WO2012031708A2

WO2012031708A2 - Antenna component and method for producing an antenna component

Info

Publication number: WO2012031708A2
Application number: PCT/EP2011/004349
Authority: WO
Inventors: Ulrich Schindler
Original assignee: Leonhard Kurz Stiftung & Co. Kg
Priority date: 2010-09-07
Filing date: 2011-08-30
Publication date: 2012-03-15
Also published as: WO2012031708A3; DE102010044598B3

Abstract

The application relates to an antenna component (1) and a method for producing an antenna component (1) comprising a three-dimensional antenna. The method comprises the following steps: forming a first electrically conductive layer (12) on a first thermoplastic carrier film, said layer being shaped in the form of a first antenna structure, inserting a first film body thus formed and comprising the first thermoplastic carrier film and the first electrically conductive layer (12) shaped in the form of the first antenna structure into a first thermoforming mould and thermo forming the first film body in accordance with the contours of the first thermoforming mould using heat and a vacuum, inserting the first film body (10') deformed in this way into an injection mould and insert moulding of the deformed first film body (10') with an injection-moulding material for forming a carrier element.

Description

Antenna component and method for producing an antenna component.

The invention relates to a method for producing an antenna component having at least one three-dimensional antenna and to an antenna component having at least one three-dimensional antenna, in particular for cards or for portable electrical or electronic devices.

From US Pat. No. 5,528,222 it is known, for example, to produce antennas for RFID receivers (RFID = Radio Frequency Identification), such that a flat antenna in the form of a structured antenna is applied to a substrate

Metal layer is applied with a layer thickness between 25 and 35 pm. This antenna is then contacted with an RFID chip by connecting the RFID chip via contact means with contact elements of the antenna. However, an embodiment of the antenna in the form of a three-dimensional antenna is not described in US Pat. No. 5,528,222.

The invention is based on the object of specifying an improved antenna component and a method for its production.

This object is achieved by an antenna component having at least one three-dimensional antenna, in which the antenna component deforms at least one by means of thermoforming or the like

thermoplastic carrier film, in each case at least one formed on the respective carrier film, in the form of at least one antenna structure of the at least one antenna formed electrically conductive layer and a carrier element of at least one injection molding material. This object is further achieved by a method for producing an antenna component having at least one three-dimensional antenna, in which an at least one electrically conductive layer in the form of an at least first antenna structure is formed on a first antenna

thermoplastic carrier film is formed, a thus formed first film body with the first thermoplastic carrier film and the first formed in the form of the at least first antenna structure first electrically conductive layer is inserted into a first thermoforming mold, the first

Film body according to the contours of the first thermoforming mold is preferably thermoformed using heat and preferably a vacuum, the deformed first film body is placed in an injection mold and the deformed first film body is at least partially back-injected with at least one injection molding material for forming a support member. The invention provides an antenna component which is characterized by improved reception properties and good resistance to environmental influences, and yet can be produced cost-effectively. For example, it has been shown that cracks in the electrical conductor tracks due to mechanical stresses and / or too strong

Strains through the use of a thermoplastic carrier film and the thermoforming of the film body prior to insertion into the

Injection mold can be largely avoided.

On the other hand, these measures led to a considerable reduction in the reject rate in the manufacture of the components.

Advantageous embodiments of the invention are designated in the subclaims.

According to a preferred embodiment of the invention, the antenna component on two or more thermoformed by deformed thermoplastic carrier films.

The two or more carrier films preferably each have at least one conductive layer in the form of a subregion of at least one complete antenna, in which case all subregions together form the shape of at least one complete antenna or form at least one complete antenna.

At least two of the carrier films overlap in some areas in such a way that at designated points this Overlap region electrically contact the electrically conductive layers of these at least two carrier films at least partially.

For this purpose, preferably one or more second film body

formed by one each in the form of a respective second

Antenna structure formed respective second electrically conductive layer on a respective second thermoplastic carrier film is formed. The one or more second film bodies are placed in a respective second one

Thermoforming mold inserted. Subsequently, the respective second

Film body respectively thermoformed or deformed according to the contours of the respective second thermoforming mold, for example, using heat and preferably a vacuum. The thus deformed one or more second film body are then inserted into the corresponding injection mold. The insertion into the injection mold takes place here in such a way that at least two of the film body, consisting of the group first and second

Film body selected, partially overlap and then electrically contact each other at designated or predefined locations in this overlap area. The inserted into the injection mold film body can only partially or completely cover the surface of the cavity of the injection mold. Subsequently, the first and the one or more second film body with the at least one

Injection molding material for the formation of the support member together at least partially back-injected and made a common composite. The film body can be back-injected from the injection molding material only from one side or from both sides, wherein a two-sided injection back molding in several injection molding operations can be performed in temporal succession. However, to form the complete antenna, parts of the antenna can also be made by other methods or in other ways. For example, a finished injection-molded part, produced from a special injection-molding compound containing metallic constituents and / or special polymers, can subsequently be processed by means of a laser and a three-dimensional antenna layout on the surface of the laser by the laser

Injection molded part are produced. The action of the laser activates and / or exposes / ablates injection-molding material, which in a subsequent metallization process, for example electroplating, serves as an adhesive layer for additional, conductive metal layers, which then function as electrically conductive conductor tracks of an antenna. Alternatively, or in addition, parts of the antenna may be over conventional etching or

Wash mask demetallization be prepared from a substantially full-surface metal surface and present as a film body.

These antenna parts produced by other methods are also present as a film body and can be used together with the inventive

Film bodies are placed together in an injection mold and back-injected, as previously described. This procedure has the advantage that the risk of cracks in the electrically conductive layers, which can be initiated by mechanical stresses and / or excessive strains, is then caused by a "division / segmentation" of a three-dimensional shape that is geometrically critical with respect to bending radii and bending angles can be minimized in several with respect to this point "non-critical" geometric shapes. Be particularly advantageous in this case has proved the geometric

divide three-dimensional shape of the antenna into a plurality of subregions or segments such that the elongation of the electrically conductive layers at any point of the respective first and second film body is higher than 1%, preferably higher than 0.5%. The individual subregions are then assigned to different first and second film bodies.

The contours of the injection mold and / or the first thermoforming mold and the shape of the first antenna structure is preferably selected so that the shape of the first antenna structure is an image of the three-dimensional antenna or a part of the three-dimensional antenna on a

two-dimensional, determined by the contours of the injection mold

Lateral surface corresponds. If, as described above, the antenna is formed by a plurality of film bodies, the contours of the injection mold and / or the first and the one or more second thermoforming molds and the shape of the first and one or more second antenna structures are selected accordingly. The three-dimensional antenna is divided into several parts as described above. The shaping of the at least first and the one or more second antenna structures is selected so that they each have an image of the respectively assigned part of the at least one three-dimensional

Antenna corresponds to a two-dimensional lateral surface. The injection mold is formed to have a portion whose contours correspond to the outer contour of the three-dimensional antenna or a portion of the three-dimensional antenna, so that the above-described

Illustration of an image on the determined by the contour of the injection mold lateral surface corresponds. The contour of the first and the one or a plurality of second thermoforming molds are selected accordingly that at least a portion of the respective thermoforming mold has a contour corresponding to the outer contour of the respective associated part of the three-dimensional antenna. Furthermore, it is also possible in this case for the first and the one or more second deep-drawing molds not to perform a complete deformation in accordance with the contour of the three-dimensional antenna, but only pre-deformation is thereby effected. The pre-deformation is preferably chosen so that a deformation of 40 to 90% of the final deformation is achieved.

It is preferred in this context if the first deformed

Film body and the one or more second deformed film body before insertion into the injection mold at least partially

stapled together. The stitching can be done here for example by gluing, by soldering or by mechanical stapling, e.g. done by riveting. Combinations of different processes and processes, as well as the use of different stapling materials are in this

Connection also possible. According to a preferred embodiment of the invention, the first and the one or more second film body by means in the

Injection mold of molded registration pins aligned with each other.

For this case, it is preferred that the first and / or the one or more second film bodies preferably have areas that are formed and / or aligned such that upon engagement of the registration pins in these areas an optimal alignment and positioning of the first and / or the one or more second film body to each other. The above-mentioned regions can be formed in the form of apertures, for example punched holes, notches, or depressions or combinations thereof.

It is also possible in this context that other procedures (eg using registration marks with

corresponding vacuum technology and sensor technology) are used to align the individual film bodies to one another and to position them before injection molding. The registration marks can be arranged on the film bodies and / or on the injection mold. The sensors detecting the registration marks may be provided on supply or discharge devices for the film bodies and / or on the injection mold. Preferably, in the provided and predefined locations of the overlap region between the deformed first and second

Film bodies applied a solder or an electrically conductive adhesive to form an electrical contact between the overlapping film bodies.

The application of the electrically conductive adhesive or solder can be carried out before or after the insertion of the respective film body into the injection mold. Preferably, in this case, a heat-activatable electrically conductive adhesive or a low-temperature solder is used, the softening temperature of which is selected so that the adhesive occurs during the injection molding Melting temperatures and forms an electrically conductive contact between electrical contact elements of the overlapping film body.

A contact between the individual film bodies can in certain cases also on the injection molding in predetermined areas of the

Component take place, if this is conductive after curing. In this case, it is preferred if the back-injection of the entire component takes place in several steps, namely in such a way that in the first step the contacting or contacting and in a second step the

Rear injection of the remaining component under the use of at least one non-conductive injection molding compound.

According to a further preferred variant of the invention, the overlapping foil bodies are thereby electrically conductive during injection molding

contacted that the film body aligned with each other in the

Injection mold are inserted so that the surfaces of the

Touch contact elements of the first and second antenna structure at least partially. Due to the pressures occurring during injection molding and / or the resulting softening of the surrounding layers of the antenna component, the contact elements touching each other at least in some areas are pressed together and aligned with each other in such a way that a reliable galvanic, electrically conductive contacting of the contact elements is achieved.

It has proven to be particularly advantageous in this case, if the above contact elements increased surface roughness or porosity have, in order at least partially to allow a mechanical engagement of the contact points during back injection by the increased contact pressure. The surface roughness or porosity shows

Elevations and / or depressions with sizes in the range of 0.01 μιη to 250 μητι, preferably between 10 m and 50 pm. The contact pressure during back injection is about 800 to 3000 bar.

In addition, it may be advantageous if the contact elements are structured or segmented in such a way that a sequence of conductive regions and of nonconductive, melting, i.

exposed and not covered with contact elements areas of

Film body is present, whereby the composite increases between injection molding material and film body in the entire areas of the contact elements and the

Stability of the contact element and ultimately the antenna device is improved.

It is possible if the contact elements are additionally stapled at least in regions after the back molding. The stitching can be done here for example by gluing, by soldering or by mechanical stapling, e.g. done by riveting. combinations

various procedures and processes, as well as the use of

different stapling materials are also possible in this context.

It is possible, after the thermoforming and / or after the back molding, to provide the antenna component with an additional conductive reinforcing layer at least in the region of the conductive layer and in particular to amplify it galvanically. The application of the conductive Reinforcing layer can be so for example by electroless or

electroless plating done.

Preferably, one or more plated-through holes are provided by the first and / or one or more of the second carrier foils and respective associated contact elements, which are formed on the respective first and second electrically conductive layer opposite side of the respective first and second carrier foil. By means of such plated-through holes, it is possible on the one hand, the film body in any orientation of the

Layer sequence of the film body insert in the injection mold. On the other hand, however, it is also possible to insert the overlapping film body in the opposite orientation of the layer sequence of the film body in the injection mold, so that the introduction of

Through contacts can be dispensed with.

Preferably, the first film body and / or one or more of the second film body are cut at least partially before being placed in the injection mold. The cutting lines are preferably chosen so that the

overlapping film body overlap only in the areas of the contact elements.

However, it may also be advantageous to preferably select the cutting lines such that the overlapping film bodies overlap in the region of the contact elements and in adjacent regions. In these adjacent areas, the material of the film body with the injection molding material or the whole partially merge, whereby an improved mechanical bond, in particular the contact elements can be achieved.

According to a preferred embodiment of the invention, the at least first and / or the one or more second electrically conductive layers comprises at least one metallic layer and an at least one electrically conductive lacquer layer arranged between the metallic layer and the carrier foil. Investigations have shown that by arranging the at least one such electrically conductive lacquer layer, which is arranged between the carrier foil and the at least one metallic layer, a considerable reduction of the reject rates and improvement of the quality of the

three-dimensional antenna can be achieved.

The latter in particular when contour shapes of the three-dimensional antenna are present, the tight curve radii and larger solid angles have.

The at least one electrically conductive lacquer layer acts here on the one hand as a kind of "sliding film", which allows a certain relative movement of the much brittle metal film with respect to the carrier film during the thermoforming process and ultimately leads to a reduction in the total shear forces between the layers and the stresses.

In addition, microcracks occurring in the at least one metal layer are probably bridged by the electrically conductive properties of the at least one electrically conductive lacquer layer in such a way that even when they occur such microcracks, the conductivity of the electrically conductive layer is reduced only insignificantly.

The at least one electrically conductive lacquer layer is preferably applied to the respective carrier foil, i. H. the first and / or the one or more second carrier foils are already applied in the form of the first or the respective second antenna structures, e.g. imprinted and then the

applied metallic layer. The at least one electrically conductive lacquer layer preferably has an electrically conductive polymer and / or a polymeric binder with electrically conductive particles. The electrically conductive particles are incorporated in the polymer matrix of the binder. It is also possible that the electrically conductive lacquer layer comprises both electrically conductive polymers and electrically conductive particles.

Of particular advantage here is when the at least one polymeric binder and / or the at least one electrically conductive polymer comprises a thermoplastic polymer. This causes the

at least one electrically conductive lacquer layer during thermoforming at least partially softened and thus in the region of narrow bending radii or large bending angle of the metallic layer of the metallic layer can be partially displaced. This will cause the occurrence of

Strains and stresses in the entire metallic layer during thermoforming are limited or reduced, further minimizing the occurrence of microcracks in the metal layer. This allows the

Committee rate in the manufacture of the antenna device can be further reduced. The constituents of the electrically conductive lacquer layer, in particular the polymers added to the electrically conductive lacquer layer, are preferably selected such that the binder components of the electrically conductive lacquer layer have a glass transition temperature in the range from -100 ° C. to 200 ° C., more preferably from 20 ° C. to 150 ° C have.

The electrically conductive lacquer layer preferably has a binder fraction of from 1 to 90% by weight, preferably from 15 to 45% by weight, and a proportion of conductive particles of from 10 to 99% by weight, more preferably from 55 to 85% by weight in the dry mass.

The metallic layer preferably has a layer thickness of 0.05 μm to 100 μm, more preferably from 1 μm to 15 μm.

The electrically conductive lacquer layer preferably has a layer thickness of from 0.05 μm to 150 μm, more preferably from 1 μm to 20 μm. Investigations have shown that in such a choice of the layer thickness of the electrically conductive lacquer layer of the Committee - probably due to the above

described effects - can be further reduced.

It is further preferred for the first film body and / or the one or more second film bodies to consist of the first electrically conductive layer or second electrically conductive layer and the first carrier film or the respective second carrier film. By renouncing further

Layers in the inserted into the thermoforming film body is the

Dilution of the electrically conductive layers during thermoforming further reduced, whereby the committee can be further lowered. These advantages are further effected by the fact that the film body are inserted into the thermoforming molds such that the carrier film between the electrically conductive layer and the thermoforming mold is arranged.

In the following the invention will be explained by way of example with reference to several embodiments with the aid of the accompanying drawings.

Fig. 1 shows a sectional view of a film body.

Fig. 2 shows a sectional view of two deformed by thermoforming film body.

Fig. 3a shows a sectional view of an antenna device.

FIG. 3b shows a plan view of the antenna component according to FIG. 3a.

1 shows a film body 10 with a carrier film 11 and an electrically conductive layer 12.

The carrier film 11 consists of a thermoplastic film with a layer thickness between 6 pm and 300 pm, more preferably between 50 pm and 200 pm. The formulation of the carrier film 11 is preferably selected such that the glass transition temperature of the plastic film 11 is between 10 and 200 ° C., more preferably between 20 and 150 ° C. The carrier film is preferably made of PET, BOPP, PVC, PC, PET-PC, polypropylene, ABS, polystyrene, ABS-PC, PMMA. The carrier film may be present as a single-layer material or as a composite material, for example as a laminate of a plurality of individual films, and / or be coated with one or more paint layers. The paint layers can For example, be adhesive layers or protective layers or

Layers for reducing the electrostatic charge of the carrier film.

The electrically conductive layer 12 consists in the embodiment of FIG. 1 of a metallic layer 13 and a layer 14 of an electrically conductive polymer.

The metal of the metal layer 13 is preferably copper. Further, for example, as the metal for the metal layer 13, aluminum, nickel, silver, gold, platinum, zinc, tin, iron, chromium, bismuth, silver, titanium, palladium, platinum, tantalum, an alloy of these metals; Mixtures of these metals and / or layer systems of these materials can be selected. The layer thickness of the metal layer 13 is preferably between 0.1 μιη and 100μηι, more preferably between 1 μιη and 15 m. In this context, it is also envisaged that other conductive materials or

Material systems (for example by means of graphite, graphene nanomaterials, etc.) can be used to form the layer 13.

The electrically conductive lacquer layer preferably comprises a lacquer containing a polymeric binder and electrically conductive particles incorporated in the primary matrix. The electrically conductive particles with any geometry of any electrically conductive material, mixtures of different electrically conductive materials or mixtures of electrically conductive and non-electrically conductive materials. Suitable electrically conductive materials are, for example, graphite, graphene or carbon nanotubes, electrically conductive metal complexes, conductive organic compounds or conductive polymers or metals, preferably Zinc, nickel, copper, tin, cobalt, manganese, iron, magnesium, lead, chromium, bismuth, silver, gold, aluminum, titanium, palladium, platinum, tantalum as well

Alloys thereof or metal mixtures containing at least one of these metals. Examples of suitable alloys are CuZn, CuSn, CuNi, CuAg, SnPb, SnBi, SnCo, NiPb, ZnFe, ZnNi, ZnCo and ZnMn. Particularly preferred are aluminum, iron, copper, silver, nickel, zinc, tin, carbon and mixtures thereof. The electrically conductive particles preferably have an average particle diameter of from 0.001 to 100 μm, preferably from 0.005 to 10 μm. The surface of the electrically conductive particles may be at least partially provided with a coating. suitable

Coatings can be inorganic or organic. The electrically conductive particle may also be coated with a metal or a fully or partially oxidized metal oxide. If two or more different metals form the electrically conductive particles, this can be done by a mixture of these metals. It is particularly preferred if the metals are selected from the group consisting of aluminum, iron, copper, silver, nickel, zinc and tin. However, the electrically conductive particles may also include a first metal and a second metal wherein the second metal is in the form of an alloy (with the first metal or one or more other metals) or the electrically conductive ones

Particles contain two different alloys. In addition to the selection of the electrically conductive particles, the shape of the electrically conductive particles has an influence on the properties of the dispersion after a coating. With regard to the shape, numerous variants known to the person skilled in the art are possible. The shape of the electrically conductive particles may be, for example, acicular, cylindrical, plate-shaped or drop-shaped or spherical. The binder content of the dried lacquer layer 14 is preferably between 1 and 90 percent by weight. The proportion of electrically conductive

Particles in the dried lacquer layer 14 is preferably between 10 and 99 weight percent, more preferably between 55 and 85

Weight.

The polymeric binder preferably comprises the following substances or a combination of the following substances: thermoplastic polymers, solvents or solvent mixtures, catalysts, additives, dispersants,

Filler components, processing aids and stabilizers, such as e.g. UV stabilizers, lubricants, corrosion inhibitors and flame retardants. Solvents, dispersants and filler components are used primarily for better processability of the electrically conductive lacquer layer

Apply as a layer on the carrier film. Preferably, the polymeric binder contains thermoplastic polymers, such as acrylates,

Acrylate resins, cellulose derivatives, methacrylates, methacrylate resins, melamine and amino resins, polyalkylenes, polyimides, epoxy resins, modified epoxy resins, for example bifunctional or polyfunctional bisphenol A or bisphenol F resins, polyfunctional epoxy novolac resins, brominated epoxy resins, cycloaliphatic epoxy resins; aliphatic epoxy resins, glycidyl ethers,

Vinyl ethers, and phenolic resins, phenoxy resins, polyurethanes, polyesters,

Polyvinyl acetals, polyvinyl acetates, polystyrenes, polystyrene copolymers,

Polystyrene acrylates, styrene-butadiene block copolymers, triazine resins,

Bismaleimide-triazine resins (BT), Alkylenvinylacetate and vinyl chloride copolymers, polyamides and their copolymers or polyurethanes, polyesters. Furthermore, mixtures of two or more of these polymers can form the polymeric binder. The proportion of the thermoplastic polymers is preferably between 1 and 100 percent by weight, more preferably between 50 and 90

Weight percent of the binder.

The electrically conductive layer 14 may, for example, have the following formulation:

2% by weight of additives

70 wt.% Metallic component in the form of metallic particles

28 wt.% Binder mixture, which is 90 percent by weight of a

Thermoplastics exists

The layer thickness of the electrically conductive lacquer layer 14 is preferably between 0.1 pm and 100 pm, more preferably between 1 pm and 20 pm. Furthermore, it is also possible for the electrically conductive lacquer layer 14 to consist of electrically conductive polymer, for example PEDOTPSS system (poly (3,4-ethylenedioxythiophene) poly (styrenesulfonate).

In this case, the layer thickness of the electrically conductive lacquer layer 14 is preferably between 5 pm and 120 pm, more preferably between 10 pm and 20 pm.

Furthermore, it is also possible that not only an electrically conductive lacquer layer, but also two or more electrically conductive lacquer layers are arranged between the metallic layer 14 and the carrier foil 11.

Preferably, these electrically conductive lacquer layers are made of this different material or material systems, for example, a layer of an electrically conductive polymer combined with a layer of a binder with embedded in the binder matrix electrically conductive particles. The different lacquer layers can be arranged one above the other, side by side or even partially overlapping.

Furthermore, it is also possible that the electrically conductive layer 12 is formed only from a layer, for example a metallic layer or a layer of an electrically conductive lacquer, which are formed in particular as above with respect to the layers 13 and 14. Furthermore, it is also possible for the electrically conductive layer 12 to consist of two or more metallic layers, which in particular have different layer thicknesses and / or consist of different metals and can be arranged in different ways to each other.

The electrically conductive layer 12 is formed on the carrier film in the form of an antenna structure. For this purpose, for example, on the carrier film 11, the electrically conductive lacquer layer 14 in the form of the antenna structure

printed, for example by means of a screen printing process,

Gravure printing, offset printing, spraying, inkjet printing or embossing. After drying the lacquer layer 14 - if drying is necessary - then the metal layer 13 is applied. Here, it is possible that the metal layer 13 only in the region of the electrically conductive lacquer layer 14, for example by a

Steaming method is applied, or the metallic layer 13 is applied over the entire surface of the carrier film 11, for example by means of vacuum vapor deposition or sputtering, and then removed again in the areas which are arranged outside the antenna structure. Here is It is also possible for the electrically conductive lacquer layer 14 to be applied over the full area to the carrier foil 14 and then subsequently removed again together with the overlying area of the metal layer 13. The removal of the layer 13 or the layers 13 and 14 can

for example by means of mechanical ablation, by means of laser ablation or by means of etching or washing process. When using an etching process, for example, an etchant or etch resist is applied in a negative mold or in a positive mold to the antenna structure. In a washing process, a washcoat is printed in negative form of the antenna structure before application of the layers 13 and the layers 13 and 14 and after applying the layers 13 and 14 in a Wasen method together with the overlying areas of the layer 13 and Layers 13 and 14 removed in a washing process again.

Further, it is also possible that the layers 13 and 14 have a different shape, for example, the layer 14, the layer 13 projects beyond.

The shape of the antenna structure is here chosen such that it corresponds to the two-dimensional lateral surface of the desired three-dimensional antenna or a part of the desired three-dimensional antenna. The three-dimensional contour of the three-dimensional antenna or the part of the three-dimensional antenna is so by means of a corresponding

Imaging function on the corresponding two-dimensional lateral surfaces imaged.

In this case, the three-dimensional antenna is preferably divided into two or more parts, as already explained above. To split the three-dimensional Antenna in sub-antennas are preferably calculated the dilations of the respective antenna structure in the subsequent deformation of the film body and in this case the division made such that the elongation of the electrically conductive layer at each point of the antenna structure is less than 1%.

After dividing the three-dimensional antenna into two or more sub-antennas, the assigned antenna structure is calculated for each of the sub-antennas as described above and a film body corresponding to the film body 10 is produced for each of the sub-antennas, the electrically conductive layer of which is shaped corresponding to the respective antenna structure. The

Material of the carrier film can be identical for all film body or it can also be used in each case carrier films, which consist of different materials and have different physical properties.

These one or more film body are then each in a

assigned thermoforming mold and then, for example, in a

Thermoforming process according to the contours of each

Thermoforming mold deformed, for example, using heat and a vacuum. The thermoforming mold has for this purpose preferably one or more

Openings for applying the vacuum and a correspondingly formed counter-mold, which is pressed by the thermoforming mold in opposite sides for deforming the film body in the thermoforming mold. At the

Thermoforming process, the film body is in this case preferably heated to a temperature between 50 ° C and 150 ° C, more preferably between 60 ° C and 80 ° C. This can be done, for example, by means of a corresponding

Heating means are carried out, which by means of the film body Heat radiation heated and / or heated the thermoforming mold and / or the counter-pressure mold accordingly.

After cooling, the film bodies have a three-dimensional shape in accordance with the contours of the thermoforming mold used in each case.

In FIG. 2, by way of example, two such deformed film bodies 10 'and 20' are shown, wherein the film body 10 'corresponds to the thermoformed shaped film body 10 according to FIG. 1 with the carrier film 11 and the electrically conductive layer 12.

The deformed foil body 20 'also has, as already explained above, a carrier foil, namely the carrier foil 21, and an electrically conductive foil

Layer, namely the electrically conductive layer 22. Furthermore, the film body 20 'on a via 23. This through-connection has already been introduced into the film body before the film body is deformed, for example by introducing a recess into the carrier film 21 at the corresponding point, for example by means of punching or by means of a laser, and then filled with electrically conductive material. This via 23 forms on the electrically conductive layer 22 opposite surface of the carrier film 21 from a contact element, which as described below, then the

Antenna structure of the film body 20 'with the antenna structure of

Film body 10 'contacted.

The deformed by the thermoforming process film body is then placed in an injection mold and back-injected with the at least one injection molding material. If - as stated above - the three-dimensional antenna in two or more parts have been divided and so two or more deformed film body have been prepared for this, the two or more deformed film body are inserted into the injection mold. This will be in

Explained below with reference to the deformed film body 10 'and 20':

The deformed film body 10 'and 20' are inserted into an injection mold whose contour in a region of the outer contour of

Three-dimensional antenna corresponds. The film body 10 'and 20' are in this case aligned aligned with each other in the injection mold, that they overlap partially and in the intended or

electrically contact predefined locations of the overlap area.

For this purpose, the injection mold preferably has registration pins, which are associated with correspondingly arranged holes in the film bodies 10 'and 20'. Thus, for example, as shown in Fig. 3b, the carrier film

11 two registration holes 16 and the carrier film 21 two registration holes 26 on.

The registration holes 16 and 26 are in this case arranged on the respective carrier film 11 or 21, that then an optimal alignment of the film body 10 'and 20' in the desired manner to each other in the injection mold, when the registration pins of the injection mold through the holes 16 and 26 are guided.

The diameter of the registration holes 16 and 26 is preferably between 0.1 and 8 mm; preferably between 1 and 3 mm.

As shown in the figures Fig. 3a and Fig. 3b, in this arrangement, the film body 10 'and 20' in the form of an antenna structure 15 and a Antenna structure 25 formed electrically conductive layers 12 and 22 arranged to each other so that in the overlap region 14, the back of the via 23 contacts the metallic layer 12. After closing the injection mold, at least one liquid injection-molding material is pressed into the mold and so the film body 20 'and 30'

back-injected, wherein a support member 30 is formed. The support member 30 provides on the one hand, the mechanical connection between the film bodies 20 'and 10' ready and further gives the antenna component 1 a certain mechanical stability to the three-dimensional formation of the three-dimensional antenna 3 formed by the antenna structures 15 and 25 even at higher to maintain mechanical influences from the outside.

The contacting of the electrically conductive layers 12 and 22 can in this case already by the pressing together of the surfaces of each other

associated contact elements of these two electrically conductive layers during the injection molding process. However, it is also possible for at least one electrically conductive adhesive or at least one electrically conductive solder to additionally be applied to the film body 10 'and / or 20' in the region of the at least one contacting. The at least one electrically conductive adhesive and / or the at least one electrically conductive solder is preferably applied to the corresponding locations before the film body 10 'and 20' is introduced into the injection mold. The electrical contacting then takes place during the injection molding process

Melting of the at least one electrically conductive adhesive or solder by the temperature entry of the heated injection-molding compound. However, it is also possible for the film bodies 10 'and 20' to be stapled together even before they are placed in the injection mold, and for this to already be electrically connected to the electrically conductive layers 10 and 22 by means of a solder or an electrically conductive adhesive.

As injection molding material preferably thermoplastics such as ABS, polystyrene, ABS-PC, PMMA, PET, PET-PC or combinations of these materials are used.

After the injection molding material has cooled and the injection mold has been removed, the antenna component shown in FIG. 3a and FIG. 3b results with the carrier element 30 formed from an injection molding material, the thermoformed carrier films 11 and 21 and the electrically conductive layers 12 and 22, respectively The antenna structure 15 and 25 are formed and are electrically contacted to each other via the via 23.

Claims

claims

Method for producing an antenna component (1) having at least one three-dimensional antenna (2), comprising

Steps:

Forming a first electrically conductive layer (12) in the form of at least one first antenna structure (15) on a first thermoplastic carrier film (11),

Inserting a first film body (10) thus formed with the first thermoplastic carrier film (11) and the first in the form of

at least one first antenna structure (15) formed first electrically conductive layer (12) in a first thermoforming mold and

Thermoforming of the first film body according to the contours of the first thermoforming mold.

Insertion of the thus deformed first film body (10 ') Injection mold and injection molding of the deformed first film body (10 ') with at least one injection molding material for forming a carrier element.

Method according to claim 1,

characterized,

that the thermoforming of the first film body in the first

Deep-drawing mold according to the contours of the first thermoforming mold using heat and a vacuum occurs.

3. The method according to any one of the preceding claims,

characterized,

that the contours of the injection mold and / or the first thermoforming mold and the shape of the first antenna structure are chosen so that the shape of the first antenna structure of an image of the three-dimensional antenna or a part of the three-dimensional antenna on a two-dimensional, through the contours of

Injection mold corresponds to certain lateral surface.

4. Method according to one of the preceding claims,

characterized,

in that one or more second film bodies (20) are formed by forming in each case a respective second electrically conductive layers (22) formed in the form of at least one respective second antenna structure (25) on a respective second thermoplastic carrier film (21), that the one or more second ones Film body (20) are inserted into a respective second thermoforming mold and the respective second film body in accordance with the contours of the respective second thermoforming mold is thermoformed in particular by using heat and a vacuum, that the thus deformed one or more second film body (20) are inserted into the injection mold such that at least two of the film body selected from the group of first and second film body (10 ', 20' ) overlap regions and are electrically contactable at predetermined or predefined locations in the overlap region, and that the first and the one or more second film body with the injection molding material for

Training the support member (30) are injected behind.

5. The method according to claim 4,

characterized,

that the contours of the injection mold and / or the first and the one or more second thermoforming molds and the shape of the first and the one or more second antenna structures are chosen such that the shape of the first and the one or more second antenna structures each of an image of each associated part of the at least one three-dimensional antenna on a two-dimensional, through the contours of the injection mold

corresponds to certain lateral surface.

6. The method according to any one of claims 4 and 5,

characterized,

in that the deformed first and the deformed one or more second film body before insertion into the injection mold at least

be stitched together in certain areas.

7. The method according to any one of claims 4 to 6,

characterized,

the first and the one or more second film bodies are aligned with one another by means of registration pins formed in the injection mold when they are placed in the injection mold.

8. The method according to any one of claims 4 to 7,

characterized,

that in designated or predefined places in the

Overlap region (40) at least one solder or at least one electrically conductive adhesive (31) for forming at least one electrical contact between the overlapping film bodies is applied.

9. The method according to claim 8,

characterized,

that the at least one solder or the at least one electrically conductive adhesive on one or more of the first and second

Film body (10 ', 20') is applied before inserting the respective film body in the injection mold.

10. The method according to any one of claims 8 and 9,

characterized,

in that the at least one electrically conductive adhesive or the at least one solder (31) melts at least in regions during the injection molding to form the electrical contact.

1.A method according to one of claims 4 to 10,

characterized,

that the provided or predefined locations of the overlapping foil bodies (10 ', 20') are electrically contacted during the back molding process in that the foil bodies are aligned with one another in such a way

Injection mold can be inserted so that the surfaces of

Contact elements of the first and second antenna structure (5, 25) touch at least partially.

12. The method according to any one of claims 1 to 11,

characterized,

in that at least one plated-through hole (23) is formed by the first and / or at least one or more of the second carrier foils (20).

13. The method according to any one of the preceding claims,

characterized,

in that the first film body and / or the one or more second film body before insertion into the injection mold at least

be cut in certain areas.

14. The method according to any one of the preceding claims,

characterized,

the first and / or the one or more second electrically conductive layers are each formed in such a way that the respectively first and second electrically conductive layer (12) comprises at least one metallic layer (13) and one between the metallic layer and the respective first or second conductive layer second carrier film (11) arranged at least one electrically conductive lacquer layer (14).

15. The method according to claim 14,

characterized,

in that the at least one electrically conductive lacquer layer (14) is applied to the respective first or second carrier foil (11), e.g. is printed and then the metallic layer (13) is applied.

16. The method according to any one of claims 14 to 15,

characterized,

in that the at least one electrically conductive lacquer layer (13)

comprising at least one electrically conductive polymer, in particular comprising at least one thermoplastic electrically conductive polymer.

17. The method according to any one of claims 14 to 16,

characterized,

in that the at least one electrically conductive lacquer layer (14)

comprises at least one polymeric binder and electrically conductive particles.

18. The method according to claim 17,

characterized,

that the at least one polymeric binder is thermoplastic

Polymer comprises, in particular the thermoplastic polymers in 1 to 99 weight percent of the dried electrically conductive

Lacquer layer are added.

19. The method according to any one of claims 14 to 18,

characterized,

the glass transition temperature of the electrically conductive lacquer layer is in the range of -100 to 200 ° C.

20. The method according to any one of claims 14 to 19,

characterized,

the layer thickness of the metallic layer is between 0.1 μm and 100 μm, preferably between 1 μm and 15 μm, and the layer thickness of the electrically conductive lacquer layer is between 0.1 μm and 150 μm, preferably between 1 μm and 20 μm.

21. Method according to one of the preceding claims,

characterized,

in that the first film body inserted in the first deep-drawing mold and / or the respective second film body inserted into the respective second deep-drawing mold consists of the at least one electrically conductive first or second layer and the first carrier film or the second carrier film.

22. Method according to one of the preceding claims,

characterized,

the first and / or the one or more second film bodies are inserted into the first or second deep-drawing mold in such a way that the first or second carrier film is arranged between the first and second electrically conductive layer and the deep-drawing mold.

23. Method according to one of the preceding claims, characterized in that

the contours of the first and / or of the one or more second deep-drawing molds are each formed in such a way that the elongation of the electrically conductive first or second layer is less than 1% at each point.

24. The method according to any one of the preceding claims,

characterized,

that the first and / or the one or more second electrically conductive layers are galvanically reinforced after the thermoforming and / or after the back molding,

25. Antenna component (1) with a three-dimensional antenna (2),

in particular for cards or portable electrical appliances, the

Antenna component (1) at least one thermoformed thermoplastic carrier film (11, 21) in each case at least one on the respective carrier film (11, 21) formed in the form of at least one antenna structure (15, 25) of the at least one antenna (2) formed has at least one electrically conductive layer (12, 22) and a carrier element (30) of at least one injection molding material.

26. Antenna component according to claim 25,

characterized,

in that the antenna component (1) has two or more means

Thermoforming deformed thermoplastic carrier films (11, 21) with respective formed on the respective carrier film, in shape at least one antenna structure of the at least one antenna formed at least one electrically conductive layer (11, 21), and that at least two of the carrier films (11, 21) at least partially overlap and at predetermined and predefined locations in the overlap region (40) the electrically conductive Layers (12, 22) of these carrier films (11, 21) are at least partially electrically contacted with each other.

27. Antenna component (1) according to claim 25 or 26,

characterized,

in that the at least one electrically conductive layer (12) or at least one of the electrically conductive layers (12, 22) comprises a metallic layer (13) and an at least one electrically conductive lacquer layer arranged between the metallic layer (13) and the respective carrier film (11) (14) at least in some areas.