WO2012117872A1

WO2012117872A1 - Resin substrate with built-in electronic component

Info

Publication number: WO2012117872A1
Application number: PCT/JP2012/053824
Authority: WO
Inventors: 酒井　範夫; 喜人大坪
Original assignee: 株式会社村田製作所
Priority date: 2011-02-28
Filing date: 2012-02-17
Publication date: 2012-09-07
Also published as: JPWO2012117872A1; CN203482516U

Abstract

A substrate (1) with a built-in electronic component comprises a plurality of resin layers (2) laminated to each other and a component (3) disposed so as to be surrounded while being in contact with various resin layers (2) of a first group (8) of two or more of the resin layers (2) which are disposed continuously in the direction of thickness that includes the plurality of resin layers (2). A plurality of reinforcing via conductors (9) are disposed so as to pass through at least one of the resin layers (2) in the first group (8) and to follow at least part of the outline of the component (3) in a planar view. The plurality of reinforcing via conductors (9) is via conductors that do not come into contact with any other circuit or are ones that are grounded.

Description

Component built-in resin substrate

The present invention relates to a component-embedded resin substrate.

An example of a component-embedded substrate formed by alternately laminating insulating layers and conductor patterns made of a thermoplastic resin is described in Japanese Patent Application Laid-Open No. 2007-305664 (Patent Document 1). According to this document, an electronic component such as a chip resistor is built in the substrate and is connected to another electronic component by wiring. In this component built-in substrate, in order to electrically connect conductor patterns at different heights, members called via conductors are formed so as to penetrate the insulating layer in the thickness direction. The electronic component is completely covered and hidden inside the component-embedded substrate and is surrounded by a part of the plurality of insulating layers. In the height layer where the electronic component is disposed, an insulating layer made of a thermoplastic resin directly surrounds the outer periphery of the electronic component so as to completely surround the outer periphery of the electronic component.

FIG. 23 shows an example of a resin substrate with a built-in component based on the conventional technology. In this example, inside the component-embedded resin substrate 101, the resin layer 2 as an insulating layer is in direct contact with the outer periphery of the component 3 so as to completely surround the outer periphery of the component 3 as an electronic component. The component built-in resin substrate 101 includes a plurality of via conductors 6 and a plurality of conductor patterns 7 therein. The component 3 is a rectangular parallelepiped as shown in FIG. 24, and has

electrodes

3a and 3b at both ends, respectively. As shown in FIG. 23, via conductors 6n are connected to the

electrodes

3a and 3b of the component 3, respectively.

JP 2007-305694 A

The above-described component-embedded resin substrate has a problem that when the substrate itself is deformed, an insulating layer made of a thermoplastic resin may be peeled around the built-in component. In the example shown in FIG. 23, the interface 4 where the resin layer 2 as the insulating layer and the component 3 come into contact with each other is first peeled off inside the component-embedded resin substrate 101. The problem is that cracks propagate at the interface 5 between the resin layers 2.

Accordingly, an object of the present invention is to provide a component-embedded resin substrate in which the insulating layer made of a thermoplastic resin is prevented from peeling around the built-in component even when the substrate itself is deformed.

In order to achieve the above object, a component-embedded resin substrate according to the present invention includes a plurality of resin layers stacked on each other and two or more resin layers continuously arranged in the thickness direction included in the plurality of resin layers. Parts arranged so as to be surrounded by and in contact with each resin layer of the first group which is a group, penetrating through at least one of the resin layers belonging to the first group, and in plan view, A plurality of reinforcing via conductors, which are via conductors that are not connected to any other circuit or are grounded, are arranged along at least a part of the outer shape of the component. By adopting this configuration, since a plurality of reinforcing via conductors are arranged around the part, the rigidity of the area around the part is increased. Therefore, even if the resin substrate with a built-in component is bent, the periphery of the component is difficult to bend, and as a result, even when the substrate itself is deformed, the insulating layer made of thermoplastic resin is peeled around the built-in component. Can be reduced.

Preferably, in the above invention, the plurality of reinforcing via conductors are arranged along at least a part of the outline of the component by arranging a plurality of point-like ones in a plan view. . By adopting this configuration, it is possible to alleviate the deformation that reaches the interface of the component at least in part of the outline.

Preferably, in the above invention, the plurality of reinforcing via conductors are arranged so as to extend over all of the first group in the thickness direction. By adopting this configuration, the reinforcing via conductor can cover the side surface of the component in a wider range, so that it is possible to more reliably prevent a large deformation from being transmitted to the side surface of the component.

In the above invention, preferably, the plurality of reinforcing via conductors are arranged so as not to be exposed to the outside. By adopting this configuration, it is possible to more reliably prevent moisture from entering.

Preferably, in the above invention, the plurality of reinforcing via conductors are arranged so as to surround the outer periphery of the component in plan view. By adopting this configuration, it is possible to more reliably protect the area in the vicinity of the component from the deformation that occurs in the entire substrate.

In the above invention, preferably, the plurality of resin layers are mainly composed of a thermoplastic resin. By adopting this configuration, the resin layers can be bonded by heating and pressurizing after laminating the respective resin layers in order, thereby facilitating production.

It is sectional drawing of the resin substrate with a built-in component in Embodiment 1 based on this invention. It is a perspective view which shows the planar positional relationship of the component contained in the component built-in resin substrate in Embodiment 1 based on this invention, several reinforcement via conductors, and a wiring pattern. It is a perspective view which shows the planar positional relationship of the component contained in the 1st modification of the component-embedded resin substrate in Embodiment 1 based on this invention, several reinforcement via conductors, and a wiring pattern. It is explanatory drawing regarding the 2nd modification of the component built-in resin substrate in Embodiment 1 based on this invention. It is explanatory drawing regarding the 3rd modification of the component built-in resin substrate in Embodiment 1 based on this invention. It is explanatory drawing regarding the 4th modification of the component built-in resin substrate in Embodiment 1 based on this invention. It is explanatory drawing regarding the 5th modification of the resin substrate with a built-in component in Embodiment 1 based on this invention. It is explanatory drawing regarding the 6th modification of the component built-in resin substrate in Embodiment 1 based on this invention. It is explanatory drawing regarding the 7th modification of the resin substrate with a built-in component in Embodiment 1 based on this invention. It is a fragmentary sectional view of the 8th modification of the component built-in resin substrate in Embodiment 1 based on this invention. It is a fragmentary sectional view of the 9th modification of the component built-in resin substrate in Embodiment 1 based on this invention. It is a fragmentary sectional view of the 10th modification of the component built-in resin substrate in Embodiment 1 based on this invention. It is explanatory drawing of the 1st process of the manufacturing method of the component built-in resin substrate in Embodiment 2 based on this invention. It is explanatory drawing of the 2nd process of the manufacturing method of the component built-in resin substrate in Embodiment 2 based on this invention. It is explanatory drawing of the 3rd process of the manufacturing method of the resin board with a built-in component in Embodiment 2 based on this invention. It is explanatory drawing of the 4th process of the manufacturing method of the component built-in resin substrate in Embodiment 2 based on this invention. It is explanatory drawing of the 5th process of the manufacturing method of the component built-in resin substrate in Embodiment 2 based on this invention. It is explanatory drawing of the 6th process of the manufacturing method of the component built-in resin substrate in Embodiment 2 based on this invention. It is explanatory drawing of the 7th process of the manufacturing method of the component built-in resin substrate in Embodiment 2 based on this invention. It is explanatory drawing of the 8th process of the manufacturing method of the component built-in resin substrate in Embodiment 2 based on this invention. It is explanatory drawing of the 9th process of the manufacturing method of the component built-in resin substrate in Embodiment 2 based on this invention. It is explanatory drawing of the 10th process of the manufacturing method of the component built-in resin substrate in Embodiment 2 based on this invention. It is sectional drawing of the component built-in resin substrate based on a prior art. It is a perspective view of the components based on a prior art.

(Embodiment 1)
With reference to FIGS. 1 and 2, a component-embedded resin substrate 1 according to the first embodiment of the present invention will be described. A cross-sectional view of the component-embedded resin substrate 1 in the present embodiment is shown in FIG. FIG. 2 shows a planar positional relationship among the component 3, the plurality of reinforcing via conductors 9, and the wiring pattern 10 in the component-embedded resin substrate 1. In FIG. 1 and FIG. 2, the via conductor 6 and the conductor pattern 7 disposed inside are omitted, but the component-embedded resin substrate 1 is similar to the component-embedded resin substrate 101 shown in FIG. 6 and conductor pattern 7 may be provided as appropriate. For example, the via conductor 6 may be formed by filling a through-hole formed by laser processing with a conductive paste containing silver and hardening it. The conductor pattern 7 may be a pattern formed of, for example, copper foil. The component-embedded resin substrate 1 in the present embodiment is a group of a plurality of resin layers 2 stacked on each other and two or more resin layers 2 arranged continuously in the thickness direction included in the plurality of resin layers 2. And a component 3 arranged so as to be surrounded by each resin layer 2 of a certain first group 8. A plurality of reinforcing via conductors 9 are arranged so as to pass through at least one of the resin layers 2 belonging to the first group 8 and along at least a part of the outer shape of the component 3 when viewed in plan. The plurality of reinforcing via conductors 9 are via conductors that are not connected to any other circuit or are grounded. When the plurality of reinforcing via conductors 9 are not connected to any other circuit, the reinforcing via conductors 9 can be regarded as electrically isolated dummy conductive structures. When the plurality of reinforcing via conductors 9 are grounded, the reinforcing via conductors 9 may be connected to the ground wiring or the ground electrode. The plurality of reinforcing via conductors 9 are spaced apart from the component 3. Part of the resin layer 2 enters between the reinforcing via conductor 9 and the component 3.

The component 3 included in the component-embedded resin substrate 1 is an example of an electronic component. The component 3 has a rectangular parallelepiped outer shape as shown in FIG. 24, and includes

electrodes

3a and 3b at both ends. The

electrodes

3a and 3b are provided so as to surround the main body of the component 3 at both ends. The component 3 may be a ceramic capacitor, for example. The

electrodes

3a and 3b are electrically connected to the wiring pattern 10 through via conductors 6n, respectively. In FIG. 1, the via conductor 6 n is drawn downward from the component 3, but this is only an example, and the drawing direction is not limited to the downward direction. The member electrically connected to the component may be configured to be pulled out in another direction. The via conductor 6n may be formed by the same method as the via conductor shown in FIG.

As shown in FIG. 2, the plurality of reinforcing via conductors 9 are arranged in dotted lines so as to surround the component 3 in a state of being separated from the component 3. In FIG. 2, a plurality of reinforcing via conductors 9 can be seen in front, and a wiring pattern 10 can be seen in the back. As shown in FIG. 1, the wiring pattern 10 is located at a different height from the plurality of reinforcing via conductors 9. As shown in FIG. 2, the wiring pattern 10 extends to the outside from the region surrounded by the reinforcing via conductor 9 when viewed in plan.

Similarly to the via

conductors

6 and 6n, the reinforcing via conductor 9 may be formed by filling a through-hole formed by laser processing with a conductive paste and solidifying, but penetrates the resin layer 2 in the thickness direction. It may be a conductive block formed by other known methods arranged in the above manner. As the material of the reinforcing via conductor 9, copper, silver, aluminum, nickel, gold, or an alloy of two or more metals selected from these is preferable for increasing the rigidity.

In the component-embedded resin substrate 1 in the present embodiment, since the plurality of reinforcing via conductors 9 are disposed around the component 3, the rigidity of the region around the component 3 is increased. Therefore, even if the component-embedded resin substrate 1 is bent, the periphery of the component 3 is difficult to bend. As a result, even when the substrate itself is deformed, it is possible to reduce the peeling of the insulating layer made of the thermoplastic resin around the built-in component 3.

Since the plurality of reinforcing via conductors 9 are not connected to any other circuit or are grounded, basically, the plurality of reinforcing via conductors 9 do not generate noise themselves, and the operation of the component 3 and other circuits is not caused. There is no adverse electrical effect.

Note that, as shown in FIG. 2, the plurality of reinforcing via conductors 9 are preferably arranged so as to surround the outer periphery of the component 3 in plan view. This is because such a surrounding configuration can more reliably protect the area in the vicinity of the component 3 from the deformation occurring in the entire substrate. Therefore, it is possible to prevent a large deformation from being transmitted to the vicinity of the component 3, and as a result, it is possible to reduce the peeling of the insulating layer made of the thermoplastic resin around the component 3.

As an example of the arrangement that does not surround the outer periphery of the component 3 in plan view, for example, a component-embedded resin substrate 1i shown in FIG. In the component-embedded resin substrate 1 i, the reinforcing via conductor 9 does not completely surround the outer periphery of the component 3, but is arranged only along two parallel long sides of the four sides of the component 3. ing. Compared with the example shown in FIG. 2, the effect is inferior, but even with the configuration shown in FIG. 3, a certain effect can be obtained with respect to protecting the component 3 from the deformation generated in the entire substrate. In addition, although it arranged here along a long side here, as shown in FIG. 4, even if it is arrangement | positioning along only a short side, a temporary effect can be acquired. However, when the component 3 is rectangular when viewed in plan, it is preferably arranged along the long side. In addition, the plurality of reinforcing via conductors 9 are not limited to two parallel sides of the component 3, and a certain effect can be obtained by arranging them on two adjacent sides as shown in FIG. 5. Alternatively, even if the plurality of reinforcing via conductors 9 are arranged along only one side of the part 3 as shown in FIG. 6 or FIG. Although it is inferior to the arrangement in the arrangement, a certain effect can be obtained. When the component-embedded resin substrate 1 is bent and used in a specific direction, it is particularly effective to dispose the reinforcing via conductor 9 in the bent portion. In the plan view of FIG. 4 and subsequent figures, for convenience of explanation, only the component 3 and the reinforcing via conductor 9 are shown, and other components are not shown.

In other words, it is preferable that the plurality of reinforcing via conductors are arranged along at least a part of the outline of the component by arranging a plurality of dot-like conductors in a plan view. This is because, if the arrangement is made along at least a part of the outline of the component, the deformation reaching the interface of the component can be mitigated at least in a part of the outline. Further, since the plurality of reinforcing via conductors have the same shape as conventional via conductors as long as they are point-shaped as shown in FIGS. 2 to 7, conventional via conductors are manufactured by the same method. Can be convenient. In addition, if the reinforcing via conductor is a dot-like one, it can be arranged without hindering the resin flow when the plurality of resin layers 2 are pressure-bonded so that the degree of freedom in design is increased.

The reinforcing via conductor used in the present invention is not limited to a point-like one, and may be a linear one. For example, a somewhat long shape like the reinforcing via conductor 9j shown in FIG. 8 may be arranged in a broken line. Further, like the reinforcing via conductor 9 k shown in FIG. 9, the length may be approximately equal to the length of the outer side of the component 3. In the example shown in FIG. 9 as well, the reinforcing via conductor 9k does not completely surround the part 3 and has a broken portion as seen in a plan view. A structure in which the conductor surrounds the part completely continuously may be adopted. However, the structure that is interrupted at any point is more realistic because it does not hinder the resin flow when the plurality of resin layers 2 are pressure-bonded and is easy to manufacture.

Note that, as shown in FIG. 1 in the present embodiment, the plurality of reinforcing via conductors are preferably arranged so as to extend over all of the first group in the thickness direction. For example, in the example shown in FIG. 10, since the component 3 has a thickness corresponding to three layers of the resin layer 2, the first group 8 is composed of the three resin layers 2, but the reinforcing via conductor 9 is formed in two of them. It only straddles. Even with such a configuration, a certain effect can be obtained. However, as in the example shown in FIG. 11, it is preferable that the reinforcing via conductors 9 are arranged so as to extend over all three layers of the first group 8. preferable. With such a configuration, the reinforcing via conductor 9 can cover the side surface of the component 3 in a wider range, so that it is possible to more reliably prevent a large deformation from being transmitted to the side surface of the component 3. As a result, peeling of the insulating layer made of the thermoplastic resin around the component 3 can be reduced.

The plurality of reinforcing via conductors may not only extend across all of the first group in the thickness direction, but may extend beyond the first group in the thickness direction.

The plurality of reinforcing via conductors 9 are preferably arranged so as not to be exposed to the outside. As shown in FIG. 12, even if the reinforcing via conductor 9 is exposed to the outside, an effect of suppressing deformation can be obtained to some extent. However, in such a configuration, moisture may enter from the exposed portion. . If the plurality of reinforcing via conductors 9 are arranged so as not to be exposed to the outside, it is preferable because moisture can be more reliably prevented from entering. In any of the examples shown in FIGS. 1, 10, and 11, the plurality of reinforcing via conductors 9 are arranged so as not to be exposed to the outside.

It is preferable that the plurality of resin layers have a thermoplastic resin as a main component. By adopting this configuration, the resin layers can be bonded by heating and pressurizing after laminating the respective resin layers in order, thereby facilitating production. In addition, there may be a problem that parts are moved undesirably by being pressed by the fluidized resin at the time of crimping, but if the reinforcing via conductor is arranged, the momentum of the fluidized resin can be reduced. The degree to which the parts move undesirably can be reduced, and the placement accuracy of the parts can be increased.

(Embodiment 2)
A method for manufacturing a component-embedded resin substrate according to the second embodiment of the present invention will be described with reference to FIGS.

First, a resin sheet 12 with a conductive foil as shown in FIG. 13 is prepared. The resin sheet with conductor foil 12 is a sheet having a structure in which the conductor foil 17 is attached to one surface of the resin layer 2. The resin layer 2 is made of, for example, LCP (liquid crystal polymer) that is a thermoplastic resin. The material of the resin layer 2 may be PEEK (polyetheretherketone), PEI (polyetherimide), PPS (poniphenylene sulfide), PI (polyimide), etc. in addition to LCP. The conductor foil 17 is a 18 μm thick foil made of Cu, for example. The material of the conductor foil 17 may be Ag, Al, SUS, Ni, Au other than Cu, or may be an alloy of two or more different metals selected from these metals. In this embodiment, the conductor foil 17 has a thickness of 18 μm, but the conductor foil 17 may have a thickness of about 3 to 40 μm. The conductor foil 17 may be any thickness that allows circuit formation.

Next, as shown in FIG. 14, via holes 11 are formed so as to penetrate the resin layer 2 by irradiating the surface of the resin sheet 12 with conductor foil on the resin layer 2 side with a carbon dioxide laser beam. The via hole 11 penetrates the resin layer 2 but does not penetrate the conductor foil 17. Thereafter, the smear (not shown) of the via hole 11 is removed. Here, carbon dioxide laser light is used to form the via hole 11, but other types of laser light may be used. In addition, a method other than laser beam irradiation may be employed to form the via hole 11.

Next, as shown in FIG. 15, a resist pattern 13 corresponding to a desired circuit pattern is printed on the surface of the conductor foil 17 of the resin sheet 12 with the conductor foil by a method such as screen printing.

Next, etching is performed using the resist pattern 13 as a mask, and the portion of the conductor foil 17 that is not covered with the resist pattern 13 is removed as shown in FIG. Thereafter, as shown in FIG. 17, the resist pattern 13 is removed. Thus, a desired conductor pattern 7 is obtained on one surface of the resin layer 2.

Next, as shown in FIG. 18, the via hole 11 is filled with a conductive paste by screen printing or the like. Screen printing is performed from the lower surface in FIG. In FIG. 18, for convenience of explanation, the via hole 11 is displayed in a posture facing downward, but in practice, screen printing may be performed by changing the posture as appropriate. The conductive paste to be filled may be mainly composed of silver as described above, but may instead be composed mainly of copper, for example. This conductive paste forms an alloy layer with the metal that is the material of the conductor pattern 7 at the temperature when the laminated resin layer is thermocompression bonded (hereinafter referred to as “thermocompression temperature”). It is preferable that the metal powder contains an appropriate amount. Since this conductive paste contains copper, that is, Cu as a main component for exerting conductivity, this conductive paste includes at least one of Ag, Cu, and Ni in addition to the main component, and Sn, Bi, Zn. It is preferable that at least one of them is included. In FIG. 18, the via conductor 6 and the reinforcing via conductor 9 are formed by filling with the conductive paste. This is merely an example, and actually, there may be a resin layer 2 in which only the via conductor 6 is formed, or there may be a resin layer 2 in which only the reinforcing via conductor 9 is formed. Since the resin layer 2 is to be laminated and assembled later, via conductors 6 and / or reinforcing via conductors 9 are formed in the plurality of resin layers 2 in accordance with the design.

Next, as shown in FIG. 19, a through hole having the same area as the projected area of the component 3 or an area larger than the projected area of the component 3 is formed as the component accommodating hole 14 by punching the resin layer 2. Among the plurality of resin layers 2 that are to be laminated, there may be a part in which the component accommodation hole 14 is formed and a part in which the part accommodation hole 14 is not formed. In accordance with the design of each of the plurality of resin layers 2, the component accommodation holes 14 are formed only in the resin layer 2 where the component accommodation holes 14 are to be formed.

As shown in FIG. 20, a plurality of resin layers 2 are stacked to form a substrate. In the lowermost layer of the substrate, the surface of the resin layer 2 on which the conductor pattern 7 is formed is used facing downward so that the conductor pattern 7 is disposed on the lower surface of the substrate. As a result, the conductor pattern 7 disposed on the lower surface of the substrate becomes the external electrode 18. In the vicinity of the lower surface of the substrate, the resin layer 2 in which the component accommodation holes 14 are not formed is used.

The resin layer 2 in which the component accommodation holes 14 are not formed is arranged in one layer, or two or more layers are laminated, and then the resin layer 2 in which the component accommodation holes 14 are formed is laminated. In the example shown in FIG. 20, after placing one resin layer 2 in which the component accommodation holes 14 are not formed, two resin layers 2 in which the component accommodation holes 14 are formed are stacked. A component accommodating portion 15 is formed by combining two or more component accommodating holes 14. The component accommodating portion 15 is a recess having a depth enough to accommodate the component 3.

By stacking, the reinforcing via conductor 9 is arranged around the component housing portion 15. The reinforcing via conductor 9 is disposed so as to surround the component housing portion 15 while being separated from the component housing portion 15. At this time, the upper surface of the reinforcing via conductor 9 may be exposed.

When the resin layer 2 is laminated until the part accommodating portion 15 is formed, temporary pressure bonding is performed at a temperature lower than the thermocompression bonding temperature. The temperature of the temporary pressure bonding is, for example, 150 ° C. or higher and 200 ° C. or lower. By temporarily press-bonding, the resin layers 2 laminated up to this point are connected, and the component housing portion 15 is formed as a stable recess.

Next, as shown in FIG. 21, the component 3 is inserted into the component accommodating portion 15.
Next, as shown in FIG. 22, the resin layer 2 is disposed so as to cover the upper side of the component 3. The resin layer 2 is disposed so that the conductor pattern 7 is exposed on the upper surface of the substrate. The conductor pattern 7 formed on the resin layer 2 located on the uppermost surface of the substrate serves as an external electrode 19 for mounting other IC components and the like. The upper surface of the reinforcing via conductor 9 is covered with the resin layer 2. In the example shown in FIG. 22, only one resin layer 2 is covered as compared with FIG. 21, but not limited to one layer, two or more layers may be covered.

Next, this laminate is subjected to main pressure bonding. In the final press-bonding process, the laminated body that has already been temporarily press-bonded and the entire resin layer 2 that has been stacked after the temporary press-bonding are collectively thermocompression bonded. The temperature of the main press bonding is, for example, 250 ° C. or more and 300 ° C. or less. The above-mentioned “thermocompression bonding temperature” means the temperature of the main compression bonding. By performing this pressure bonding, the resin layers 2 adjacent to each other in the thickness direction are bonded to each other to form an integral insulating substrate. When the material of the resin layer 2 is a thermoplastic resin, since the material of the resin layer 2 softens and flows by thermocompression bonding, the gap around the component 3 is filled with the flow of the material of the peripheral resin layer 2. After the main pressure bonding, it is preferable that the surface of the

external electrodes

18 and 19 formed on the upper and lower surfaces of the component-embedded resin substrate is plated with Ni, Au or the like.

In this way, a component-embedded resin substrate 1j is obtained as shown in FIG.
In the present embodiment, a resin substrate with a built-in component that is essentially the same as that described in Embodiment 1 can be obtained by stacking and thermocompression-bonding resin layers that have undergone predetermined processing.

In the present embodiment, the example in which the final pressure bonding is performed after the temporary pressure bonding is performed once is shown. However, the number of the temporary pressure bonding may be two times or more instead of one time. It is good also as finishing only by this pressure bonding, without performing temporary pressure bonding at all. However, in general, it is preferable to perform the temporary pressure bonding at an appropriate time during the assembly because the laminated resin layer can be prevented from shifting during the operation.

In each embodiment, as the reinforcing via conductor, via conductors formed for each resin layer are connected side by side in the thickness direction and illustrated as being over multiple layers. It is not limited to such a structure, but may be formed by other methods. For example, the reinforcing via conductor is provided with a concave portion that spans a plurality of layers in the thickness direction in a region where the reinforcing via conductor is to be formed, and a conductor having a height that spans the plurality of layers in the thickness direction is provided in the concave portion. It may be formed by filling as a conductor paste or inserting as a conductor block.

In each embodiment, description has been made on the assumption that such a component 3 as shown in FIG. 24 is assumed as an example of a component to be incorporated. Is not limited to such a structure, but may have other forms.

In each embodiment, only an example in which the number of components arranged inside one substrate is 1 is shown, but a configuration in which a plurality of components are arranged inside one substrate may be used. . The plurality of components arranged inside one substrate are not necessarily the same structure, and may be components having different structures.

The material of the resin layer 2 is not limited to a thermoplastic resin but may be a thermosetting resin. The material of the resin layer 2 may be other resins.

It should be noted that the above-described embodiment disclosed herein is illustrative and non-restrictive in every respect. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

The present invention can be used for a component-embedded resin substrate.

1, 1i, 1j Component built-in resin substrate, 2 resin layer, 3 component, 3a, 3b (component) electrode, 4 (insulating layer and component) interface, 5 (insulating layer-to-insulator) interface, 6, 6n via Conductor, 7 conductor pattern, 8 first group, 9, 9j, 9k reinforcing via conductor, 10 wiring pattern, 11 via hole, 12 resin sheet with conductive foil, 13 resist pattern, 14 component receiving hole, 15 component receiving part, 17 (Before patterning) Conductor foil, 18, 19 External electrode, 101 (Conventional) Component-embedded resin substrate.

Claims

A plurality of resin layers (2) laminated together;
The component (3) arranged so as to be surrounded by each resin layer of the first group (8) which is a group of two or more resin layers arranged continuously in the thickness direction included in the plurality of resin layers And
Not connected to any other circuit or grounded so as to penetrate at least one of the resin layers belonging to the first group and along at least a part of the outer shape of the component in plan view A component-embedded resin substrate on which a plurality of reinforcing via conductors (9, 9j, 9k) which are via conductors are arranged.
2. The plurality of reinforcing via conductors are arranged so as to be along at least a part of an outline of the component by arranging a plurality of point-like ones in a plan view. Component built-in resin board.
The component-embedded resin substrate according to claim 1, wherein the plurality of reinforcing via conductors are arranged so as to extend over all of the first group in the thickness direction.
The component-embedded resin substrate according to claim 1, wherein the plurality of reinforcing via conductors are arranged so as not to be exposed to the outside.
The component-embedded resin substrate according to claim 1, wherein the plurality of reinforcing via conductors are arranged so as to surround an outer periphery of the component in a plan view.
The component-embedded resin substrate according to claim 1, wherein the plurality of resin layers are mainly composed of a thermoplastic resin.