WO2012167866A1

WO2012167866A1 - Test arrangement for electrically testing singulated circuit carriers

Info

Publication number: WO2012167866A1
Application number: PCT/EP2012/002091
Authority: WO
Inventors: Rick Anthony Taylor
Original assignee: Epants Gmbh; Feinmetall Gmbh
Priority date: 2011-06-10
Filing date: 2012-05-15
Publication date: 2012-12-13
Also published as: DE202011101848U1

Abstract

The invention relates to a test arrangement (1) for electrically testing singulated circuit carriers (3), in particular in semiconductor technology, which testing is carried out by making electrical touching contact by means of a test card (2), having at least one receiving apparatus (4) for holding at least one circuit carrier (3) in a manner such that the position can be reproduced, wherein the receiving apparatus (4) has a holding member (11) with holding elements (27) for holding the circuit carrier (3), means (13) are provided for elastic deformation at least in regions and for at least partial cancellation of the deformation of the holding member (11) having intrinsic elasticity in such a manner that, on account of the deformation, the clear width between the holding elements (27) is increased to such an extent that the circuit carrier (3) can be inserted between the holding elements (27) and the latter rest against the circuit carrier (3) and fix the latter when the deformation is partially cancelled, and fastening means (45) are present for fastening the receiving apparatus (4) to the test card (2) or a component (7) associated with the test card (2) in such a manner that the position can be reproduced.

Description

Test arrangement for electrical testing of isolated circuit carriers

description

The invention relates to a test arrangement for electrical contact contacting by means of a test card electrical testing of individual circuit carriers, in particular semiconductor technology.

Electronic circuits of semiconductor technology are produced as wafers. These are silicon wafers, on each of which a plurality of such circuits are arranged like a matrix. Often, the wafer's circuitry is tested for electrical performance by a probe card (probe card) before the wafer is split into a single "bare die." For this, the wafer is pressed against test contacts of the probe card in corresponding positions so that the test contacts are touch-contacted Depending on the result of the test, the dies tested as "good" are further processed, ie they are installed or they are packaged, ie provided with a housing. In the case of unpackaged circuits, ie the "bare die", one speaks of "isolated circuit carriers" and in the case of the packaged circuit carriers of "microchips." The occasional circuit carriers are usually rectangular plates, which after the dicing process, which is usually done by sawing, must be contacted individually to test them electrically, which proves to be exceedingly difficult, since the contact distances and the isolated circuit carriers themselves are very small.This is different in the mentioned test of the entire wafer, because In this case, the position of the test cone can be determined very precisely via optical reference points of a camera. Determine the timing of the test card in relation to contacts of the wafer. This procedure is no longer possible after separation, ie in the case of the "bare dies".

Known are so-called "sockets" which receive individual circuit carriers and serve as a holding and contacting device to test the "bare dies" with the same test equipment that is also used for the test of the wafers. These "sockets" are connected via a separate board with the probe card (Probe Card), which, however, brings many problems, since the contact distances are very small and the production of such boards is complicated and complicated and also additional contacts are required to the Test to perform.

The invention is therefore an object of the invention to provide a test arrangement for testing isolated circuit boards, which is simple and inexpensive and allows an uncomplicated and sure-footed test of each "bare dies".

This object is achieved in consideration of the test arrangement mentioned above in that the test arrangement comprises at least one receiving device for position reproducible holding at least one circuit carrier, wherein the receiving device comprises: a holding member with holding elements for holding the circuit carrier, means for at least partially taking place elastic deformation and for the at least partial cancellation of the deformation of the retaining element having its inherent elasticity, such that, due to the deformation, the inside width between the retaining elements increases to such an extent that the circuit carrier is inserted between the retaining elements. is settable and invest in the partial abolition of the deformation of the circuit board and fix it, and with fastening means for position reproducible fastening of the recording device to the test card or one of the test card assigned component. The receiving device serves to hold positionally accurate at least one circuit carrier so that it can be subjected to an electrical test by means of the probe card (Probe Card). The holding of the circuit carrier to the receiving device is carried out according to the invention by means of the holding member of the receiving device, which is designed as a solid-state spring. This means that the holding member has inherent inherent elasticity of its material, which is used to keep the isolated circuit carrier exciting. The existing due to the inherent elasticity spring action of the holding member is therefore used to clamp the circuit carrier between the holding elements of the holding member. According to the invention means are provided which make the elastic deformation of the holding member or at least a portion of the holding member in order to increase the clear width between the holding elements so far that the circuit carrier can be inserted between the holding elements. Subsequently, the mentioned means for a cancellation of the deformation provide such that by resiliency of the holding member, the holding elements receive the circuit substrate clamped between them. Now there is a reproducible position of the circuit substrate to be tested, so that an accurate contacting of electrical contacts (pads) of the circuit substrate by means of test contacts of the test card is possible. After carrying out the test, the means are used again, which deform the holding member, ie the solid spring, again so elastically that the width between the holding elements 201

4

th enlarged so far that the circuit carrier can be removed. The use of the inherent elasticity of the holding member for holding and exact positioning of the at least one circuit carrier requires no complex holding and Spannmechani- ken and insofar also no moving parts whose ever-existing tolerances could add up. In addition, due to the inventive design no place for the mentioned mechanisms is required, whereby the test arrangement according to the invention can be built very small and also the possibility exists to clamp not only a single circuit substrate, but several, then in the same test cycle a electrical test can be subjected. In a single process step, several circuit carriers can then be positioned and, in particular, contacted one after the other by means of the test card and thereby tested by means of a test device connected to the test card. As a test card is preferably a device is used, which is used in the same way for the testing of wafers, so of not yet isolated circuit carriers. Preferably, it may be necessary to provide that the test card is not used with its test contacts pointing downwards, as is the case when testing wafers, but rather that the test card is pivoted in its test device by 180 ° so that the contact tips of the test contacts point upwards. The receiving device can now be supplied from above to the test card in order to carry out the test.

According to a development of the invention, it is provided that the holding elements lie on a first side of the holding member and that the means lie on a second side of the holding member opposite the first side. For the inclusion of the at least one single circuit carrier, the holding elements are arranged on the first side of the holding member, in particular formed. In order to displace these holding elements by the elastic deformation of the holding member, such that a circuit carrier can be inserted or removed, the mentioned means engage on one side of the holding member, which lies opposite the first side. Are the holding elements thus on the first side of the support member, which forms, for example, a front, so are the means for elastic deformation on the second side, namely the back of the support member. The lying between the front and the back material of the holding member thus forms the solid-state spring. If no force is applied to deform, then the holding member is due to the solid state spring property in rest position or the resetting takes place so far that the holding elements hold the circuit board between them by clamping due to the inherent elasticity. If in the course of this application is spoken of a deformation of the holding member, the deformation may affect the entire holding member or at least a portion of the holding member. According to a development of the invention it is provided that the holding elements are fixedly attached to the holding member or formed integrally on the holding member. Since the "body" of the holding member forms the spring action of the solid-state spring due to its material elasticity, the holding elements can be fixedly attached to the holding member, yet their required for receiving, clamping and releasing the at least one circuit substrate displacement due to the elastic deformation of this "body" is possible. Should separate holding elements be used, which are not formed integrally with the material of the holding member are, they are to be firmly connected by suitable techniques with the holding member. Alternatively and preferably, however, it is provided that the holding elements are integrally formed on the holding member, that is, a material-uniform structure is present. The holding elements may preferably be formed by retaining walls of the holding member. These retaining walls are fine structures, for example, web-like structures of the support member or at least one recess of the holding member, ie, a circuit carrier to be positioned is inserted into the recess and the recess walls practice a holding pressure / clamping pressure when canceling the elastic deformation the circuit carrier, so that it is held position reproducible.

The holding member is preferably designed as a holding plate. For elastic deformation, the means exert at least one force on the retaining plate. This force leads to a deformation of the holding plate or at least a portion of the holding plate and on the deforming by the deforming contour of the holding member, the holding elements are "moved", which increase the clearance between them by the new shape, so that between them the circuit carrier As soon as the means relieve the retaining plate, it will, due to the inherent solid-state spring, move back somewhat in the direction of its original shape, with the result that the retaining elements move towards one another, thereby clamping the circuit carrier between them Once the test has been carried out, a stronger deformation of the holding plate is again brought about by the means, whereby the holding elements remove the circuit stress. release ger and a removal of the tested circuit substrate can be done.

The holding member is made of a material that allows the mentioned elastic deformation and that due to the spring action always moves back to the original shape state. In particular, it is provided that the holding member consists of a suitably suitable plastic.

According to a development of the invention, it is provided that the means have at least one transversely, in particular at right angles, to the plane of the holding plate, belonging to this holding plate web and at least one holding plate web for deforming laterally acted upon by a force actuator. In order to carry out the deforming of the holding member taking place at least partially, the at least one holding plate web is preferably provided. This belongs to the holding plate, so it is attached to it, but preferably of the same material, so in one piece, with the holding member, in particular the holding plate formed. It runs transversely to the plane of the retaining plate, in particular at right angles to it. If such a holding plate web is laterally acted upon by a force, this leads to a deformation of the region of the holding member from which the holding plate web proceeds. The mentioned force, which acts laterally on the holding plate web to "tilt" it and thereby bring about the mentioned elastic deformation, takes place by means of the mentioned actuating element Seitenkraftbeaufschlagung of the holding plate web performs a suitable displacement to the clamping or releasing the isolated circuit substrate to enable. In particular, it is provided that the holding elements on the first side of the holding member, for example on the front, and the holding plate web is located on the second side of the holding member which is opposite the first side, in particular a back of the holding member, in particular the holding plate forms.

According to a development of the invention, it is preferably provided that the actuating element has a control surface extending at an acute angle to the direction of extension of the retaining plate web, and / or that the retaining plate web is acted upon by the actuating element at an acute angle to the extension direction of the actuating element Control surface is provided. If the actuating element is displaced to bring about a deformation of the holding member, namely moved in the direction of the holding member or moved away from the holding member, the control surface or so leads the control surfaces to the side of the holding plate web is subjected to a force and therefore caused to tilt, which brings the mentioned elastic deformation of the holding member or at least a portion of the holding member with it.

The actuating element is - as already indicated above - arranged transversely, in particular at right angles, displaceable to the plane of the retaining plate. In particular, a reciprocally displaceable punch is provided, on which the actuating element is arranged or formed. By shifting the plunger back and forth, the actuating element acts on the retaining plate web with the consequence of the corresponding elastic deformation of the retaining element. In particular, the stamp is biased by means of a spring device in its direction of the deformation of the support member reversing direction. This has the consequence that the stamp has the desire to always return to its original position. In particular, it can be provided that the holding elements overhang a holding station for holding the circuit carrier. The "veranden" does not mean that the circuit carrier must be received on all sides and without gaps of holding elements, because it is particularly sufficient if, for example, in a rectangular shape of the circuit substrate each side of the rectangle of at least one holding element is applied in regions, Thus, the respective holding element does not have to extend over the entire side length of the associated rectangle side, and there can also be several holding elements on at least one side of the circuit carrier and / or corresponding holding elements are provided which only and / or also in the corner areas In other words, in order to be able to test a plurality of isolated circuit carriers simultaneously in one test cycle, it is provided in particular that the holding member has a plurality of holding stations for holding a plurality of scs holding bearers. These are held in a similar manner, as explained above. The fastening means have at least one quick-release device for clamping fastening of the receiving device to the test card or to the component. The fasteners, which are a positional make reproducible attachment of the recording device to the probe card or on the component associated with the test card, should preferably be very easy and fast tensioned and released after the test again. The mentioned quick-clamping device allows a Spannbefestigung the mentioned parts to each other, which in particular can only be tensioned by means of a single handle and in turn can be solved again only with a single handle.

A development of the invention provides that the test card has test contacts which are urged against electrical contacts of the circuit carrier by clamping the quick-release device. The quick-release device thus not only serves to clamp the receiving device and probe card or component, but also leads to the electrical test contact of the test card with the electrical contacts of the circuit carrier, ie to build up contacting forces.

In order to enable a positionally accurate association of recording device and probe card or recording device and component, the fastening means preferably have alignment pins which enter into corresponding, highly accurate holes, whereby the alignment function takes place.

The mentioned construction part associated with the test card is preferably attached to the test card, in particular screwed to the test card. The receiving device is then not fed directly to the test card for carrying out the test, but instead is positively attached to the component. mounted onsreproduzierbar to perform the electrical contact Kontakt- tion.

In particular, the quick release device has at least one clamping hook with clamping lever. The clamping lever allows pivoting of the clamping hook such that it engages behind a corresponding counter element and clamped in this way recording device and probe card or recording device and component.

Finally, it is advantageous if the holding plate has at least one material recess area and / or breakthrough that supports its deformability. In order to influence the elasticity of the solid spring, so the holding member in the desired manner, it is preferably provided to the holding member at a suitable location or at suitable locations with at least one Materialvertiefungsbe- rich and / or at least one breakthrough to provide. In this way, a correspondingly influenced elastic deformation will set in order to optimally hold the at least one isolated circuit carrier and release it again.

The drawings illustrate the invention by means of an embodiment, in which:

FIG. 1 is a perspective view of a test arrangement;

FIG. 2 shows a plan view of the test arrangement of FIG. 1,

FIG. 3 shows a side view of the test device of FIG. 1, 4 is a bottom view of a receiving device of the test arrangement and an enlarged view of an electrically tested, isolated circuit substrate,

Figure 5 is a sectional view through the test arrangement of the figure

1 and

FIG. 6 shows an enlarged detailed representation of a region K marked in FIG.

FIGS. 1 to 6 show a test arrangement 1 for electrical testing of a singulated circuit carrier 3 of the semiconductor technology by electrical contact contacting by means of a test card 2.

According to FIG. 1, the test arrangement 1 has a receiving device 4 which can be fastened to a component 7 by means of fastening means 45, which are designed as quick-release devices 5. The component 7 is in particular a base plate 6, which is associated with the probe card 2. In particular, the component 7 with the probe card 2 both screwed and - pinned - for accurate positioning.

The test card 2 is a so-called V-Probe Card, that is to say a test device with vertical test contacts designed as test needles, the test probes of these test contacts pointing downwards while the wafer is being tested and the wafer against the test probes from below is urged to touch contact. For the case relevant here, isolated circuit carriers, ie to check "bare dies", there is the test card 2 in a rotated by 180 ° position, so that the probes of the test needles point upwards and supplied from above the receiving device 4 and fixed by means of the quick release device 5 for performing a test. The test card 2 can be stored accordingly for the purpose of 180 ° turn. At least one isolated circuit carrier 3 is accommodated in the receiving device 4 so that, during clamping by means of the quick-action clamping device 5, the test probes of the test contacts of the test card 2 come against electrical contacts of the circuit substrate 3 to be tested and by means of a suitable test peripheral which is connected to the test card 2 (not shown) an electrical function test can be performed.

The test arrangement 1 will be described in more detail below.

According to FIG. 5, the base plate 6 has on its underside 8 a recess 9, into which the probe card 2 protrudes during the test. By means of suitable fastening screws (not shown) and pins 10 (only one pin 10 is shown in Figure 5), the base plate 6 is secured to the exact position of the probe card 2. The receiving device 4, which serves for temporarily receiving at least one separated circuit carrier 3, has a holding member 11, a base holder 12, the quick-action clamping device 5 and means 13 for elastically deforming at least one region of the holding member 11. Retaining member and base holder 12 are fastened to one another by means of threaded screws 14 and pinned together for positionally accurate alignment with one another (not shown).

The base holder 12 has an annular flange 15, in the interior 16 of a punch 17 in the axial direction (double arrow 17 ') displaced is guided. A trained as a hand knob 18 screw member 19 is held by means of a bayonet connection 20 on the outside of the annular flange 15, wherein an inner side 21 of the screw member 19 a top 22 of the punch 17 acts. By means of a spring device 23 which is formed as a helical compression spring 24 and which is supported at one end to the base holder 12 and the other end abuts against a support surface of the punch 17, this is in the axial direction 17 'with its top 22 against the bottom 21 of the Screw member 19 urged. According to Figures 4, 5 and 6, the holding member 11 is plate-shaped. It therefore forms a holding plate 25. The holding plate 25 has on its side facing away from the punch 17 a recess 26 in which holding elements 27 are arranged. In the illustrated embodiment, there are a total of six Halteele- elements 27, wherein each three are arranged according to Figure 4 approximately U-shaped to each other, so that a total of a holding station 28 is bordered, which - as indicated in Figure 4 - the circuit carrier 3 can record. Each two holding elements 27 abut on the long sides 29 and one holding element 27 on the narrow sides 30 of the rectangular, plate-shaped, isolated circuit carrier 3 and hold them reproducibly in position. In the figure 4, the circuit substrate 3 is shown enlarged on the one hand and on the other hand in original size, inserted into the receiving device 4. The enlarged view of the circuit substrate 3 shows that it is provided with a plurality of electrical contacts 31. According to the enlargement of FIG. 6, it can be seen that the holding elements 27 are located on a first side 32 of the holding plate 25. In the illustrated embodiment, the holding means 27 are formed by preferably triangular in cross-section retaining walls 33, wherein each retaining wall 33 has a wall surface 34 which points in the direction of the stopping place 28. The retaining walls 33 project beyond the base of the recess 26, ie, the circuit carrier 3 is supplied to the holding station 28, he finds place between the holding elements 27, and this is apparent in particular from Figures 4 and 6.

The holding plate 25 has according to Figures 5 and 6 on a second side 35, which is opposite to the first side 32, holding plate webs 36, which lie in opposition or approximately in opposition to the holding elements 27. Preferably, therefore, six retaining plate webs 36 are also provided. The holding plate webs 36 lie within a recess 37 which is formed on the second side 35 of the holding plate 25 and are connected to the bottom of the recess 37 and thus formed integrally on the holding member 11. They run in the axial direction (double arrow 17 ') and are provided at their free ends with inclined control surfaces 38. It can be clearly seen from FIGS. 5 and 6 that the punch 17 has axially (double arrow 17 ') in the direction of the holding member 11 facing actuator 39, which are finger-shaped and have at their free ends obliquely extending control surfaces 40. According to FIG. 6, holding plate webs 36 and actuating elements 39 assigned to each other are located laterally against one another such that the control surfaces 38 and 40 can cooperate. According to FIG. 6, the holding member 1 can have at least one opening 46, which influences the elasticity of this component in the desired manner.

The fastening means 45 embodied as a quick-release device 5 are apparent in particular from FIGS. 1 and 3. It can be seen that it has a U-shaped clamping lever 41, the end is connected with clamping hooks 42 in connection, wherein the quick-clamping device 5 in the region of the clamping hooks 42 by means of bearing pins 43 is pivotally mounted on the base holder 12. The clamping hooks 42 can cooperate with stud bolts 44, which protrude laterally from the base plate 6.

In order to carry out a test of a separated circuit carrier 3, the receiving device 4 is used for receiving the circuit substrate 3 to be tested. The receiving device 4 is located in a removed from the probe card 2 and the base plate 6 position so that their bottom is accessible according to Figure 4. An operator operates the hand knob 3 so that due to the bayonet connection 20 of the punch 17 is depressed. The rotational movement of the hand knob 18 thus leads to an axial displacement, so that its underside 21, the top 22 of the punch 17 is applied and this is moved against the force of the helical compression spring 24 in the direction of the support member 11. By doing while sliding along the control surfaces 38 and 40, the holding plate webs 36 are applied laterally and tilted towards each other, with the result that at least the material region of the holding plate 25, from which the holding plate webs 36 emanate, is elastically deformed such that on The holding elements 27 located on the other side of the holding plate 25 perform an opposite movement, ie, they shift away from one another, with the result that the clear width between them is increased such that the circuit carrier 3 can be inserted between the holding elements 27. Now, the operator turns the hand knob 18 back, whereby the punch 17 is released so that he - pushed by the helical compression spring 24 - comes back into the starting position, and the holding plate webs 36 are no longer acted upon by the actuating elements 39 side, with the result that due to the inherent elasticity of the holding member 11, the holding elements 27 to move toward each other, so far until their wall surfaces 34 against the longitudinal sides 29 and narrow sides 30 of the circuit substrate. 3 lay. As a result, the circuit carrier 3 is clamped in a reproducible position. Now, the operator sets the recording device

4 on the base plate 6, wherein a positionally accurate assignment by means of alignment pins (not shown) is brought about. Now, the operator pivots the clamping lever 41 of the quick-release device 5 such that the clamping hooks 42 capture the stud bolts 44, whereby the receiving device 4 is urged in the direction of the probe card 2 and thereby the test contacts the probe card 2 against the electrical contacts 31 of the circuit substrate. 3 to step. Now, by means of the test card 2 connected to a test peripheral, an electrical test of the circuit substrate 3 can be carried out. Depending on the test result, the circuit carrier 3 is classified as electrically "in order" or electrically "out of order". To remove the circuit substrate 3 from the test arrangement 1, the quick-release device is initially

5 solved. Then, the hand knob 18 is actuated, so that the holding elements 27 release the circuit carrier 3 by a corresponding elastic deformation of the holding member 11 and the removal is possible. In this state, a new circuit carrier 3 can be inserted into the holding space 28, etc.

FIGS. 1 to 6 and the above description assume that the receiving device 4 has only one holding station 28 for a circuit carrier 3. Of course, it is also possible that in another embodiment, several holding places 28 are provided for the common testing of multiple circuit carriers 3. The above description and the figures are valid accordingly.

The invention is based in particular on the principle of the above-mentioned solid-state spring, that is, the elasticity of the holding member 11 or at least a portion of the holding member 11 is used to hold a circuit substrate 3 to be tested by elastically deforming and partially reversing the deformation. This approach allows for very tight tolerances. Furthermore, the invention requires no additional, separate board to bring about a connection to the sample card (probe card), but the contact is made directly with the probe card 2. Due to the procedure according to the invention can be without any problems contact distances of down to 75 pm and smaller perfectly to contact.

Claims

claims

1 . Test arrangement (1) for the electrical contact contacting by means of a test card (2) electrical testing of isolated circuit carriers (3) in particular semiconductor technology, with at least one receiving device (4) for position reproducible holding at least one circuit carrier (3), wherein the receiving device (4) comprises:

- A holding member (1 1) with holding elements (27) for holding the circuit substrate (3), - means (13) for at least partially taking place elastic deformation and at least partially cancel the deformation of an inherent elasticity holding member (1 1), in such, that due to the deformation, the inside width between the holding elements (27) increases to such an extent that the circuit carrier (3) can be inserted between the holding elements (27) and bear against the circuit carrier (3) when the deformation is partially canceled fix, and with fastening means (45) for position reproducible fastening of the receiving device (4) on the probe card (2) or one of the probe card (2) associated component (7).

2. Test arrangement according to claim 1, characterized in that the holding elements (27) on a first side (32) of the holding member (1 1) and that the means (13) on one of the first side (32) opposite the second side (35) of the holding member (1 1) lie.

3. Test arrangement according to one of the preceding claims, characterized in that the holding elements (27) are fixedly attached to the holding member (11) or integrally formed on the holding member (11).

4. Test arrangement according to one of the preceding claims, characterized in that the holding elements (27) of retaining walls (33) of the holding member (11) are formed.

5. Test arrangement according to one of the preceding claims, characterized in that the holding member (11) is designed as a holding plate (25).

6. Test arrangement according to one of the preceding claims, characterized in that the holding member (11) consists of plastic.

7. Test arrangement according to one of the preceding claims, characterized in that the means (13) at least one transversely, in particular at right angles, to the plane of the holding plate (25) extending, belonging to this holding plate web (36) and at least one holding plate web (36) for the deforming laterally with a force acting actuator (39).

8. Test arrangement according to one of the preceding claims, characterized in that the actuating element (39) extending to the extension direction of the holding plate web (36) at an acute angle, the holding plate web (36) acting on the control surface (40) and / or that the holding plate web ( 36) with one at an acute angle to the direction of extension of the actuating element (36) extending, by the actuating element (39) acted upon control surface (38) is provided.

9. Test arrangement according to one of the preceding claims, characterized in that the actuating element (39) transversely, in particular at right angles, to the plane of the holding plate (25) is arranged displaceably.

10. Test arrangement according to one of the preceding claims, characterized in that the actuating element (39) on a reciprocally displaceable punch (17) is arranged or formed.

11. Test arrangement according to one of the preceding claims, characterized in that the punch (17) is acted upon for its reciprocation by a screw member (19) which carries out a reciprocating displacement causing feed movement during a screwing movement.

12. Test arrangement according to one of the preceding claims, characterized in that the punch (17) by means of a spring device (23) is biased in a direction of the deformation of the holding member (11) reversing direction.

13. Test arrangement according to one of the preceding claims, characterized in that the holding elements (27) a holding place (28) for holding the circuit substrate (3) bound.

14. Test arrangement according to one of the preceding claims, characterized in that the holding member (11) has a plurality of holding space (28) for holding a plurality of circuit carriers (3).

15. Test arrangement according to one of the preceding claims, characterized in that the fastening means (45) have at least one quick-release device (5) for clamping fastening of the receiving device (4) on the probe card (2) or on the component (7).

16. Test arrangement according to one of the preceding claims, characterized in that the test card (2) has test contacts which are urged against electrical contacts (31) of the circuit carrier (3) by tensioning the quick-clamping device (5).

17. Test arrangement according to one of the preceding claims, characterized in that the fastening means (45) have alignment pins.

18. Test arrangement according to one of the preceding claims, characterized in that the component (7) attached to the probe card (2), in particular screwed to the probe card (2) is.

19. Test arrangement according to one of the preceding claims, characterized in that the quick-clamping device (5) has at least one clamping hook (42) with clamping lever (41).

20. Test arrangement according to one of the preceding claims, characterized in that the holding plate (25) has at least one of their deformability supporting material recess region (recess 26, recess 37) and / or opening (46).