WO2012074570A3 - Stacked microelectronic assembly with tsvs formed in stages and carrier above chip - Google Patents

Stacked microelectronic assembly with tsvs formed in stages and carrier above chip Download PDF

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Publication number
WO2012074570A3
WO2012074570A3 PCT/US2011/029394 US2011029394W WO2012074570A3 WO 2012074570 A3 WO2012074570 A3 WO 2012074570A3 US 2011029394 W US2011029394 W US 2011029394W WO 2012074570 A3 WO2012074570 A3 WO 2012074570A3
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WO
WIPO (PCT)
Prior art keywords
stages
microelectronic assembly
extends
opening
microelectronic
Prior art date
Application number
PCT/US2011/029394
Other languages
French (fr)
Other versions
WO2012074570A2 (en
Inventor
Vage Oganesian
Belgacem Haba
Ilyas Mohammed
Craig Mitchell
Piyush Savalia
Original Assignee
Tessera, Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tessera, Inc filed Critical Tessera, Inc
Priority to JP2013541978A priority Critical patent/JP2013544444A/en
Priority to EP11711722.6A priority patent/EP2647040B1/en
Priority to CN201180066039.8A priority patent/CN103339717B/en
Publication of WO2012074570A2 publication Critical patent/WO2012074570A2/en
Publication of WO2012074570A3 publication Critical patent/WO2012074570A3/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Abstract

A microelectronic assembly 100 is provided which includes a first element 110 consisting essentially of at least one of semiconductor or inorganic dielectric material having a surface 103 facing and attached to a major surface 104 of a microelectronic element 102 at which a plurality of conductive pads 106 are exposed, the microelectronic element 102 having active semiconductor devices therein. A first opening 111 extends from an exposed surface 118 of the first element 110 towards the surface 103 attached to the microelectronic element 102, and a second opening 113 extends from the first opening 111 to a first one of the conductive pads 106, wherein where the first and second openings meet, interior surfaces 121, 123 of the first and second openings extend at different angles relative to the major surface 104 of the microelectronic element 102. A conductive element 114 extends within the first and second openings 111, 113 and contacts the at least one conductive pad 106.
PCT/US2011/029394 2010-12-02 2011-03-22 Stacked microelectronic assembly with tsvs formed in stages and carrier above chip WO2012074570A2 (en)

Priority Applications (3)

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JP2013541978A JP2013544444A (en) 2010-12-02 2011-03-22 Multilayer microelectronic assembly having a carrier above the chip and stepped silicon through-electrodes
EP11711722.6A EP2647040B1 (en) 2010-12-02 2011-03-22 Stacked microelectronic assembly with tsvs
CN201180066039.8A CN103339717B (en) 2010-12-02 2011-03-22 There is the stacking micromodule of carrier on the through silicon path and chip that segmentation formed

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US41903310P 2010-12-02 2010-12-02
US61/419,033 2010-12-02
US13/051,424 2011-03-18
US13/051,424 US8736066B2 (en) 2010-12-02 2011-03-18 Stacked microelectronic assemby with TSVS formed in stages and carrier above chip

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WO2012074570A3 true WO2012074570A3 (en) 2012-09-27

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