WO2012019040A3 - Spectrographic monitoring using index tracking after detection of layer clearing - Google Patents

Spectrographic monitoring using index tracking after detection of layer clearing Download PDF

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Publication number
WO2012019040A3
WO2012019040A3 PCT/US2011/046642 US2011046642W WO2012019040A3 WO 2012019040 A3 WO2012019040 A3 WO 2012019040A3 US 2011046642 W US2011046642 W US 2011046642W WO 2012019040 A3 WO2012019040 A3 WO 2012019040A3
Authority
WO
WIPO (PCT)
Prior art keywords
sequence
spectra
layer
polishing
best matching
Prior art date
Application number
PCT/US2011/046642
Other languages
French (fr)
Other versions
WO2012019040A2 (en
Inventor
Jimin Zhang
Zhihong Wang
Harry Q. Lee
Wen-Chiang Tu
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Publication of WO2012019040A2 publication Critical patent/WO2012019040A2/en
Publication of WO2012019040A3 publication Critical patent/WO2012019040A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Abstract

A method of controlling polishing includes storing a library having a plurality of reference spectra, each reference spectrum of the plurality of reference spectra having a stored associated index value, polishing a substrate having a second layer overlying a first layer, measuring a sequence of spectra of light from the substrate during polishing, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum to generate a sequence of best matching reference spectra, determining the associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values, detecting exposure of the first layer, fitting a function to a portion of the sequence of index values corresponding to spectra measured after detection of exposure of the first layer, and determining a polishing endpoint or an adjustment for a polishing rate based on the function.
PCT/US2011/046642 2010-08-05 2011-08-04 Spectrographic monitoring using index tracking after detection of layer clearing WO2012019040A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/851,467 US20120034844A1 (en) 2010-08-05 2010-08-05 Spectrographic monitoring using index tracking after detection of layer clearing
US12/851,467 2010-08-05

Publications (2)

Publication Number Publication Date
WO2012019040A2 WO2012019040A2 (en) 2012-02-09
WO2012019040A3 true WO2012019040A3 (en) 2012-05-10

Family

ID=45556482

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2011/046642 WO2012019040A2 (en) 2010-08-05 2011-08-04 Spectrographic monitoring using index tracking after detection of layer clearing

Country Status (3)

Country Link
US (1) US20120034844A1 (en)
TW (1) TW201213050A (en)
WO (1) WO2012019040A2 (en)

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US9221147B2 (en) * 2012-10-23 2015-12-29 Applied Materials, Inc. Endpointing with selective spectral monitoring
US20140242880A1 (en) * 2013-02-26 2014-08-28 Applied Materials, Inc. Optical model with polarization direction effects for comparison to measured spectrum
JP6060308B2 (en) 2013-03-15 2017-01-11 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ Dynamic control of residue clearing using in situ profile control (ISPC)
TWI784719B (en) * 2016-08-26 2022-11-21 美商應用材料股份有限公司 Method of obtaining measurement representative of thickness of layer on substrate, and metrology system and computer program product
CN109724938B (en) * 2017-10-30 2021-06-11 中国石油化工股份有限公司 Method for predicting properties of lubricating oil base oil by near infrared spectrum
CN109724939B (en) * 2017-10-30 2021-06-11 中国石油化工股份有限公司 Method for predicting hydrogenated tail oil property by near infrared spectrum
CN109724937B (en) * 2017-10-30 2021-05-14 中国石油化工股份有限公司 Method for predicting vacuum distillate oil property by near infrared spectrum
CN112247740A (en) * 2020-09-25 2021-01-22 深圳市裕展精密科技有限公司 Polishing device, polishing method, polishing assisting device, polishing assisting system and polishing assisting method
CN116604464A (en) * 2023-07-19 2023-08-18 合肥晶合集成电路股份有限公司 Wafer grinding control method and device, computer equipment and storage medium

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US8392012B2 (en) * 2008-10-27 2013-03-05 Applied Materials, Inc. Multiple libraries for spectrographic monitoring of zones of a substrate during processing
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US8190285B2 (en) * 2010-05-17 2012-05-29 Applied Materials, Inc. Feedback for polishing rate correction in chemical mechanical polishing
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Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
US6153116A (en) * 1998-08-18 2000-11-28 United Microelectronics Corp. Method of detecting end point and monitoring uniformity in chemical-mechanical polishing operation
US20040165177A1 (en) * 2002-03-29 2004-08-26 Lam Research System and method of broad band optical end point detection for film change indication
US20050026542A1 (en) * 2003-07-31 2005-02-03 Tezer Battal Detection system for chemical-mechanical planarization tool
US20090275265A1 (en) * 2008-05-02 2009-11-05 Applied Materials, Inc. Endpoint detection in chemical mechanical polishing using multiple spectra

Also Published As

Publication number Publication date
US20120034844A1 (en) 2012-02-09
WO2012019040A2 (en) 2012-02-09
TW201213050A (en) 2012-04-01

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