WO2012149331A3 - Optical endpoint detection system - Google Patents

Optical endpoint detection system Download PDF

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Publication number
WO2012149331A3
WO2012149331A3 PCT/US2012/035469 US2012035469W WO2012149331A3 WO 2012149331 A3 WO2012149331 A3 WO 2012149331A3 US 2012035469 W US2012035469 W US 2012035469W WO 2012149331 A3 WO2012149331 A3 WO 2012149331A3
Authority
WO
WIPO (PCT)
Prior art keywords
detection system
endpoint detection
process chamber
endpoint
optical endpoint
Prior art date
Application number
PCT/US2012/035469
Other languages
French (fr)
Other versions
WO2012149331A2 (en
Inventor
Balasubramanian Ramachandran
Masato Ishii
Aaron Muir Hunter
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Priority to KR1020137031675A priority Critical patent/KR101742478B1/en
Priority to SG2013075577A priority patent/SG194450A1/en
Priority to CN201280019970.5A priority patent/CN103493192B/en
Priority to JP2014508603A priority patent/JP6019105B2/en
Publication of WO2012149331A2 publication Critical patent/WO2012149331A2/en
Publication of WO2012149331A3 publication Critical patent/WO2012149331A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto 
    • B08B9/08—Cleaning containers, e.g. tanks
    • B08B9/46—Inspecting cleaned containers for cleanliness
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52—Controlling or regulating the coating process
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N2021/8411—Application to online plant, process monitoring
    • G01N2021/8416—Application to online plant, process monitoring and process controlling, not otherwise provided for

Abstract

Methods and apparatus for determining an endpoint of a process chamber cleaning process are provided. In some embodiments, a processing system having an endpoint detection system may include a process chamber having internal surfaces requiring periodic cleaning due to processes performed in the process chamber; and an endpoint detection system that includes a light detector positioned to detect light reflected off of a first internal surface of the process chamber; and a controller coupled to the light detector and configured to determine an endpoint of a cleaning process based upon the detected reflected light.
PCT/US2012/035469 2011-04-29 2012-04-27 Optical endpoint detection system WO2012149331A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020137031675A KR101742478B1 (en) 2011-04-29 2012-04-27 Optical endpoint detection system
SG2013075577A SG194450A1 (en) 2011-04-29 2012-04-27 Optical endpoint detection system
CN201280019970.5A CN103493192B (en) 2011-04-29 2012-04-27 Determine the Apparatus and method for of the terminal processing chamber clean technique
JP2014508603A JP6019105B2 (en) 2011-04-29 2012-04-27 Optical end point detection system

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201161480839P 2011-04-29 2011-04-29
US61/480,839 2011-04-29
US13/440,564 2012-04-05
US13/440,564 US9347132B2 (en) 2011-04-29 2012-04-05 Optical endpoint detection system

Publications (2)

Publication Number Publication Date
WO2012149331A2 WO2012149331A2 (en) 2012-11-01
WO2012149331A3 true WO2012149331A3 (en) 2013-03-28

Family

ID=47066950

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2012/035469 WO2012149331A2 (en) 2011-04-29 2012-04-27 Optical endpoint detection system

Country Status (7)

Country Link
US (2) US9347132B2 (en)
JP (1) JP6019105B2 (en)
KR (1) KR101742478B1 (en)
CN (1) CN103493192B (en)
SG (1) SG194450A1 (en)
TW (1) TWI538079B (en)
WO (1) WO2012149331A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10047457B2 (en) 2013-09-16 2018-08-14 Applied Materials, Inc. EPI pre-heat ring
US10153141B2 (en) 2014-02-14 2018-12-11 Electronics And Telecommunications Research Institute Apparatus for monitoring gas and plasma process equipment including the same
US10053777B2 (en) * 2014-03-19 2018-08-21 Applied Materials, Inc. Thermal processing chamber
JP2018046044A (en) * 2016-09-12 2018-03-22 大陽日酸株式会社 Cleaning device and cleaning method of susceptor
US10043641B2 (en) 2016-09-22 2018-08-07 Applied Materials, Inc. Methods and apparatus for processing chamber cleaning end point detection
CN109226131A (en) * 2018-10-11 2019-01-18 武汉华星光电半导体显示技术有限公司 Clean endpoint monitoring method and monitoring device
CN109365410B (en) * 2018-10-17 2020-09-18 北京航天控制仪器研究所 Processing head device for realizing efficient laser cleaning and cleaning method
US11708635B2 (en) 2020-06-12 2023-07-25 Applied Materials, Inc. Processing chamber condition and process state monitoring using optical reflector attached to processing chamber liner

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11140655A (en) * 1997-11-14 1999-05-25 Sony Corp Plasma treating device
US20040011379A1 (en) * 2000-08-08 2004-01-22 Anaokar Sunil G. Processing apparatus and cleaning method
US6737666B1 (en) * 1999-11-26 2004-05-18 Nec Electronics Corporation Apparatus and method for detecting an end point of a cleaning process
KR20040055344A (en) * 2002-12-20 2004-06-26 아남반도체 주식회사 Chamber cleaner

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6129807A (en) 1997-10-06 2000-10-10 Applied Materials, Inc. Apparatus for monitoring processing of a substrate
JP2002246320A (en) 2001-02-20 2002-08-30 Hitachi Ltd Plasma cleaning method for plasma processor
JP2004047020A (en) * 2002-07-15 2004-02-12 Fuji Electric Holdings Co Ltd Magnetic disk medium and fixed magnetic disk device
US8460945B2 (en) 2003-09-30 2013-06-11 Tokyo Electron Limited Method for monitoring status of system components
US20060021633A1 (en) 2004-07-27 2006-02-02 Applied Materials, Inc. Closed loop clean gas control
US7534469B2 (en) * 2005-03-31 2009-05-19 Asm Japan K.K. Semiconductor-processing apparatus provided with self-cleaning device
JP5441332B2 (en) * 2006-10-30 2014-03-12 アプライド マテリアルズ インコーポレイテッド Endpoint detection for photomask etching
US20080176149A1 (en) 2006-10-30 2008-07-24 Applied Materials, Inc. Endpoint detection for photomask etching
CN201182036Y (en) 2007-02-01 2009-01-14 应用材料股份有限公司 Gas injection nozzle

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11140655A (en) * 1997-11-14 1999-05-25 Sony Corp Plasma treating device
US6737666B1 (en) * 1999-11-26 2004-05-18 Nec Electronics Corporation Apparatus and method for detecting an end point of a cleaning process
US20040011379A1 (en) * 2000-08-08 2004-01-22 Anaokar Sunil G. Processing apparatus and cleaning method
KR20040055344A (en) * 2002-12-20 2004-06-26 아남반도체 주식회사 Chamber cleaner

Also Published As

Publication number Publication date
KR101742478B1 (en) 2017-06-15
JP6019105B2 (en) 2016-11-02
KR20140033376A (en) 2014-03-18
JP2014518009A (en) 2014-07-24
TWI538079B (en) 2016-06-11
TW201250906A (en) 2012-12-16
CN103493192B (en) 2016-08-17
US20120273005A1 (en) 2012-11-01
CN103493192A (en) 2014-01-01
US10179354B2 (en) 2019-01-15
US20160263634A1 (en) 2016-09-15
US9347132B2 (en) 2016-05-24
SG194450A1 (en) 2013-12-30
WO2012149331A2 (en) 2012-11-01

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