WO2012177890A4 - High voltage isolation of an inductively coupled plasma ion source with a liquid that is not actively pumped - Google Patents

High voltage isolation of an inductively coupled plasma ion source with a liquid that is not actively pumped Download PDF

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Publication number
WO2012177890A4
WO2012177890A4 PCT/US2012/043563 US2012043563W WO2012177890A4 WO 2012177890 A4 WO2012177890 A4 WO 2012177890A4 US 2012043563 W US2012043563 W US 2012043563W WO 2012177890 A4 WO2012177890 A4 WO 2012177890A4
Authority
WO
WIPO (PCT)
Prior art keywords
fluid
plasma chamber
plasma
heat pipe
heat
Prior art date
Application number
PCT/US2012/043563
Other languages
French (fr)
Other versions
WO2012177890A3 (en
WO2012177890A2 (en
Inventor
Sean Kellogg
Andrew B. WELLS
James B. Mcginn
N. William Parker
Mark W. Utlaut
Original Assignee
Fei Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fei Company filed Critical Fei Company
Priority to CN201280030689.1A priority Critical patent/CN103843107B/en
Priority to JP2014517167A priority patent/JP6085596B2/en
Priority to US14/128,030 priority patent/US9591735B2/en
Priority to EP12802095.5A priority patent/EP2724359B1/en
Publication of WO2012177890A2 publication Critical patent/WO2012177890A2/en
Publication of WO2012177890A3 publication Critical patent/WO2012177890A3/en
Publication of WO2012177890A4 publication Critical patent/WO2012177890A4/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J27/00—Ion beam tubes
    • H01J27/02—Ion sources; Ion guns
    • H01J27/16—Ion sources; Ion guns using high-frequency excitation, e.g. microwave excitation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
    • H01J37/08—Ion sources; Ion guns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/002—Cooling arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/06—Sources
    • H01J2237/061—Construction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/06—Sources
    • H01J2237/08—Ion sources
    • H01J2237/0815—Methods of ionisation
    • H01J2237/0817—Microwaves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/31749—Focused ion beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
    • H05H1/4645—Radiofrequency discharges
    • H05H1/4652—Radiofrequency discharges using inductive coupling means, e.g. coils

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electromagnetism (AREA)
  • Combustion & Propulsion (AREA)
  • Plasma Technology (AREA)
  • Electron Sources, Ion Sources (AREA)

Abstract

An inductively-coupled plasma source for a focused charged particle beam system includes a plasma chamber and a fluid that is not actively pumped surrounding the plasma chamber for providing high voltage isolation between the plasma chamber and nearby parts which are at ground potential, such as a conductive shield. One or more cooling devices cool the plasma chamber by using evaporative cooling and heat pipes to dissipate the heat from the plasma chamber into a surrounding environment.

Claims

AMENDED CLAIMS received by the International Bureau on 28 March 2013 (28.03.13)
1. A charged particle beam system, comprising:
a plasma source having:
a plasma chamber having a wall composed of a dielectric material, the wall having an interior surface and an exterior surface;
a conductor coiled at least one time around the plasma chamber; a fluid surrounding and in thermal contact with at least a portion of the plasma chamber, in which the fluid is not actively pumped; and
a source electrode for electrically biasing the plasma to a high voltage;
one or more focusing lenses for focusing charged particles from the plasma source onto a sample; and
at least one heat pipe containing a dissipating fluid, a portion of the at least one heat pipe is in thermal contact with the fluid such that heat from the fluid can dissipate through the at least one heat pipe to cool the fluid, said dissipating fluid being separate from the fluid surrounding and in thermal contact with at least a portion of the plasma chamber.
2. The charged particle beam system of claim 1 in which a portion of the fluid is positioned between the plasma chamber and the conductor.
3. The charged particle beam system of claim 1 in which the fluid has a dielectric constant greater than 5.
4. The charged particle beam system of claim 1 in which the fluid comprises water or a fluorine compound.
5. The charged particle beam system of claim 1 further comprising a conductive shield positioned between the plasma chamber and the conductor, at least a portion of the fluid positioned between the plasma chamber and the conductive shield.
6. The charged particle beam system of claim 5 further comprising at least one cooling device for cooling the fluid.
7. The charged particle beam system of claim 6 in which the at least one cooling device comprises a thermoelectric cooler.
8. Cancelled.
9. The charged particle beam system of claim 1, further comprising a cooling fin in thermal contact with the at least one heat pipe, the cooling fin for dissipating heat from the at least one heat pipe and transferring the heat into a surrounding environment.
10. Cancelled.
11. A method of maintaining a plasma source, comprising:
providing a plasma chamber for containing a plasma;
providing radio frequency energy to the plasma chamber from a radio frequency coil; providing a conductive shield between the coil and the plasma chamber; and providing a fluid between the conductive shield and the plasma chamber; wherein the fluid provides high voltage isolation of the plasma chamber and the fluid is not actively pumped.
12. The method of claim 11 further comprising providing at least one cooling device in thermal contact with the plasma chamber for cooling the plasma chamber..
13. The method of claim 12 in which providing at least one cooling device comprises providing a cooling tube for circulating a cooling fluid or a thermoelectric cooler.
14. The method of claim 11 in which providing a fluid between the conductive shield and the plasma chamber comprises providing water or a fluorine compound.
15. The method of claim 11 further comprising providing a heat pipe for cooling the plasma chamber, in which a pojtjon of the heat pipe is in thermal contact with the fluid.
16. The method of claim .15 in which a portion of the fluid between the conductive shield and the plasma chamber is evaporated to produce a vapor, the heat from the vapor being dissipated by the heat pipe and transferred to a surrounding environment to cool the plasma chamber.
17. A method of providing high voltage isolation to a plasma source of a charged particle beam system, comprising:
directing energy to maintain a plasma in a plasma chamber;
conducting heat from the wall of the plasma chamber to a fluid, a portion of the fluid in thermal contact with the wall of the plasma chamber; and
cooling the fluid by evaporating a portion of the fluid by heat from the plasma chamber creating a vapor, the heat from the vapor being dissipated by a heat pipe into a surrounding environment, a portion of the vapor within the heat pipe condensing to its liquid state as the heat from the vapor is being dissipated into the surrounding environment and flows back into the jacket.
18. The method of claim Ί 7 in which the fluid is not actively pumped.
19. The method of claim 17 in which the fluid is maintained in a jacket surrounding the plasma chamber, the jacket connected to the heat pipe such that a portion of the vapor rises through the heat pipe.
20. Cancelled.
PCT/US2012/043563 2011-06-21 2012-06-21 High voltage isolation of an inductively coupled plasma ion source with a liquid that is not actively pumped WO2012177890A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201280030689.1A CN103843107B (en) 2011-06-21 2012-06-21 The high_voltage isolation of inductively coupled plasma ion source and the liquid actively not pumped
JP2014517167A JP6085596B2 (en) 2011-06-21 2012-06-21 High voltage isolation of plasma ion sources using liquids that do not actively flow out.
US14/128,030 US9591735B2 (en) 2011-06-21 2012-06-21 High voltage isolation of an inductively coupled plasma ion source with a liquid that is not actively pumped
EP12802095.5A EP2724359B1 (en) 2011-06-21 2012-06-21 High voltage isolation of an inductively coupled plasma ion source with a liquid that is not actively pumped

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/165,556 2011-06-21
US13/165,556 US8642974B2 (en) 2009-12-30 2011-06-21 Encapsulation of electrodes in solid media for use in conjunction with fluid high voltage isolation

Publications (3)

Publication Number Publication Date
WO2012177890A2 WO2012177890A2 (en) 2012-12-27
WO2012177890A3 WO2012177890A3 (en) 2013-05-02
WO2012177890A4 true WO2012177890A4 (en) 2013-06-20

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2012/043563 WO2012177890A2 (en) 2011-06-21 2012-06-21 High voltage isolation of an inductively coupled plasma ion source with a liquid that is not actively pumped

Country Status (5)

Country Link
US (2) US8642974B2 (en)
EP (1) EP2724359B1 (en)
JP (1) JP6085596B2 (en)
CN (1) CN103843107B (en)
WO (1) WO2012177890A2 (en)

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US20150102230A1 (en) 2015-04-16
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EP2724359A2 (en) 2014-04-30
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