WO2012030363A1 - Voltage switchable dielectric material containing conductor-on-conductor core shelled particles - Google Patents
Voltage switchable dielectric material containing conductor-on-conductor core shelled particles Download PDFInfo
- Publication number
- WO2012030363A1 WO2012030363A1 PCT/US2010/060617 US2010060617W WO2012030363A1 WO 2012030363 A1 WO2012030363 A1 WO 2012030363A1 US 2010060617 W US2010060617 W US 2010060617W WO 2012030363 A1 WO2012030363 A1 WO 2012030363A1
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- WO
- WIPO (PCT)
- Prior art keywords
- particles
- composition
- shell
- core
- conductive
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/105—Varistor cores
- H01C7/108—Metal oxide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0257—Overvoltage protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00013—Fully indexed content
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0257—Overvoltage protection
- H05K1/0259—Electrostatic discharge [ESD] protection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0218—Composite particles, i.e. first metal coated with second metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/073—High voltage adaptations
- H05K2201/0738—Use of voltage responsive materials, e.g. voltage switchable dielectric or varistor materials
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Dispersion Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
- Inorganic Insulating Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Powder Metallurgy (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP10807764A EP2513912A1 (en) | 2009-12-15 | 2010-12-15 | Voltage switchable dielectric material containing conductor-on-conductor core shelled particles |
CN2010800639458A CN102870166A (en) | 2009-12-15 | 2010-12-15 | Voltage switchable dielectric material containing conductor-on-conductor core shelled particles |
SG2012044798A SG181777A1 (en) | 2009-12-15 | 2010-12-15 | Voltage switchable dielectric material containing conductor-on-conductor core shelled particles |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/638,360 | 2009-12-15 | ||
US12/638,360 US9208931B2 (en) | 2008-09-30 | 2009-12-15 | Voltage switchable dielectric material containing conductor-on-conductor core shelled particles |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2012030363A1 true WO2012030363A1 (en) | 2012-03-08 |
Family
ID=44170201
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2010/060617 WO2012030363A1 (en) | 2009-12-15 | 2010-12-15 | Voltage switchable dielectric material containing conductor-on-conductor core shelled particles |
Country Status (6)
Country | Link |
---|---|
US (1) | US9208931B2 (en) |
EP (1) | EP2513912A1 (en) |
KR (1) | KR20120104333A (en) |
CN (1) | CN102870166A (en) |
SG (1) | SG181777A1 (en) |
WO (1) | WO2012030363A1 (en) |
Cited By (1)
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Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7825491B2 (en) * | 2005-11-22 | 2010-11-02 | Shocking Technologies, Inc. | Light-emitting device using voltage switchable dielectric material |
US20100264224A1 (en) * | 2005-11-22 | 2010-10-21 | Lex Kosowsky | Wireless communication device using voltage switchable dielectric material |
US20080032049A1 (en) * | 2006-07-29 | 2008-02-07 | Lex Kosowsky | Voltage switchable dielectric material having high aspect ratio particles |
US7981325B2 (en) * | 2006-07-29 | 2011-07-19 | Shocking Technologies, Inc. | Electronic device for voltage switchable dielectric material having high aspect ratio particles |
US20080029405A1 (en) * | 2006-07-29 | 2008-02-07 | Lex Kosowsky | Voltage switchable dielectric material having conductive or semi-conductive organic material |
US7793236B2 (en) * | 2007-06-13 | 2010-09-07 | Shocking Technologies, Inc. | System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices |
US20100148129A1 (en) * | 2008-12-15 | 2010-06-17 | Lex Kosowsky | Voltage Switchable Dielectric Material Containing Insulative and/or Low-Dielectric Core Shell Particles |
US9053844B2 (en) * | 2009-09-09 | 2015-06-09 | Littelfuse, Inc. | Geometric configuration or alignment of protective material in a gap structure for electrical devices |
EP2564482B1 (en) * | 2010-04-28 | 2023-10-25 | Littelfuse, Inc. | Embedded protection against spurious electrical events |
CN102637658A (en) * | 2011-02-15 | 2012-08-15 | 崔骥 | Electronic device with built-in over-voltage-protection composite film |
US9000453B2 (en) | 2011-06-28 | 2015-04-07 | Osram Sylvania Inc. | Electrostatic discharge protection for electrical components, devices including such protection and methods for making the same |
KR101910977B1 (en) | 2011-11-25 | 2018-10-24 | 삼성전자주식회사 | Graphene ball structure and method of manufacturing the same |
GB2504957A (en) * | 2012-08-14 | 2014-02-19 | Henkel Ag & Co Kgaa | Curable compositions comprising composite particles |
US8815725B2 (en) * | 2013-01-18 | 2014-08-26 | International Business Machines Corporation | Low alpha particle emission electrically-conductive coating |
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US10453974B2 (en) | 2016-02-23 | 2019-10-22 | Basf Se | Conductive paste comprising a silicone oil |
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US20230407052A1 (en) * | 2020-11-16 | 2023-12-21 | Merck Patent Gmbh | Method for variably adjusting the electrical insulating properties of varistor-containing materials |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4977357A (en) | 1988-01-11 | 1990-12-11 | Shrier Karen P | Overvoltage protection device and material |
US5068634A (en) | 1988-01-11 | 1991-11-26 | Electromer Corporation | Overvoltage protection device and material |
US5099380A (en) | 1990-04-19 | 1992-03-24 | Electromer Corporation | Electrical connector with overvoltage protection feature |
US5142263A (en) | 1991-02-13 | 1992-08-25 | Electromer Corporation | Surface mount device with overvoltage protection feature |
US5189387A (en) | 1991-07-11 | 1993-02-23 | Electromer Corporation | Surface mount device with foldback switching overvoltage protection feature |
US5248517A (en) | 1991-11-15 | 1993-09-28 | Electromer Corporation | Paintable/coatable overvoltage protection material and devices made therefrom |
WO1996002924A1 (en) | 1994-07-14 | 1996-02-01 | Surgx Corporation | Single and multi-layer variable voltage protection devices and methods of making same |
WO1997026665A1 (en) | 1996-01-22 | 1997-07-24 | Surgx Corporation | Over-voltage protection device and method for making same |
US6797125B2 (en) | 2001-11-09 | 2004-09-28 | Andritz Oy | Method of treating condensates |
WO2009026299A1 (en) * | 2007-08-20 | 2009-02-26 | Shocking Technologies Inc | Voltage switchable dielectric material incorporating modified high aspect ratio particles |
WO2010039902A2 (en) * | 2008-09-30 | 2010-04-08 | Shocking Technologies, Inc. | Voltage switchable dielectric material containing conductive core shelled particles |
Family Cites Families (252)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3239465A (en) * | 1958-05-12 | 1966-03-08 | Xerox Corp | Xerographic developer |
US3347724A (en) | 1964-08-19 | 1967-10-17 | Photocircuits Corp | Metallizing flexible substrata |
US3685026A (en) | 1970-08-20 | 1972-08-15 | Matsushita Electric Ind Co Ltd | Process of switching an electric current |
US3685028A (en) | 1970-08-20 | 1972-08-15 | Matsushita Electric Ind Co Ltd | Process of memorizing an electric signal |
US3808576A (en) * | 1971-01-15 | 1974-04-30 | Mica Corp | Circuit board with resistance layer |
US3723635A (en) * | 1971-08-16 | 1973-03-27 | Western Electric Co | Double-sided flexible circuit assembly and method of manufacture therefor |
GB1433129A (en) * | 1972-09-01 | 1976-04-22 | Raychem Ltd | Materials having non-linear resistance characteristics |
US4359414A (en) | 1972-12-22 | 1982-11-16 | E. I. Du Pont De Nemours And Company | Insulative composition for forming polymeric electric current regulating junctions |
US3926916A (en) | 1972-12-22 | 1975-12-16 | Du Pont | Dielectric composition capable of electrical activation |
US3977957A (en) | 1973-09-24 | 1976-08-31 | National Plastics And Plating Supply Co. | Apparatus for intermitting electroplating strips |
US4113899A (en) | 1977-05-23 | 1978-09-12 | Wear-Cote International, Inc. | Method of obtaining electroless nickel coated filled epoxy resin article |
US4133735A (en) * | 1977-09-27 | 1979-01-09 | The Board Of Regents Of The University Of Washington | Ion-sensitive electrode and processes for making the same |
JPS5828750B2 (en) | 1979-12-25 | 1983-06-17 | 富士通株式会社 | semiconductor equipment |
US4331948A (en) * | 1980-08-13 | 1982-05-25 | Chomerics, Inc. | High powered over-voltage protection |
DE3040784C2 (en) | 1980-10-29 | 1982-11-18 | Schildkröt Spielwaren GmbH, 8057 Eching | Process for applying a metallic coating and conductive varnish suitable for this purpose |
US4439809A (en) * | 1982-02-22 | 1984-03-27 | Sperry Corporation | Electrostatic discharge protection system |
US4591411A (en) * | 1982-05-05 | 1986-05-27 | Hughes Aircraft Company | Method for forming a high density printed wiring board |
DE3231118C1 (en) * | 1982-08-20 | 1983-11-03 | Siemens AG, 1000 Berlin und 8000 München | Combined circuit arrangement with varistor and method for its production |
US4405432A (en) | 1982-10-22 | 1983-09-20 | National Semiconductor Corporation | Plating head |
JPS6091489A (en) | 1983-10-24 | 1985-05-22 | Nippon Telegr & Teleph Corp <Ntt> | Static electricity resistant ic card |
CH663491A5 (en) | 1984-02-27 | 1987-12-15 | Bbc Brown Boveri & Cie | Electronic circuit module |
US4702860A (en) | 1984-06-15 | 1987-10-27 | Nauchno-Issledovatelsky Institut Kabelnoi Promyshlennosti Po "Sredazkabel" | Current-conducting composition |
BR8601387A (en) * | 1985-03-29 | 1986-12-02 | Raychem Ltd | DEVICE TO PROTECT AN ELECTRIC CIRCUIT, ELECTRIC CIRCUIT, ELECTRIC COMPONENT AND USE OF AN AMORPUS COMPOSITION |
US4888574A (en) | 1985-05-29 | 1989-12-19 | 501 Ohmega Electronics, Inc. | Circuit board material and method of making |
US4642160A (en) * | 1985-08-12 | 1987-02-10 | Interconnect Technology Inc. | Multilayer circuit board manufacturing |
US5917707A (en) | 1993-11-16 | 1999-06-29 | Formfactor, Inc. | Flexible contact structure with an electrically conductive shell |
JPS62137807A (en) | 1985-12-11 | 1987-06-20 | 株式会社村田製作所 | Composite varistor material |
US4799128A (en) * | 1985-12-20 | 1989-01-17 | Ncr Corporation | Multilayer printed circuit board with domain partitioning |
US4726877A (en) * | 1986-01-22 | 1988-02-23 | E. I. Du Pont De Nemours And Company | Methods of using photosensitive compositions containing microgels |
US4726991A (en) * | 1986-07-10 | 1988-02-23 | Eos Technologies Inc. | Electrical overstress protection material and process |
US5039452A (en) | 1986-10-16 | 1991-08-13 | Raychem Corporation | Metal oxide varistors, precursor powder compositions and methods for preparing same |
KR960015106B1 (en) * | 1986-11-25 | 1996-10-28 | 가부시기가이샤 히다찌세이사꾸쇼 | Surface package type semiconductor package |
US5295297B1 (en) * | 1986-11-25 | 1996-11-26 | Hitachi Ltd | Method of producing semiconductor memory |
JPS63195275A (en) | 1987-02-10 | 1988-08-12 | Canon Inc | Production of precision forming die |
JPS63196672A (en) | 1987-02-11 | 1988-08-15 | Asahi Chem Res Lab Ltd | Carbon paste composition |
US5138438A (en) * | 1987-06-24 | 1992-08-11 | Akita Electronics Co. Ltd. | Lead connections means for stacked tab packaged IC chips |
US4892776A (en) * | 1987-09-02 | 1990-01-09 | Ohmega Electronics, Inc. | Circuit board material and electroplating bath for the production thereof |
US5734188A (en) * | 1987-09-19 | 1998-03-31 | Hitachi, Ltd. | Semiconductor integrated circuit, method of fabricating the same and apparatus for fabricating the same |
EP0322466A1 (en) * | 1987-12-24 | 1989-07-05 | Ibm Deutschland Gmbh | PECVD (plasma enhanced chemical vapor deposition) method for deposition of tungsten or layers containing tungsten by in situ formation of tungsten fluorides |
US4935584A (en) | 1988-05-24 | 1990-06-19 | Tektronix, Inc. | Method of fabricating a printed circuit board and the PCB produced |
US5502889A (en) * | 1988-06-10 | 1996-04-02 | Sheldahl, Inc. | Method for electrically and mechanically connecting at least two conductive layers |
US4992333A (en) * | 1988-11-18 | 1991-02-12 | G&H Technology, Inc. | Electrical overstress pulse protection |
AU631595B2 (en) | 1988-12-24 | 1992-12-03 | Technology Applications Company Limited | Improved method for making printed circuits |
EP0379176B1 (en) * | 1989-01-19 | 1995-03-15 | Burndy Corporation | Card edge connector |
US5220316A (en) | 1989-07-03 | 1993-06-15 | Benjamin Kazan | Nonlinear resistor control circuit and use in liquid crystal displays |
US5126915A (en) * | 1989-07-28 | 1992-06-30 | E. I. Du Pont De Nemours And Company | Metal oxide-coated electrically conductive powders and compositions thereof |
US5300208A (en) * | 1989-08-14 | 1994-04-05 | International Business Machines Corporation | Fabrication of printed circuit boards using conducting polymer |
JPH045844A (en) | 1990-04-23 | 1992-01-09 | Nippon Mektron Ltd | Multilayer circuit board for mounting ic and manufacture thereof |
US4996945A (en) * | 1990-05-04 | 1991-03-05 | Invisible Fence Company, Inc. | Electronic animal control system with lightning arrester |
JPH0636472B2 (en) * | 1990-05-28 | 1994-05-11 | インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン | Method for manufacturing multilayer wiring board |
US5260848A (en) | 1990-07-27 | 1993-11-09 | Electromer Corporation | Foldback switching material and devices |
US5252195A (en) | 1990-08-20 | 1993-10-12 | Mitsubishi Rayon Company Ltd. | Process for producing a printed wiring board |
US5679977A (en) | 1990-09-24 | 1997-10-21 | Tessera, Inc. | Semiconductor chip assemblies, methods of making same and components for same |
EP0481703B1 (en) | 1990-10-15 | 2003-09-17 | Aptix Corporation | Interconnect substrate having integrated circuit for programmable interconnection and sample testing |
US5183698A (en) * | 1991-03-07 | 1993-02-02 | G & H Technology, Inc. | Electrical overstress pulse protection |
US5557136A (en) | 1991-04-26 | 1996-09-17 | Quicklogic Corporation | Programmable interconnect structures and programmable integrated circuits |
AT398877B (en) * | 1991-10-31 | 1995-02-27 | Philips Nv | TWO OR MULTILAYERED CIRCUIT BOARD, METHOD FOR PRODUCING SUCH A CIRCUIT BOARD AND LAMINATE FOR PRODUCING SUCH A CIRCUIT BOARD BY SUCH A PROCESS |
US5367764A (en) | 1991-12-31 | 1994-11-29 | Tessera, Inc. | Method of making a multi-layer circuit assembly |
US5282312A (en) * | 1991-12-31 | 1994-02-01 | Tessera, Inc. | Multi-layer circuit construction methods with customization features |
US5260108A (en) | 1992-03-10 | 1993-11-09 | International Business Machines Corporation | Selective seeding of Pd by excimer laser radiation through the liquid |
US5294374A (en) * | 1992-03-20 | 1994-03-15 | Leviton Manufacturing Co., Inc. | Electrical overstress materials and method of manufacture |
EP0568313A2 (en) * | 1992-05-01 | 1993-11-03 | Nippon CMK Corp. | A method of manufacturing a multilayer printed wiring board |
JP2601128B2 (en) * | 1992-05-06 | 1997-04-16 | 松下電器産業株式会社 | Method of manufacturing circuit forming substrate and circuit forming substrate |
JP2921722B2 (en) * | 1992-06-10 | 1999-07-19 | 三菱マテリアル株式会社 | Chip type surge absorber |
US5246388A (en) | 1992-06-30 | 1993-09-21 | Amp Incorporated | Electrical over stress device and connector |
US5278535A (en) * | 1992-08-11 | 1994-01-11 | G&H Technology, Inc. | Electrical overstress pulse protection |
JP3057924B2 (en) | 1992-09-22 | 2000-07-04 | 松下電器産業株式会社 | Double-sided printed circuit board and method of manufacturing the same |
US5393597A (en) * | 1992-09-23 | 1995-02-28 | The Whitaker Corporation | Overvoltage protection element |
EP0589560B1 (en) * | 1992-09-23 | 1997-10-22 | The Whitaker Corporation | Electrical overstress protection apparatus |
US5262754A (en) | 1992-09-23 | 1993-11-16 | Electromer Corporation | Overvoltage protection element |
JP2773578B2 (en) * | 1992-10-02 | 1998-07-09 | 日本電気株式会社 | Method for manufacturing semiconductor device |
CA2082771C (en) | 1992-11-12 | 1998-02-10 | Vu Quoc Ho | Method for forming interconnect structures for integrated circuits |
US5340641A (en) | 1993-02-01 | 1994-08-23 | Antai Xu | Electrical overstress pulse protection |
US5418689A (en) | 1993-02-01 | 1995-05-23 | International Business Machines Corporation | Printed circuit board or card for direct chip attachment and fabrication thereof |
US5347258A (en) | 1993-04-07 | 1994-09-13 | Zycon Corporation | Annular resistor coupled with printed circuit board through-hole |
JP3256603B2 (en) | 1993-07-05 | 2002-02-12 | 株式会社東芝 | Semiconductor device and manufacturing method thereof |
US5413694A (en) * | 1993-07-30 | 1995-05-09 | The United States Of America As Represented By The Secretary Of The Navy | Method for improving electromagnetic shielding performance of composite materials by electroplating |
IL106738A (en) | 1993-08-19 | 1998-02-08 | Mind E M S G Ltd | Device for external correction of deficient valves in venous junctions |
US5736681A (en) * | 1993-09-03 | 1998-04-07 | Kabushiki Kaisha Toshiba | Printed wiring board having an interconnection penetrating an insulating layer |
US5444593A (en) | 1993-09-30 | 1995-08-22 | Allina; Edward F. | Thick-film varistors for TVSS |
JP3361903B2 (en) * | 1994-01-06 | 2003-01-07 | 凸版印刷株式会社 | Manufacturing method of printed wiring board |
US5808351A (en) | 1994-02-08 | 1998-09-15 | Prolinx Labs Corporation | Programmable/reprogramable structure using fuses and antifuses |
US5834824A (en) | 1994-02-08 | 1998-11-10 | Prolinx Labs Corporation | Use of conductive particles in a nonconductive body as an integrated circuit antifuse |
US5510629A (en) * | 1994-05-27 | 1996-04-23 | Crosspoint Solutions, Inc. | Multilayer antifuse with intermediate spacer layer |
US6191928B1 (en) * | 1994-05-27 | 2001-02-20 | Littelfuse, Inc. | Surface-mountable device for protection against electrostatic damage to electronic components |
US5552757A (en) * | 1994-05-27 | 1996-09-03 | Littelfuse, Inc. | Surface-mounted fuse device |
US5493146A (en) | 1994-07-14 | 1996-02-20 | Vlsi Technology, Inc. | Anti-fuse structure for reducing contamination of the anti-fuse material |
BR9508404A (en) | 1994-07-14 | 1997-11-25 | Surgx Corp | Variable voltage protection component and production process |
US5802714A (en) | 1994-07-19 | 1998-09-08 | Hitachi, Ltd. | Method of finishing a printed wiring board with a soft etching solution and a preserving treatment or a solder-leveling treatment |
US5487218A (en) * | 1994-11-21 | 1996-01-30 | International Business Machines Corporation | Method for making printed circuit boards with selectivity filled plated through holes |
US5962815A (en) | 1995-01-18 | 1999-10-05 | Prolinx Labs Corporation | Antifuse interconnect between two conducting layers of a printed circuit board |
US5770113A (en) | 1995-03-06 | 1998-06-23 | Matsushita Electric Industrial Co., Ltd. | Zinc oxide ceramics and method for producing the same |
US5714794A (en) * | 1995-04-18 | 1998-02-03 | Hitachi Chemical Company, Ltd. | Electrostatic protective device |
US5906042A (en) * | 1995-10-04 | 1999-05-25 | Prolinx Labs Corporation | Method and structure to interconnect traces of two conductive layers in a printed circuit board |
JPH09111135A (en) * | 1995-10-23 | 1997-04-28 | Mitsubishi Materials Corp | Conductive polymer composition |
US5834160A (en) | 1996-01-16 | 1998-11-10 | Lucent Technologies Inc. | Method and apparatus for forming fine patterns on printed circuit board |
US5940683A (en) | 1996-01-18 | 1999-08-17 | Motorola, Inc. | LED display packaging with substrate removal and method of fabrication |
US6172590B1 (en) * | 1996-01-22 | 2001-01-09 | Surgx Corporation | Over-voltage protection device and method for making same |
US5869869A (en) | 1996-01-31 | 1999-02-09 | Lsi Logic Corporation | Microelectronic device with thin film electrostatic discharge protection structure |
US5933307A (en) | 1996-02-16 | 1999-08-03 | Thomson Consumer Electronics, Inc. | Printed circuit board sparkgap |
US6455916B1 (en) | 1996-04-08 | 2002-09-24 | Micron Technology, Inc. | Integrated circuit devices containing isolated dielectric material |
US5744759A (en) * | 1996-05-29 | 1998-04-28 | International Business Machines Corporation | Circuit boards that can accept a pluggable tab module that can be attached or removed without solder |
US5874902A (en) * | 1996-07-29 | 1999-02-23 | International Business Machines Corporation | Radio frequency identification transponder with electronic circuit enabling/disabling capability |
US5956612A (en) | 1996-08-09 | 1999-09-21 | Micron Technology, Inc. | Trench/hole fill processes for semiconductor fabrication |
US5905000A (en) | 1996-09-03 | 1999-05-18 | Nanomaterials Research Corporation | Nanostructured ion conducting solid electrolytes |
US6933331B2 (en) | 1998-05-22 | 2005-08-23 | Nanoproducts Corporation | Nanotechnology for drug delivery, contrast agents and biomedical implants |
US5977489A (en) | 1996-10-28 | 1999-11-02 | Thomas & Betts International, Inc. | Conductive elastomer for grafting to a metal substrate |
US5856910A (en) * | 1996-10-30 | 1999-01-05 | Intel Corporation | Processor card assembly having a cover with flexible locking latches |
US5946555A (en) | 1996-11-04 | 1999-08-31 | Packard Hughes Interconnect Company | Wafer level decal for minimal packaging of chips |
ATE355645T1 (en) | 1996-11-19 | 2006-03-15 | Surgx Corp | PROTECTIVE DEVICE AGAINST TRANSIENT VOLTAGE AND METHOD FOR PRODUCING THE SAME |
US6013358A (en) | 1997-11-18 | 2000-01-11 | Cooper Industries, Inc. | Transient voltage protection device with ceramic substrate |
US5834893A (en) | 1996-12-23 | 1998-11-10 | The Trustees Of Princeton University | High efficiency organic light emitting devices with light directing structures |
US20020061363A1 (en) | 2000-09-27 | 2002-05-23 | Halas Nancy J. | Method of making nanoshells |
US5972192A (en) | 1997-07-23 | 1999-10-26 | Advanced Micro Devices, Inc. | Pulse electroplating copper or copper alloys |
JP2996215B2 (en) | 1997-08-20 | 1999-12-27 | サンケン電気株式会社 | Semiconductor device |
US6037879A (en) | 1997-10-02 | 2000-03-14 | Micron Technology, Inc. | Wireless identification device, RFID device, and method of manufacturing wireless identification device |
JP3257521B2 (en) | 1997-10-07 | 2002-02-18 | ソニーケミカル株式会社 | PTC element, protection device and circuit board |
US6251513B1 (en) | 1997-11-08 | 2001-06-26 | Littlefuse, Inc. | Polymer composites for overvoltage protection |
US6468593B1 (en) | 1997-11-27 | 2002-10-22 | Kanto Kasei Co., Ltd. | Plated non-conductive products and plating method for the same |
TW511103B (en) | 1998-01-16 | 2002-11-21 | Littelfuse Inc | Polymer composite materials for electrostatic discharge protection |
US6064094A (en) * | 1998-03-10 | 2000-05-16 | Oryx Technology Corporation | Over-voltage protection system for integrated circuits using the bonding pads and passivation layer |
US6130459A (en) | 1998-03-10 | 2000-10-10 | Oryx Technology Corporation | Over-voltage protection device for integrated circuits |
GB9806066D0 (en) * | 1998-03-20 | 1998-05-20 | Cambridge Display Tech Ltd | Multilayer photovoltaic or photoconductive devices |
JP2000059986A (en) * | 1998-04-08 | 2000-02-25 | Canon Inc | Solar cell module and method and device of failure detection therefor |
JPH11345292A (en) | 1998-06-02 | 1999-12-14 | Matsushita Electric Ind Co Ltd | Non-contact ic card |
JP2000067646A (en) | 1998-06-12 | 2000-03-03 | Matsushita Electric Ind Co Ltd | Conductive paste |
JP2942829B1 (en) | 1998-08-17 | 1999-08-30 | 熊本大学長 | Method of forming metal oxide film by photoelectroless oxidation method |
US6549114B2 (en) * | 1998-08-20 | 2003-04-15 | Littelfuse, Inc. | Protection of electrical devices with voltage variable materials |
US6162159A (en) | 1998-08-24 | 2000-12-19 | Martini; Calvin Duke | Ticket dispenser |
US6108184A (en) | 1998-11-13 | 2000-08-22 | Littlefuse, Inc. | Surface mountable electrical device comprising a voltage variable material |
US6713955B1 (en) | 1998-11-20 | 2004-03-30 | Agilent Technologies, Inc. | Organic light emitting device having a current self-limiting structure |
US6351011B1 (en) * | 1998-12-08 | 2002-02-26 | Littlefuse, Inc. | Protection of an integrated circuit with voltage variable materials |
US6211554B1 (en) * | 1998-12-08 | 2001-04-03 | Littelfuse, Inc. | Protection of an integrated circuit with voltage variable materials |
US6250984B1 (en) | 1999-01-25 | 2001-06-26 | Agere Systems Guardian Corp. | Article comprising enhanced nanotube emitter structure and process for fabricating article |
US6198392B1 (en) * | 1999-02-10 | 2001-03-06 | Micron Technology, Inc. | Communications system and method with A/D converter |
US6534422B1 (en) * | 1999-06-10 | 2003-03-18 | National Semiconductor Corporation | Integrated ESD protection method and system |
US20120195018A1 (en) | 2005-11-22 | 2012-08-02 | Lex Kosowsky | Wireless communication device using voltage switchable dielectric material |
US7695644B2 (en) * | 1999-08-27 | 2010-04-13 | Shocking Technologies, Inc. | Device applications for voltage switchable dielectric material having high aspect ratio particles |
US7446030B2 (en) | 1999-08-27 | 2008-11-04 | Shocking Technologies, Inc. | Methods for fabricating current-carrying structures using voltage switchable dielectric materials |
US20080035370A1 (en) * | 1999-08-27 | 2008-02-14 | Lex Kosowsky | Device applications for voltage switchable dielectric material having conductive or semi-conductive organic material |
US7825491B2 (en) | 2005-11-22 | 2010-11-02 | Shocking Technologies, Inc. | Light-emitting device using voltage switchable dielectric material |
AU6531600A (en) * | 1999-08-27 | 2001-03-26 | Lex Kosowsky | Current carrying structure using voltage switchable dielectric material |
WO2001018864A1 (en) * | 1999-09-03 | 2001-03-15 | Seiko Epson Corporation | Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
US6448900B1 (en) | 1999-10-14 | 2002-09-10 | Jong Chen | Easy-to-assembly LED display for any graphics and text |
US6316734B1 (en) | 2000-03-07 | 2001-11-13 | 3M Innovative Properties Company | Flexible circuits with static discharge protection and process for manufacture |
US6509581B1 (en) | 2000-03-29 | 2003-01-21 | Delta Optoelectronics, Inc. | Structure and fabrication process for an improved polymer light emitting diode |
US6407411B1 (en) | 2000-04-13 | 2002-06-18 | General Electric Company | Led lead frame assembly |
US6373719B1 (en) | 2000-04-13 | 2002-04-16 | Surgx Corporation | Over-voltage protection for electronic circuits |
US6486196B2 (en) * | 2000-05-05 | 2002-11-26 | Dr. Reddy's Research Foundation | Anticancer compounds: process for their preparation and pharmaceutical compositions containing them |
JP4066620B2 (en) | 2000-07-21 | 2008-03-26 | 日亜化学工業株式会社 | LIGHT EMITTING ELEMENT, DISPLAY DEVICE HAVING LIGHT EMITTING ELEMENT AND METHOD FOR MANUFACTURING DISPLAY DEVICE |
US6628498B2 (en) | 2000-08-28 | 2003-09-30 | Steven J. Whitney | Integrated electrostatic discharge and overcurrent device |
US6903175B2 (en) | 2001-03-26 | 2005-06-07 | Shipley Company, L.L.C. | Polymer synthesis and films therefrom |
TW554388B (en) * | 2001-03-30 | 2003-09-21 | Univ California | Methods of fabricating nanostructures and nanowires and devices fabricated therefrom |
US6690251B2 (en) | 2001-04-11 | 2004-02-10 | Kyocera Wireless Corporation | Tunable ferro-electric filter |
JP2002353003A (en) | 2001-05-29 | 2002-12-06 | Nec Tokin Corp | High polymer ptc element and manufacturing method therfor |
TW492202B (en) | 2001-06-05 | 2002-06-21 | South Epitaxy Corp | Structure of III-V light emitting diode (LED) arranged in flip chip configuration having structure for preventing electrostatic discharge |
US6762237B2 (en) * | 2001-06-08 | 2004-07-13 | Eikos, Inc. | Nanocomposite dielectrics |
US7276844B2 (en) | 2001-06-15 | 2007-10-02 | E. I. Du Pont De Nemours And Company | Process for improving the emission of electron field emitters |
SE523309E (en) | 2001-06-15 | 2009-10-26 | Replisaurus Technologies Ab | Method, electrode and apparatus for creating micro- and nanostructures in conductive materials by patterning with master electrode and electrolyte |
ATE499691T1 (en) * | 2001-07-02 | 2011-03-15 | Abb Schweiz Ag | POLYMER COMPOUND WITH NON-LINEAR CURRENT-VOLTAGE CHARACTERISTICS AND METHOD FOR PRODUCING A POLYMER COMPOUND |
US7034652B2 (en) * | 2001-07-10 | 2006-04-25 | Littlefuse, Inc. | Electrostatic discharge multifunction resistor |
US20030066998A1 (en) * | 2001-08-02 | 2003-04-10 | Lee Howard Wing Hoon | Quantum dots of Group IV semiconductor materials |
US6525953B1 (en) * | 2001-08-13 | 2003-02-25 | Matrix Semiconductor, Inc. | Vertically-stacked, field-programmable, nonvolatile memory and method of fabrication |
TW557237B (en) | 2001-09-14 | 2003-10-11 | Sekisui Chemical Co Ltd | Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure |
US20030078332A1 (en) * | 2001-10-19 | 2003-04-24 | Dardi Peter S. | Conductive polymer-particle blends |
JP2003163104A (en) | 2001-11-28 | 2003-06-06 | Mitsubishi Electric Corp | Organic ptc composition |
US6936968B2 (en) * | 2001-11-30 | 2005-08-30 | Mule Lighting, Inc. | Retrofit light emitting diode tube |
GB0200259D0 (en) | 2002-01-07 | 2002-02-20 | Univ Reading The | Encapsulated radioactive nuclide microparticles and methods for their production |
US20070208243A1 (en) | 2002-01-16 | 2007-09-06 | Nanomix, Inc. | Nanoelectronic glucose sensors |
TWI229115B (en) | 2002-02-11 | 2005-03-11 | Sipix Imaging Inc | Core-shell particles for electrophoretic display |
JP3857156B2 (en) | 2002-02-22 | 2006-12-13 | 株式会社日立製作所 | Electron source paste, electron source, and self-luminous panel type display device using the electron source |
JP2003346108A (en) | 2002-03-20 | 2003-12-05 | Oji Paper Co Ltd | Non-contact ic card |
JP3902969B2 (en) | 2002-03-27 | 2007-04-11 | トッパン・フォームズ株式会社 | RF-ID media |
WO2003088356A1 (en) * | 2002-04-08 | 2003-10-23 | Littelfuse, Inc. | Voltage variable material for direct application and devices employing same |
US7183891B2 (en) | 2002-04-08 | 2007-02-27 | Littelfuse, Inc. | Direct application voltage variable material, devices employing same and methods of manufacturing such devices |
US7132922B2 (en) | 2002-04-08 | 2006-11-07 | Littelfuse, Inc. | Direct application voltage variable material, components thereof and devices employing same |
DE10223957B4 (en) | 2002-05-31 | 2006-12-21 | Advanced Micro Devices, Inc., Sunnyvale | An improved method of electroplating copper on a patterned dielectric layer |
JP2004014466A (en) | 2002-06-11 | 2004-01-15 | Mitsubishi Materials Corp | Chip type surge absorber and its manufacturing method |
US7031132B1 (en) * | 2002-06-14 | 2006-04-18 | Mitchell Dennis A | Short circuit diagnostic tool |
TWI299559B (en) | 2002-06-19 | 2008-08-01 | Inpaq Technology Co Ltd | Ic substrate with over voltage protection function and method for manufacturing the same |
KR100497121B1 (en) | 2002-07-18 | 2005-06-28 | 삼성전기주식회사 | Semiconductor LED Device |
US7247980B2 (en) | 2002-08-04 | 2007-07-24 | Iljin Idamond Co., Ltd | Emitter composition using diamond, method of manufacturing the same and field emission cell using the same |
EP2399970A3 (en) | 2002-09-05 | 2012-04-18 | Nanosys, Inc. | Nanocomposites |
JP3625467B2 (en) * | 2002-09-26 | 2005-03-02 | キヤノン株式会社 | Electron emitting device using carbon fiber, electron source, and method of manufacturing image forming apparatus |
US6709944B1 (en) | 2002-09-30 | 2004-03-23 | General Electric Company | Techniques for fabricating a resistor on a flexible base material |
WO2004059663A1 (en) * | 2002-12-26 | 2004-07-15 | Showa Denko K. K. | Carbonaceous material for forming electrically conductive material and use thereof |
US7132697B2 (en) | 2003-02-06 | 2006-11-07 | Weimer Alan W | Nanomaterials for quantum tunneling varistors |
US6981319B2 (en) * | 2003-02-13 | 2006-01-03 | Shrier Karen P | Method of manufacturing devices to protect election components |
US20050208304A1 (en) | 2003-02-21 | 2005-09-22 | California Institute Of Technology | Coatings for carbon nanotubes |
US20040211942A1 (en) | 2003-04-28 | 2004-10-28 | Clark Darren Cameron | Electrically conductive compositions and method of manufacture thereof |
KR100776912B1 (en) | 2003-06-25 | 2007-11-15 | 주식회사 엘지화학 | Anode material for lithium secondary cell with high capacity |
DE102004049053A1 (en) | 2003-10-11 | 2005-05-04 | Conti Temic Microelectronic | Printed circuit board (PCB) with spark path for overvoltage protection between two electrically conductive regions on PCB, especially caused by electrostatic discharge (ESD), for electronic modules |
US7141184B2 (en) | 2003-12-08 | 2006-11-28 | Cts Corporation | Polymer conductive composition containing zirconia for films and coatings with high wear resistance |
US7557154B2 (en) | 2004-12-23 | 2009-07-07 | Sabic Innovative Plastics Ip B.V. | Polymer compositions, method of manufacture, and articles formed therefrom |
US7205613B2 (en) * | 2004-01-07 | 2007-04-17 | Silicon Pipe | Insulating substrate for IC packages having integral ESD protection |
US7274910B2 (en) | 2004-02-09 | 2007-09-25 | Battelle Memorial Institute K1-53 | Advanced capability RFID system |
JP4273986B2 (en) | 2004-02-10 | 2009-06-03 | ソニー株式会社 | Plastic card manufacturing method and plastic card |
US7279724B2 (en) | 2004-02-25 | 2007-10-09 | Philips Lumileds Lighting Company, Llc | Ceramic substrate for a light emitting diode where the substrate incorporates ESD protection |
EP1585146B1 (en) | 2004-04-06 | 2008-08-06 | Abb Research Ltd. | Nonlinear electrical material for high and medium voltage applications |
KR100628943B1 (en) | 2004-04-16 | 2006-09-27 | 학교법인 포항공과대학교 | Core-shell type nano-particle, and method for preparing the same |
KR100631521B1 (en) | 2004-04-17 | 2006-10-11 | 엘지전자 주식회사 | Light emitting device and manufacturing method thereof |
US7064353B2 (en) | 2004-05-26 | 2006-06-20 | Philips Lumileds Lighting Company, Llc | LED chip with integrated fast switching diode for ESD protection |
US20050274455A1 (en) | 2004-06-09 | 2005-12-15 | Extrand Charles W | Electro-active adhesive systems |
US7002217B2 (en) | 2004-06-12 | 2006-02-21 | Solectron Corporation | Electrostatic discharge mitigation structure and methods thereof using a dissipative capacitor with voltage dependent resistive material |
US20060293434A1 (en) | 2004-07-07 | 2006-12-28 | The Trustees Of The University Of Pennsylvania | Single wall nanotube composites |
WO2007005038A1 (en) | 2004-08-31 | 2007-01-11 | University Of Florida Research Foundation, Inc. | Photocatalytic nanocomposites and applications thereof |
KR100576872B1 (en) * | 2004-09-17 | 2006-05-10 | 삼성전기주식회사 | Nitride semiconductor light emitting diode with esd protection capacity |
US7218492B2 (en) | 2004-09-17 | 2007-05-15 | Electronic Polymers, Inc. | Devices and systems for electrostatic discharge suppression |
US7345307B2 (en) | 2004-10-12 | 2008-03-18 | Nanosys, Inc. | Fully integrated organic layered processes for making plastic electronics based on conductive polymers and semiconductor nanowires |
EP1807919A4 (en) | 2004-11-02 | 2011-05-04 | Nantero Inc | Nanotube esd protective devices and corresponding nonvolatile and volatile nanotube switches |
US20060152334A1 (en) | 2005-01-10 | 2006-07-13 | Nathaniel Maercklein | Electrostatic discharge protection for embedded components |
US7368045B2 (en) | 2005-01-27 | 2008-05-06 | International Business Machines Corporation | Gate stack engineering by electrochemical processing utilizing through-gate-dielectric current flow |
US7579397B2 (en) | 2005-01-27 | 2009-08-25 | Rensselaer Polytechnic Institute | Nanostructured dielectric composite materials |
WO2007050114A2 (en) * | 2005-02-16 | 2007-05-03 | Sanmina-Sci Corporation | A substantially continuous layer of embedded transient protection for printed circuit boards |
TWI389205B (en) | 2005-03-04 | 2013-03-11 | Sanmina Sci Corp | Partitioning a via structure using plating resist |
KR100775100B1 (en) | 2005-03-16 | 2007-11-08 | 주식회사 엘지화학 | Coating composition for dielectric insulating film, dielectric film prepared therefrom, and electric or electronic device comprising the same |
US7626198B2 (en) | 2005-03-22 | 2009-12-01 | Semiconductor Energy Laboratory Co., Ltd. | Nonlinear element, element substrate including the nonlinear element, and display device |
US7505239B2 (en) * | 2005-04-14 | 2009-03-17 | Tdk Corporation | Light emitting device |
US7535462B2 (en) | 2005-06-02 | 2009-05-19 | Eastman Kodak Company | Touchscreen with one carbon nanotube conductive layer |
KR100668977B1 (en) | 2005-06-27 | 2007-01-16 | 삼성전자주식회사 | Element for protecting from surge voltage |
US7923844B2 (en) | 2005-11-22 | 2011-04-12 | Shocking Technologies, Inc. | Semiconductor devices including voltage switchable materials for over-voltage protection |
US20100264224A1 (en) | 2005-11-22 | 2010-10-21 | Lex Kosowsky | Wireless communication device using voltage switchable dielectric material |
CN101578710B (en) | 2005-11-22 | 2013-05-22 | 肖克科技有限公司 | A light-emitting device using voltage switchable dielectric material |
US20070116976A1 (en) | 2005-11-23 | 2007-05-24 | Qi Tan | Nanoparticle enhanced thermoplastic dielectrics, methods of manufacture thereof, and articles comprising the same |
US7435780B2 (en) | 2005-11-29 | 2008-10-14 | Sabic Innovavtive Plastics Ip B.V. | Poly(arylene ether) compositions and methods of making the same |
US20080299298A1 (en) * | 2005-12-06 | 2008-12-04 | Electronics And Telecommunications Research Institute | Methods of Manufacturing Carbon Nanotube (Cnt) Paste and Emitter with High Reliability |
US7492504B2 (en) | 2006-05-19 | 2009-02-17 | Xerox Corporation | Electrophoretic display medium and device |
US20080032049A1 (en) * | 2006-07-29 | 2008-02-07 | Lex Kosowsky | Voltage switchable dielectric material having high aspect ratio particles |
EP2418657A3 (en) | 2006-07-29 | 2013-05-01 | Shocking Technologies, Inc. | Voltage Switchable dielectric material having high aspect ratio particles |
US20080029405A1 (en) * | 2006-07-29 | 2008-02-07 | Lex Kosowsky | Voltage switchable dielectric material having conductive or semi-conductive organic material |
US7981325B2 (en) | 2006-07-29 | 2011-07-19 | Shocking Technologies, Inc. | Electronic device for voltage switchable dielectric material having high aspect ratio particles |
CN101523510B (en) * | 2006-08-04 | 2012-06-27 | 株式会社I.S.T. | Conductive paste, and conductive coating film and conductive film using the same |
US20080047930A1 (en) | 2006-08-23 | 2008-02-28 | Graciela Beatriz Blanchet | Method to form a pattern of functional material on a substrate |
JP4920342B2 (en) * | 2006-08-24 | 2012-04-18 | 浜松ホトニクス株式会社 | Method for manufacturing silicon element |
WO2008036984A2 (en) | 2006-09-24 | 2008-03-27 | Shocking Technologies Inc | Technique for plating substrate devices using voltage switchable dielectric material and light assistance |
WO2008036423A2 (en) * | 2006-09-24 | 2008-03-27 | Shocking Technologies, Inc. | Formulations for voltage switchable dielectric material having a stepped voltage response and methods for making the same |
DE102006047377A1 (en) | 2006-10-06 | 2008-04-10 | Robert Bosch Gmbh | Electrostatic discharge protection for electrical or electronic devices involves providing voltage protection drain that includes material accumulation that is directly or indirectly placed in contact with electrical connection |
US20120119168A9 (en) | 2006-11-21 | 2012-05-17 | Robert Fleming | Voltage switchable dielectric materials with low band gap polymer binder or composite |
EP1990834B1 (en) | 2007-05-10 | 2012-08-15 | Texas Instruments France | Local integration of non-linear sheet in integrated circuit packages for ESD/EOS protection |
US8206674B2 (en) | 2007-05-15 | 2012-06-26 | National Institute Of Aerospace Associates | Boron nitride nanotubes |
US7793236B2 (en) | 2007-06-13 | 2010-09-07 | Shocking Technologies, Inc. | System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices |
WO2009031663A1 (en) * | 2007-09-07 | 2009-03-12 | Sekisui Chemical Co., Ltd. | Binder resin, vehicle composition, and paste composition having inorganic microparticle dispersed therein |
DE102007044302A1 (en) * | 2007-09-17 | 2009-03-19 | Bühler PARTEC GmbH | Process for dispersing finely divided inorganic powders in liquid media using reactive siloxanes |
KR20090047328A (en) * | 2007-11-07 | 2009-05-12 | 삼성전기주식회사 | Conductive paste and printed circuit board using the same |
US8206614B2 (en) | 2008-01-18 | 2012-06-26 | Shocking Technologies, Inc. | Voltage switchable dielectric material having bonded particle constituents |
US20090220771A1 (en) | 2008-02-12 | 2009-09-03 | Robert Fleming | Voltage switchable dielectric material with superior physical properties for structural applications |
US8203421B2 (en) | 2008-04-14 | 2012-06-19 | Shocking Technologies, Inc. | Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration |
CN101261892A (en) | 2008-04-30 | 2008-09-10 | 杭州电子科技大学 | Low-voltage film pressure sensitive resistor based on ZnO |
US20100047535A1 (en) * | 2008-08-22 | 2010-02-25 | Lex Kosowsky | Core layer structure having voltage switchable dielectric material |
KR101679099B1 (en) | 2009-03-26 | 2016-11-23 | 쇼킹 테크놀로지스 인코포레이티드 | Components having voltage switchable dielectric materials |
US9053844B2 (en) * | 2009-09-09 | 2015-06-09 | Littelfuse, Inc. | Geometric configuration or alignment of protective material in a gap structure for electrical devices |
US20110132645A1 (en) | 2009-12-04 | 2011-06-09 | Ning Shi | Granular varistor and applications for use thereof |
-
2009
- 2009-12-15 US US12/638,360 patent/US9208931B2/en active Active
-
2010
- 2010-12-15 CN CN2010800639458A patent/CN102870166A/en active Pending
- 2010-12-15 KR KR1020127018154A patent/KR20120104333A/en not_active Application Discontinuation
- 2010-12-15 WO PCT/US2010/060617 patent/WO2012030363A1/en active Application Filing
- 2010-12-15 SG SG2012044798A patent/SG181777A1/en unknown
- 2010-12-15 EP EP10807764A patent/EP2513912A1/en active Pending
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4977357A (en) | 1988-01-11 | 1990-12-11 | Shrier Karen P | Overvoltage protection device and material |
US5068634A (en) | 1988-01-11 | 1991-11-26 | Electromer Corporation | Overvoltage protection device and material |
US5099380A (en) | 1990-04-19 | 1992-03-24 | Electromer Corporation | Electrical connector with overvoltage protection feature |
US5142263A (en) | 1991-02-13 | 1992-08-25 | Electromer Corporation | Surface mount device with overvoltage protection feature |
US5189387A (en) | 1991-07-11 | 1993-02-23 | Electromer Corporation | Surface mount device with foldback switching overvoltage protection feature |
US5248517A (en) | 1991-11-15 | 1993-09-28 | Electromer Corporation | Paintable/coatable overvoltage protection material and devices made therefrom |
WO1996002924A1 (en) | 1994-07-14 | 1996-02-01 | Surgx Corporation | Single and multi-layer variable voltage protection devices and methods of making same |
US5807509A (en) | 1994-07-14 | 1998-09-15 | Surgx Corporation | Single and multi layer variable voltage protection devices and method of making same |
WO1997026665A1 (en) | 1996-01-22 | 1997-07-24 | Surgx Corporation | Over-voltage protection device and method for making same |
US6797125B2 (en) | 2001-11-09 | 2004-09-28 | Andritz Oy | Method of treating condensates |
WO2009026299A1 (en) * | 2007-08-20 | 2009-02-26 | Shocking Technologies Inc | Voltage switchable dielectric material incorporating modified high aspect ratio particles |
WO2010039902A2 (en) * | 2008-09-30 | 2010-04-08 | Shocking Technologies, Inc. | Voltage switchable dielectric material containing conductive core shelled particles |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3817008A1 (en) * | 2019-11-01 | 2021-05-05 | Hamilton Sundstrand Corporation | Field grading members, cables having field grading members, and methods of making field grading members |
US11417442B2 (en) | 2019-11-01 | 2022-08-16 | Hamilton Sundstrand Corporation | Field grading members, cables having field grading members, and methods of making field grading members |
Also Published As
Publication number | Publication date |
---|---|
SG181777A1 (en) | 2012-07-30 |
KR20120104333A (en) | 2012-09-20 |
CN102870166A (en) | 2013-01-09 |
US9208931B2 (en) | 2015-12-08 |
EP2513912A1 (en) | 2012-10-24 |
US20100090176A1 (en) | 2010-04-15 |
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