 US 2011040924 W US2011040924 W US 2011040924W WO 2011160046 A3 WO2011160046 A3 WO 2011160046A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat carrier
including devices
carrier channels
substrate
use downhole
Prior art date
Application number
PCT/US2011/040924
Other languages
French (fr)
Other versions
WO2011160046A2 (en
Inventor
Joerg Lehr
Sebastian Jung
Sascha Schwarze
Ludger Overmeyer
Tobias Kruhn
Original Assignee
Baker Hughes Incorporated
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Baker Hughes Incorporated filed Critical Baker Hughes Incorporated
Priority to BR112012032351A priority Critical patent/BR112012032351A2/en
Priority to AU2011268130A priority patent/AU2011268130B2/en
Priority to GB1223430.8A priority patent/GB2494094A/en
Publication of WO2011160046A2 publication Critical patent/WO2011160046A2/en
Publication of WO2011160046A3 publication Critical patent/WO2011160046A3/en
Priority to NO20130005A priority patent/NO20130005A1/en

Links

Classifications

    • E—FIXED CONSTRUCTIONS
    • E21—EARTH DRILLING; MINING
    • E21B—EARTH DRILLING, e.g. DEEP DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
    • E21B36/00—Heating, cooling, insulating arrangements for boreholes or wells, e.g. for use in permafrost zones
    • E21B36/001—Cooling arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Abstract

A method and apparatus for regulating a temperature of a device in a tool used in a wellbore is disclosed. The device generally includes a substrate and a heat source associated with the substrate that induces heat into the substrate. The substrate includes a fluid channel therein. A fluid system provides the fluid into the fluid channel and out of the fluid channel to control the temperature of the component.
PCT/US2011/040924 2010-06-18 2011-06-17 Apparatus for use downhole including devices having heat carrier channels WO2011160046A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
BR112012032351A BR112012032351A2 (en) 2010-06-18 2011-06-17 apparatus for use well below including devices having carrier channels
AU2011268130A AU2011268130B2 (en) 2010-06-18 2011-06-17 Apparatus for use downhole including devices having heat carrier channels
GB1223430.8A GB2494094A (en) 2010-06-18 2011-06-17 Apparatus for use downhole including devices having heat carrier channels
NO20130005A NO20130005A1 (en) 2010-06-18 2013-01-03 Device for use downhole which includes equipment having heat carrier ducts

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US35643410P 2010-06-18 2010-06-18
US61/356,434 2010-06-18

Publications (2)

Publication Number Publication Date
WO2011160046A2 WO2011160046A2 (en) 2011-12-22
WO2011160046A3 true WO2011160046A3 (en) 2012-02-16

Family

ID=45327650

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2011/040924 WO2011160046A2 (en) 2010-06-18 2011-06-17 Apparatus for use downhole including devices having heat carrier channels

Country Status (6)

Country Link
US (1) US20110308791A1 (en)
AU (1) AU2011268130B2 (en)
BR (1) BR112012032351A2 (en)
GB (1) GB2494094A (en)
NO (1) NO20130005A1 (en)
WO (1) WO2011160046A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9125305B2 (en) * 2010-03-17 2015-09-01 Delta Design, Inc. Devices with pneumatic, hydraulic and electrical components
DE102012106244B4 (en) * 2012-07-11 2020-02-20 Rogers Germany Gmbh Metal-ceramic substrate
US9353618B2 (en) * 2012-10-31 2016-05-31 Baker Hughes Incorporated Apparatus and methods for cooling downhole devices
US9611723B2 (en) * 2014-12-17 2017-04-04 Schlumberger Technology Corporation Heat transferring electronics chassis
AT518472B1 (en) * 2016-04-13 2018-04-15 Zkw Group Gmbh Component cooling device and motor vehicle headlight with component cooling device
US11396794B2 (en) * 2018-05-29 2022-07-26 Baker Hughes, A Ge Company, Llc Device temperature gradient control
US11640929B2 (en) * 2018-12-20 2023-05-02 Intel Corporation Thermal management solutions for cored substrates

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5931000A (en) * 1998-04-23 1999-08-03 Turner; William Evans Cooled electrical system for use downhole
US20050083647A1 (en) * 2002-02-08 2005-04-21 Hitachi, Ltd. Electric device with liquid cooling system and method of manufacturing thereof
US7017622B2 (en) * 2002-12-03 2006-03-28 Forhealth Technologies, Inc. Automated means for removing, parking and replacing a syringe tip cap from a syringe
US20060117759A1 (en) * 2004-12-08 2006-06-08 Hall David R Method and system for cooling electrical components downhole

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US5730217A (en) * 1994-09-12 1998-03-24 Pes, Inc. Vacuum insulated converter for extending the life span of electronic components
US6665185B1 (en) * 2002-10-09 2003-12-16 Ltx Corporation Apparatus and method for embedded fluid cooling in printed circuit boards
US6769487B2 (en) * 2002-12-11 2004-08-03 Schlumberger Technology Corporation Apparatus and method for actively cooling instrumentation in a high temperature environment
US7591302B1 (en) * 2003-07-23 2009-09-22 Cooligy Inc. Pump and fan control concepts in a cooling system
US7215547B2 (en) * 2004-08-16 2007-05-08 Delphi Technologies, Inc. Integrated cooling system for electronic devices
US20060144619A1 (en) * 2005-01-06 2006-07-06 Halliburton Energy Services, Inc. Thermal management apparatus, systems, and methods
EP1761114A3 (en) * 2005-08-31 2009-09-16 Kabushiki Kaisha Toyota Jidoshokki Circuit board
TW200735308A (en) * 2005-12-23 2007-09-16 Koninkl Philips Electronics Nv On-chip interconnect-stack cooling using sacrificial interconnect segments
US7298623B1 (en) * 2006-06-29 2007-11-20 International Business Machines Corporation Organic substrate with integral thermal dissipation channels, and method for producing same
US7806173B2 (en) * 2007-06-21 2010-10-05 Schlumberger Technology Corporation Apparatus and methods to dissipate heat in a downhole tool
JP5032269B2 (en) * 2007-11-02 2012-09-26 東京エレクトロン株式会社 Temperature adjusting apparatus and temperature adjusting method for substrate to be processed, and plasma processing apparatus including the same
GB2482637B (en) * 2009-04-27 2014-05-07 Halliburton Energy Serv Inc Thermal component temperature management system and method
US8567500B2 (en) * 2009-10-06 2013-10-29 Schlumberger Technology Corporation Cooling apparatus and methods for use with downhole tools

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5931000A (en) * 1998-04-23 1999-08-03 Turner; William Evans Cooled electrical system for use downhole
US20050083647A1 (en) * 2002-02-08 2005-04-21 Hitachi, Ltd. Electric device with liquid cooling system and method of manufacturing thereof
US7017622B2 (en) * 2002-12-03 2006-03-28 Forhealth Technologies, Inc. Automated means for removing, parking and replacing a syringe tip cap from a syringe
US20060117759A1 (en) * 2004-12-08 2006-06-08 Hall David R Method and system for cooling electrical components downhole

Also Published As

Publication number Publication date
WO2011160046A2 (en) 2011-12-22
NO20130005A1 (en) 2013-01-14
AU2011268130B2 (en) 2017-02-02
AU2011268130A1 (en) 2013-01-17
GB2494094A (en) 2013-02-27
BR112012032351A2 (en) 2019-09-24
US20110308791A1 (en) 2011-12-22
GB201223430D0 (en) 2013-02-06

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