WO2012151738A1

WO2012151738A1 - Embedded capacitance material and forming method thereof

Info

Publication number: WO2012151738A1
Application number: PCT/CN2011/073784
Authority: WO
Inventors: 苏民社
Original assignee: 广东生益科技股份有限公司
Priority date: 2011-05-06
Filing date: 2011-05-06
Publication date: 2012-11-15

Abstract

An embedded capacitance material and a forming method thereof are provided in the present invention. The embedded capacitance material comprises: a prepreg, metal foils or cement coated metal foils respectively covered on both sides of the prepreg by pressing. The prepreg comprises a porous organic film and adhering resin compound after impregnating and drying. The cement coated metal foils comprise metal foils and resin compound coated on the metal foils. By using a porous organic film as the supporting material, the embedded capacitance material in the present invention not only increases the capacitance, but also provides excellent impact resistance.

Description

Buried material and manufacturing method thereof

The invention relates to the technical field of buried materials, in particular to a buried material using a porous organic film as a supporting material and a manufacturing method thereof. Background technique

As electronic devices move toward higher functionality and miniaturization, passive components in electronic systems are becoming more and more important. For example, the number of passive devices in mobile phones is 20 times that of active devices. At present, passive devices mainly use surface mount methods (such as discrete capacitive devices), occupy a large amount of space on the substrate, and have a large number of interconnect lengths and solder joints, which makes the electrical properties and reliability of materials and systems large. reduce. In order to provide an electronic system that is lighter, more efficient, cheaper, and more reliable, the conversion of a surface mount package system to a buried package system is the only option. Among all the passive components, the number of capacitors is the most, and more attention is paid.

In order to save space on the surface of the board and reduce electromagnetic interference, the discrete capacitors are buried (laminated) in the form of a flat capacitor (two metal electrodes up and down, with a flat dielectric structure in the middle) In the board (PCB), it is the trend to solve the problem.

Pre-obtained buried capacitors with high application value, the dielectric materials need to have high withstand voltage, high peel strength between the medium and the metal substrate, and good heat resistance and processing properties. These requirements for buried capacitor materials should first be attributed to the resin matrix requirements in the dielectric material. It is well known that as a buried capacitor, it is required to have a thin dielectric layer thickness and a high dielectric constant. In order to obtain a high dielectric constant, a large amount of a high dielectric ceramic filler is usually added to the dielectric layer, and a large amount of ceramic filler is used. The addition has a certain negative influence on the performance of the dielectric layer, such as the deterioration of the peeling strength, the deterioration of the reliability of the material, the brittleness of the material, the deterioration of the processing property, etc., and the dielectric layer of the buried capacitor material is made thin. In the case of these, the adverse effects will be more prominent.

Chinese patent CN200610007389.8 discloses a resin composition for a buried capacitor, a buried ceramic/polymer buried material for including the resin composition, and a resin composition mainly focused on In order to solve the problem of adhesion, heat resistance and flame retardancy, the brittleness problem of the buried material composed of the resin composition and the ceramic material is not solved, and the resin composition is large in its own brittleness, and After the ceramic filler is compounded, it is more brittle and difficult to pass. The line etching machine that processes the printed circuit board (PCB) process will be broken during the processing of the PCB, and cannot meet the processing requirements as a buried material.

In order to solve the brittleness problem of buried materials, one of the more methods currently used is to use a method of adding a supporting material, such as glass fiber cloth as a supporting material. U.S. Patent No. 5,162,977 discloses a process for fabricating and assembling a printed circuit board containing a high-capacitance energy distribution core layer, the high dielectric constant material being formed of epoxy resin and strongly induced ceramic powder. The glue is formed by impregnating a fiberglass cloth. However, the thickness of the buried material made of the thinnest glass cloth is more than 30 microns, which cannot meet the need for a thinner thickness of the buried material.

U.S. Patent Application No. US20060188701 discloses the use of a heat-resistant film in the middle as a supporting material. Although the strength of the buried material (i.e., the brittleness is solved) is solved, the use of the film as an intermediate interlayer causes the buried material to be two parts. The series structure, according to the calculation formula of the series capacitor 1/C=1/C1+1/C2, the capacitance value C of the finally fabricated buried material is reduced.

U.S. Patent No. 4,996,097, by using a ceramic-filled PTFE film having a minimum thickness of 2.5 μm as a capacitor material by expansion and stretching, proposes to fabricate a porous PTFE film by a stretching method and then eliminate it by high pressure (1000 psi) compression. The voids therein are made into a capacitor material without voids. It has not been proposed to use such a porous high-porosity PTFE film as a supporting material, and to impregnate other resin systems by impregnation to achieve the purpose of eliminating pores, thereby preparing a buried material. Moreover, the capacitor material produced by this patented method needs to be molded at a high temperature of 350 ° C or higher.

In view of the above problems, it is necessary to develop a buried material having sufficient strength and a small decrease in the permittivity. Summary of the invention

The object of the present invention is to provide a buried material which uses a porous organic film as a supporting material, which is advantageous for thinning of a buried material, good flexibility, and high electric capacity.

Another object of the present invention is to provide a method for fabricating the above-mentioned buried material, which adopts a porous organic film as a supporting material, has good formability, and is processed and operated, and the strength and impact resistance of the prepared buried material are obtained. Excellent performance, avoiding the phenomenon of chipping during etching or drilling

In order to achieve the above object, the present invention provides a buried material comprising: a prepreg, and a metal foil or a metallized metal foil respectively pressed on both sides thereof, the prepreg comprising a porous organic film and adhered thereto by impregnation and drying The resin composition, the metallized metal foil comprises a metal foil and a resin composition coated thereon. The porous organic film is made of polyester, polyamine, polyacrylic acid, polyimide, aramid, polytetrafluoroethylene, or syndiotactic polystyrene; the porous organic film is expanded by porosity a polytetrafluoroethylene (ePTFE) film, a porous polyethylene film, a porous polypropylene film, or a porous polyimide film; the porous organic film has a thickness of 2 to 50 μm, wherein the hole The pore size is from 1 to 500 μm, and the porosity is from 30 to 98%; the metal foil is copper, brass, aluminum, nickel, or an alloy of these metals or a composite metal foil having a thickness of 12 to 150 μm.

The resin component of the resin composition is an epoxy resin, a cyanate resin, a polyphenylene ether resin, a polybutadiene resin, a styrene-butadiene resin, an anthracene resin, a polytetrafluoroethylene resin (PTFE resin), a polyamido. One or more of an amine resin, a phenol resin, and an acrylate resin; the resin composition does not include or include a ceramic filler selected from the group consisting of titanium dioxide, silicon dioxide, aluminum oxide, boron nitride, aluminum nitride, Barium titanate, barium titanate, barium titanate, barium calcium titanate, barium titanate lead ceramics, lead titanate magnesium chloride lead, carbon black, carbon nanotubes, ferroferric oxide, metals and metal oxides One or more of the powders.

The present invention provides another embedding material comprising: a porous organic film and a rubberized metal foil pressed on both sides thereof, the rubberized metal foil comprising a metal foil and a resin composition coated thereon.

The porous organic film is made of polyester, polyamine, polyacrylic acid, polyimide, aramid, polytetrafluoroethylene, or syndiotactic polystyrene, and the porous organic film is porous. a polytetrafluoroethylene (ePTFE) film, a porous polyethylene film, a porous polypropylene film, or a porous polyimide film; the porous organic film has a thickness of 2 to 50 μm, wherein the hole The pore size is from 1 to 500 μm, and the porosity is from 30 to 98%; the metal foil is copper, brass, aluminum, nickel, or an alloy of these metals or a composite metal foil having a thickness of 12 to 150 μm.

The invention provides a method for manufacturing the above buried material, comprising the following steps:

Step 1. Providing a porous organic film, a metal foil or a metallized metal foil, and preparing a glue solution of the resin composition;

Step 2: impregnating the porous organic film with the glue solution of the resin composition prepared above, baking and semi-curing to obtain a prepreg; Step 3. Laminating a metal foil or a metallized metal foil on both sides of the prepreg, and then putting it into a laminating machine to cure by hot pressing, thereby preparing a buried material.

The porous organic film is made of polyester, polyamine, polyacrylic acid, polyimide, aramid, polytetrafluoroethylene, or syndiotactic polystyrene, and the porous organic film is porous. a polytetrafluoroethylene film, a porous polyethylene film, a porous polypropylene film, or a porous polyimide film; the porous organic film has a thickness of 2 to 50 μm, wherein the pore diameter is 1~500 μ η, a porosity of 30 to 98%; the metal foil is copper, brass, aluminum, nickel, or an alloy or composite metal foil of these metals, and has a thickness of 12 to 150 μm; The metal foil is obtained by baking a resin solution of a resin composition on a metal foil, and baking is semi-cured, and the resin composition is the same as or different from the resin composition of the prepreg.

The present invention provides another method for fabricating the above-mentioned buried material, comprising the following steps: Step 1. Providing a metal foil and a porous organic film, and preparing a glue of the resin composition;

Step 2: coating or pouring a glue solution of the resin composition on the metal foil, baking and semi-curing to obtain a rubberized metal foil;

Step 3. Laminating a strip of coated metal foil on both sides of the porous organic film, and then putting it into a laminating machine to cure by hot pressing, thereby preparing a buried material.

The porous organic film is made of polyester, polyamine, polyacrylic acid, polyimide, aramid, polytetrafluoroethylene, or syndiotactic polystyrene, and the porous organic film is porous. a polytetrafluoroethylene film, a porous polyethylene film, a porous polypropylene film, or a porous polyimide film; the porous organic film has a thickness of 2 to 50 μm, wherein the pore diameter is 1~500 μ ιη, porosity is 30~98%; the metal foil is copper, brass, aluminum, nickel, or an alloy or composite metal foil of these metals, and has a thickness of 12-150 μm.

Advantageous Effects of the Invention: The buried material of the present invention adopts a porous organic film as a supporting material, which can facilitate the entry of the resin or the filler, so that the buried material becomes a whole, and the internal does not have a series effect, thereby making electricity The capacity is improved. In addition, a porous organic film is used as a supporting material, and a thermosetting resin is used to prepare a buried material, which has good formability, low molding temperature, process operation cylinder, and strength of the prepared buried material. Excellent impact resistance, avoiding the phenomenon of cracking during etching or drilling, and facilitating the thinning of the buried material. detailed description

A buried material according to an embodiment of the present invention comprises: a prepreg, and a rubberized metal foil or a metal foil laminated on both sides thereof, the prepreg comprising a porous organic film and being attached by impregnation and drying The resin composition thereon, the metallized metal foil includes a metal foil and a resin composition coated thereon. The porous organic film is used as a supporting material, and has good flexibility, can provide flexibility, high electric capacity, excellent strength and impact resistance of the buried material, and the thickness of the buried material can be less than 25 microns, and more Thin.

The porous organic film may be a film made of polyester, polyamine, polyacrylic acid, polyimide, aramid, polytetrafluoroethylene, or syndiotactic polystyrene, but is not limited to these listed materials, It is made by foaming, expanding and stretching. The porous organic film may be a porous expanded polytetrafluoroethylene (ePTFE) film, a porous polyethylene film, a porous polypropylene film, or a porous polyimide film, preferably porous. The organic film is a porous polytetrafluoroethylene film produced by expansion stretching. The porous organic film has a large number of non-closed pores, and the size of the pores is convenient for the resin and the filler to enter, preferably having a thickness of 2 to 50 μm, wherein the pore diameter is 1 μ ιη to 500 μ ιη, The porous organic film having a porosity of 50% to 98% is further preferably a porous organic film having a thickness of 2 to 15 μm, a pore diameter of 1 μm to 10 μm, and a porosity of 70% to 98%. .

The resin composition for applying the metal foil is the same as or different from the resin composition of the prepreg, and the resin component included in the resin composition may be an epoxy resin, a cyanate resin, a polyphenylene ether resin, or a polybutylene. One or more of a diene resin, a styrene-butadiene resin, a fluorene resin, a PTFE resin (polytetrafluoroethylene resin), a polyimide resin, a phenol resin, and an acrylate resin, but are not limited thereto.

According to the present invention, the resin composition may not include a ceramic filler, and may also include a ceramic filler selected from the group consisting of titanium dioxide, silicon dioxide, aluminum oxide, boron nitride, aluminum nitride, barium titanate, and titanic acid. One of barium, barium titanate, barium calcium titanate, zirconium titanate lead ceramic, lead titanate magnesium lead, carbon black, carbon nanotubes, triiron tetroxide, metal and metal oxide powder or A variety, but not limited to these.

According to the invention, the metal foil is used as an electrode material, and the metal foil may include copper, brass, aluminum, nickel, or an alloy of these metals or a composite metal foil having a thickness of 12 to 150 μm.

The manufacturing method of the buried material of the above embodiment comprises the following steps:

Step 1. Providing a porous organic film, and a metal foil or a metallized metal foil, and preparing a glue solution of the resin composition; the resin composition may or may not include a ceramic filler. When a metal foil is applied, the rubberized metal foil can be prepared in advance, and the resin composition is coated on the metal foil to be semi-cured by baking.

Step 2. Impregnating the porous organic film with the glue of the resin composition prepared above, baking and semi-curing to obtain a prepreg. Step 3. Laminating a metal foil or a metallized metal foil on both sides of the prepreg, and then putting it into a laminating machine to cure by hot pressing, thereby preparing a buried material. The resulting buried material may have a thickness of less than 25 microns.

A buried material according to another embodiment of the present invention includes: a porous organic film and a rubberized metal foil pressed on both sides thereof, the rubberized metal foil comprising a metal foil and a resin composition coated thereon . The porous organic film is used as a supporting material, and has good flexibility, can provide flexibility, high electric capacity, excellent strength and impact resistance of the buried material, and the buried material can be thinner (thickness can be Less than 25 microns).

The porous organic film may be a film made of polyester, polyamine, polyacrylic acid, polyimide, aramid, polytetrafluoroethylene, or syndiotactic polystyrene, but is not limited to these listed materials, It is made by foaming, expanding and stretching. The porous organic film may be a porous expanded polytetrafluoroethylene film, a porous polyethylene film, a porous polypropylene film, or a porous polyimide film. The preferred porous organic film is A porous polytetrafluoroethylene film produced by expansion stretching. The porous organic film has a large number of unsealed pores, and the size of the pores is convenient for the resin and the filler to enter, preferably having a thickness of 2 to 50 μm, wherein the pore diameter is 1 μ ιη to 500 μ ιη, The porous organic film having a porosity of 50% to 98% is further preferably a porous organic film having a thickness of 2 to 15 μm, a pore diameter of 1 μm to 10 μm, and a porosity of 70% to 98%. .

The resin component included in the resin composition may, for example, be an epoxy resin, a cyanate resin, a polyphenylene ether resin, a polybutadiene resin, a styrene-butadiene resin, an anthracene resin, or a PTFE resin (polytetrafluoroethylene resin). One or more of a polyimide resin, a phenol resin, and an acrylate resin, but is not limited thereto. According to the present invention, the resin composition may not include a ceramic filler, and may also include a ceramic filler selected from the group consisting of titanium dioxide, silicon dioxide, aluminum oxide, boron nitride, aluminum nitride, barium titanate, and titanic acid. One of barium, barium titanate, barium calcium titanate, barium titanate lead ceramic, lead titanate magnesium chloride, carbon black, carbon nanotubes, triiron tetroxide, metal and metal oxide powder or A variety, but not limited to these. According to the invention, the metal foil is used as an electrode material, and the metal foil may include copper, brass, aluminum, nickel, or an alloy of these metals or a composite metal foil having a thickness of 12 to 150 μm.

The manufacturing method of the buried material according to another embodiment of the present invention includes the following steps:

Step 1. A metal foil and a porous organic film are provided, and a gel of the resin composition is prepared.

Step 2. Coating or casting a glue solution of the resin composition on the metal foil, baking and semi-curing to obtain a rubberized metal foil.

Step 3. Lay a piece of rubberized metal foil on both sides of the porous organic film, and then put it into The laminating machine is cured by hot pressing, that is, a buried material is obtained. The resulting buried material may have a thickness of less than 25 microns.

The embodiments of the present invention are described in detail below, but the present invention is not limited to the scope of the embodiments. Example 1:

Dissolving bisphenol A epoxy resin (epoxy resin A), brominated epoxy resin (epoxy resin B) and terminal carboxylated nitrile rubber (C) in ethylene glycol methyl ether, and adding relative to epoxy The resin was mixed at a molar ratio of o-cresol novolac phenolic acid resin and 2-MI (2-methylimidazole), and then mixed at room temperature to obtain a gum solution. The obtained glue was coated on a copper foil, and then baked in an oven at 155 ° C for 5 minutes to form a B-stage to obtain a coated copper foil (RCC) having a thickness of 8 μm. Next, a 3 micron thick ePTFE film was placed between two RCCs, laminated and cured at 190 ° C in a press to obtain tensile modulus, elongation, Tg, peel strength and etching after curing. The thickness of the dielectric layer after the copper foil. The specific ratio and performance are shown in Table 1.

Example 2:

Dissolving bisphenol A epoxy resin (epoxy resin A) and brominated epoxy resin (epoxy resin B) in ethylene glycol methyl ether, and adding ortho-cresol novolac to 0.9 molar ratio relative to epoxy The resin and 2-MI (2-methylimidazole) were then mixed at room temperature to give a gum solution. A 3 μm thick ePTFE film was impregnated with the resulting glue, and then baked in an oven at 155 ° C for 5 minutes to form a B stage, and a prepreg was obtained, and the control resin content was 60%. Next, the prepreg was placed between two copper foils, laminated and cured at 190 ° C in a press to obtain a cured product, and the tensile modulus, elongation, Tg, peel strength, and etching of the copper foil were measured. The thickness of the dielectric layer. The specific ratio and performance are shown in Table 1.

Comparative example 1:

Dissolving bisphenol A epoxy resin (epoxy resin A), brominated epoxy resin (epoxy resin B) and terminal nitrile rubber (resin C) in ethylene glycol methyl ether, and adding 0.9 molar ratio of adjacent The cresol novolac phenolic acid resin and 2-MI (2-methylimidazole) are then mixed at room temperature to obtain a gum solution. The Type E E-glass cloth was impregnated with the above glue, and then baked in an oven at 155 ° C for 5 minutes to form a B-stage, and a prepreg was obtained, and the control resin content was 72%. Next, the prepreg was placed between two copper foils, laminated and cured at 190 ° C in a press to obtain a cured product, and then the tensile modulus, elongation, Tg, peel strength, and etching of the copper foil were measured. The thickness of the dielectric layer. The specific proportion and performance are shown in Table 1.

Comparative Example 2:

Dissolving bisphenol A epoxy resin (epoxy resin A) and brominated epoxy resin (epoxy resin B) in ethylene glycol methyl ether, and adding 0.9 molar ratio of o-cresol novolac resin and 2 -MI (2-methylimidazole), and then mixed at room temperature to obtain a gum solution. Impregnate Type 104 E with the above glue The glass cloth was then baked in an oven at 155 ° C for 5 minutes to form a B-stage to obtain a prepreg having a controlled resin content of 80%. Next, the prepreg was placed between two copper foils, laminated and cured at 190 ° C in a press to obtain a cured product, and then the tensile modulus, elongation, Tg, peel strength, and etching of the copper foil were measured. The thickness of the dielectric layer. The specific ratio and performance are shown in Table 1.

Table 1

Example 3:

The bisphenol A epoxy resin (epoxy resin A), the brominated epoxy resin (epoxy resin B), and the terminal carboxylated nitrile rubber mixture were dissolved in ethylene glycol methyl ether according to the ratio of Example 1, as for the reaction. The solution was also added with a 0.9 molar ratio of o-cresol novolac resin and 2-MI as a curing agent, and then the resulting gum was mixed at room temperature. Then add 40 vol% of the additive barium titanate, mixing After uniformity, the obtained glue was poured on a copper foil, baked in an oven at 155 ° C for 4 minutes, and semi-cured to a B-stage to form an RCC. Next, a 5 micron thick ePTFE film was placed between two RCCs, laminated and cured at 190 ° C in a press. The tensile modulus, elongation, Tg, peel strength, Dk/Df, and flame retardancy were measured after obtaining a cured product, and the results are shown in Table 2.

Comparative Example 3:

The bisphenol A epoxy resin (epoxy resin A), the brominated epoxy resin (epoxy resin B), and the terminal carboxylated nitrile rubber mixture were dissolved in ethylene glycol methyl ether according to the ratio of Example 1, as for the reaction. The solution was also added with a 0.9 molar ratio of o-cresol novolac resin and 2-MI as a curing agent, and then the resulting gum was mixed at room temperature. Then, 40 vol% of the additive barium titanate was added, and the mixture was uniformly mixed. Then, the obtained glue was cast on a copper foil, baked in an oven at 155 ° C for 4 minutes, and semi-cured to form a RCC in the B stage. Next, a 5 μm thick PI film was placed between two RCCs, laminated and cured at 190 ° C in a press. The tensile modulus, elongation, Tg, peel strength, Dk/Df and flame retardancy were measured after obtaining a cured product, and the results are shown in Table 2.

Table 2

The above examples and comparative examples refer to the IPC4101 standard for testing copper clad laminates. The detection methods are as follows:

(1), glass transition temperature (Tg): Dynamic thermomechanical analysis (DMA).

(2), Peel strength (PS): The test conditions are normal.

(3), flammability: Adopt UL-94 test standard.

(4), tensile modulus and elongation: Zwick material tensile testing machine, material testing state is A state.

(5), dielectric '1' energy generation: SPDR (splite post dielectric resonator) method Test, the test condition is A state, l.lGHz.

As can be seen from the results of the above Table 1, the inventive examples 1 and 2 are compared with the comparative examples 1 and 2, and the ePTFE film is used as the supporting material, so that the buried material can be made thinner and has good strength and toughness. Although the commercially available type 104 thin glass cloth was used in Comparative Example 2, the thickness of the final buried material could not be made thinner.

As can be seen from the results of the above Table 2, Example 3 of the present invention is compared with Comparative Example 3, since Example 3 employs a porous ePTFE film having a dielectric constant higher than that of a PI film having no pores. A lot, you can get higher capacitance.

It can be seen from the examples that the porous organic film and the thermosetting resin are used in combination to form a buried material, and the molding temperature is low.

In summary, the buried material of the present invention adopts a porous organic film as a supporting material, which can facilitate the entry of the resin or the filler, so that the buried material becomes a whole, and the internal does not have a series effect, thereby making the capacitance. In addition, a porous organic film is used as a supporting material, and a thermosetting resin is used to prepare a buried material, which has good formability, low molding temperature, process operation cylinder, strength of the prepared buried material, and Excellent impact resistance, avoiding the phenomenon of cracking during etching or drilling, and facilitating the thinning of the buried material.

The above examples are not intended to limit the content of the composition of the present invention, and any minor modifications, equivalent changes and modifications made to the above examples in accordance with the technical spirit or composition of the present invention in parts by weight or amount are still in the present embodiment. Within the scope of the inventive solution.

Claims

Rights request

1. A buried material comprising: a prepreg, a metal foil or a metallized metal foil respectively pressed on both sides thereof, the prepreg comprising a porous organic film and a resin composition adhered thereto by impregnation and drying, and a rubber coating The metal foil includes a metal foil and a resin composition coated thereon.

2. The embedding material according to claim 1, wherein the porous organic film is composed of polyester, polyamine, polyacrylic acid, polyimide, aramid, polytetrafluoroethylene, or syndiotactic polyphenylene. Made of ethylene; the porous organic film is a porous expanded polytetrafluoroethylene film, a porous polyethylene film, a porous polypropylene film, or a porous polyimide film; the porous organic The thickness of the film is 2~50 μ ιη, wherein the pore diameter is 1~500 μ η, and the porosity is 30-98%; the metal foil is copper, brass, aluminum, nickel, or an alloy or composite metal foil of these metals, Its thickness is 12~150 μ ιη.

3. The embedding material according to claim 1, wherein the resin component of the resin composition is an epoxy resin, a cyanate resin, a polyphenylene ether resin, a polybutadiene resin, a styrene-butadiene resin, and a ruthenium resin. One or more of a resin, a polytetrafluoroethylene resin, a polyimide resin, a phenol resin, and an acrylate resin; the resin composition does not include or include a ceramic filler selected from the group consisting of titanium dioxide, silicon dioxide, Alumina, boron nitride, aluminum nitride, barium titanate, barium titanate, barium titanate, barium calcium titanate, zirconium titanate lead ceramic, lead titanate magnesium lead, carbon black, carbon nanotube One or more of triiron tetroxide, metal and metal oxide powders.

A buried material comprising: a porous organic film and a rubberized metal foil pressed on both sides thereof, the rubberized metal foil comprising a metal foil and a resin composition coated thereon.

The buried material according to claim 4, wherein the porous organic film is made of polyester, polyamine, polyacrylic acid, polyimide, aramid, polytetrafluoroethylene, or syndiotactic polyphenylene. Made of ethylene, the porous organic film is a porous expanded polytetrafluoroethylene film, a porous polyethylene film, a porous polypropylene film, or a porous polyimide film; the porous organic The thickness of the film is 2~50 μ ιη, wherein the pore diameter is 1~500 μ η, and the porosity is 30-98%; the metal foil is copper, brass, aluminum, nickel, or an alloy or composite metal foil of these metals, Its thickness is 12~150 μ ιη.

The embedding material according to claim 4, wherein the resin component of the resin composition is an epoxy resin, a cyanate resin, a polyphenylene ether resin, a polybutadiene resin, a styrene-butadiene resin, and a ruthenium resin. One or more of a resin, a polytetrafluoroethylene resin, a polyimide resin, a phenol resin, and an acrylate resin; the resin composition does not include or include a ceramic filler selected from the group consisting of titanium dioxide, silicon dioxide, Alumina, boron nitride, aluminum nitride, barium titanate, barium titanate, barium titanate, One or more of calcium barium titanate, zirconium titanate lead ceramic, lead titanate magnesium lead, carbon black, carbon nanotubes, triiron tetroxide, metal and metal oxide powder.

7. A method of fabricating a buried material according to claim 1, comprising the steps of: Step 1, providing a porous organic film, and a metal foil or a metallized metal foil, and preparing a glue solution of the resin composition;

Step 2: impregnating the porous organic film with the glue solution of the resin composition prepared above, baking and semi-curing to obtain a prepreg;

Step 3. Laminating a metal foil or a metallized metal foil on both sides of the prepreg, and then putting it into a laminating machine to cure by hot pressing, thereby preparing a buried material.

The method of manufacturing a buried material according to claim 7, wherein the porous organic film is made of polyester, polyamine, polyacrylic acid, polyimide, aramid, polytetrafluoroethylene, or Made of a polystyrene, the porous organic film is a porous expanded polytetrafluoroethylene film, a porous polyethylene film, a porous polypropylene film, or a porous polyimide film; The porous organic film has a thickness of 2 to 50 μm, wherein the pores have a pore diameter of 1 to 500 μm and a porosity of 30 to 98%; and the metal foil is copper, brass, aluminum, nickel, or these metals. An alloy or a composite metal foil having a thickness of 12 to 150 μm; the rubberized metal foil is obtained by coating a metal foil with a glue of a resin composition, and baking is semi-cured, the resin composition and the resin composition The resin compositions of the prepreg are the same or different.

9. A method of fabricating a buried material according to claim 4, comprising the steps of: Step 1. providing a metal foil and a porous organic film, and preparing a glue of the resin composition;

The method of manufacturing a buried material according to claim 9, wherein the porous organic film is made of polyester, polyamine, polyacrylic acid, polyimide, aramid, polytetrafluoroethylene, or Made of a polystyrene, the porous organic film is a porous expanded polytetrafluoroethylene film, a porous polyethylene film, a porous polypropylene film, or a porous polyimide film; The porous organic film has a thickness of 2 to 50 μm, wherein the pores have a pore diameter of 1 to 500 μm and a porosity of 30 to 98%; the metal foil is copper, brass, aluminum, nickel, or an alloy of these metals or Composite metal foil with a thickness of 12~150 μm.