WO2013005155A3 - Apparatus for treating a wafer-shaped article - Google Patents

Apparatus for treating a wafer-shaped article Download PDF

Info

Publication number
WO2013005155A3
WO2013005155A3 PCT/IB2012/053350 IB2012053350W WO2013005155A3 WO 2013005155 A3 WO2013005155 A3 WO 2013005155A3 IB 2012053350 W IB2012053350 W IB 2012053350W WO 2013005155 A3 WO2013005155 A3 WO 2013005155A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
process chamber
shaped article
closed process
treating
Prior art date
Application number
PCT/IB2012/053350
Other languages
French (fr)
Other versions
WO2013005155A2 (en
Inventor
Karl-Heinz Hohenwarter
Original Assignee
Lam Research Ag
Lam Research Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Ag, Lam Research Corporation filed Critical Lam Research Ag
Priority to KR1020147000452A priority Critical patent/KR102007546B1/en
Publication of WO2013005155A2 publication Critical patent/WO2013005155A2/en
Publication of WO2013005155A3 publication Critical patent/WO2013005155A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Abstract

An apparatus for processing wafer-shaped articles comprises a closed process chamber, a chuck located within the closed process chamber, and at least one process liquid dispensing device disposed within the chamber. The closed process chamber comprises a lid that can be opened to position a wafer-shaped article within the closed process chamber. The lid incorporates a heater adapted to heat a wafer-shaped article positioned in the closed process chamber.
PCT/IB2012/053350 2011-07-07 2012-07-02 Apparatus for treating a wafer-shaped article WO2013005155A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020147000452A KR102007546B1 (en) 2011-07-07 2012-07-02 Apparatus for treating a wafer-shaped article

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/178,430 US20130008602A1 (en) 2011-07-07 2011-07-07 Apparatus for treating a wafer-shaped article
US13/178,430 2011-07-07

Publications (2)

Publication Number Publication Date
WO2013005155A2 WO2013005155A2 (en) 2013-01-10
WO2013005155A3 true WO2013005155A3 (en) 2015-08-06

Family

ID=47437509

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2012/053350 WO2013005155A2 (en) 2011-07-07 2012-07-02 Apparatus for treating a wafer-shaped article

Country Status (4)

Country Link
US (1) US20130008602A1 (en)
KR (1) KR102007546B1 (en)
TW (1) TWI569345B (en)
WO (1) WO2013005155A2 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8926788B2 (en) * 2010-10-27 2015-01-06 Lam Research Ag Closed chamber for wafer wet processing
KR101501362B1 (en) 2012-08-09 2015-03-10 가부시키가이샤 스크린 홀딩스 Substrate processing apparatus and substrate processing method
KR101512560B1 (en) 2012-08-31 2015-04-15 가부시키가이샤 스크린 홀딩스 Substrate processing apparatus
KR102091291B1 (en) 2013-02-14 2020-03-19 가부시키가이샤 스크린 홀딩스 Substrate processing apparatus and substrate processing method
US10132309B2 (en) * 2013-03-15 2018-11-20 Integrated Designs, L.P. Apparatus and method for the remote monitoring, viewing and control of a semiconductor process tool
US10043686B2 (en) * 2013-12-31 2018-08-07 Lam Research Ag Apparatus for treating surfaces of wafer-shaped articles
DE102014105300A1 (en) * 2014-03-12 2015-09-17 Von Ardenne Gmbh Processing arrangement and method for operating a processing arrangement
JP6329428B2 (en) * 2014-05-09 2018-05-23 東京エレクトロン株式会社 Substrate processing apparatus, deposit removal method for substrate processing apparatus, and storage medium
WO2015200511A1 (en) * 2014-06-24 2015-12-30 Virsec Systems, Inc. System and methods for automated detection of input and output validation and resource management vulnerability
US10816901B2 (en) * 2014-09-16 2020-10-27 Acm Research (Shanghai) Inc. Coater with automatic cleaning function and coater automatic cleaning method
US20160376702A1 (en) * 2015-06-26 2016-12-29 Lam Research Ag Dual mode chamber for processing wafer-shaped articles
US10534907B2 (en) * 2016-12-15 2020-01-14 Sap Se Providing semantic connectivity between a java application server and enterprise threat detection system using a J2EE data
CN116504702B (en) * 2023-06-26 2023-09-05 山东联高智能科技有限公司 Semiconductor element processing equipment

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5595241A (en) * 1994-10-07 1997-01-21 Sony Corporation Wafer heating chuck with dual zone backplane heating and segmented clamping member
US5861609A (en) * 1995-10-02 1999-01-19 Kaltenbrunner; Guenter Method and apparatus for rapid thermal processing
US6331212B1 (en) * 2000-04-17 2001-12-18 Avansys, Llc Methods and apparatus for thermally processing wafers
US6375746B1 (en) * 1998-07-10 2002-04-23 Novellus Systems, Inc. Wafer processing architecture including load locks
US20020195128A1 (en) * 2001-06-22 2002-12-26 S.E.S. Company Limited Single wafer type substrate cleaning method and apparatus
US6770424B2 (en) * 2002-12-16 2004-08-03 Asml Holding N.V. Wafer track apparatus and methods for dispensing fluids with rotatable dispense arms
WO2004084278A1 (en) * 2003-03-20 2004-09-30 Sez Ag Device and method for wet treating disc-shaped articles
US7187002B2 (en) * 2004-02-02 2007-03-06 Matsushita Electric Industrial Co., Ltd. Wafer collective reliability evaluation device and wafer collective reliability evaluation method

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JPH01134932A (en) * 1987-11-19 1989-05-26 Oki Electric Ind Co Ltd Cleansing process and clarifier of substrate
US5464480A (en) * 1993-07-16 1995-11-07 Legacy Systems, Inc. Process and apparatus for the treatment of semiconductor wafers in a fluid
US6232248B1 (en) * 1998-07-03 2001-05-15 Tokyo Electron Limited Single-substrate-heat-processing method for performing reformation and crystallization
US20020096196A1 (en) * 2001-01-23 2002-07-25 Takayuki Toshima Substrate processing apparatus and substrate processing method
JP4343022B2 (en) * 2004-05-10 2009-10-14 東京エレクトロン株式会社 Substrate processing method and substrate processing apparatus
US20070289534A1 (en) * 2006-05-30 2007-12-20 Applied Materials, Inc. Process chamber for dielectric gapfill
CN101809717B (en) * 2007-09-25 2012-10-10 朗姆研究公司 Temperature control modules for showerhead electrode assemblies for plasma processing apparatuses
WO2009117612A2 (en) * 2008-03-21 2009-09-24 Applied Materials, Inc. Shielded lid heater assembly
US8926788B2 (en) * 2010-10-27 2015-01-06 Lam Research Ag Closed chamber for wafer wet processing

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5595241A (en) * 1994-10-07 1997-01-21 Sony Corporation Wafer heating chuck with dual zone backplane heating and segmented clamping member
US5861609A (en) * 1995-10-02 1999-01-19 Kaltenbrunner; Guenter Method and apparatus for rapid thermal processing
US6375746B1 (en) * 1998-07-10 2002-04-23 Novellus Systems, Inc. Wafer processing architecture including load locks
US6331212B1 (en) * 2000-04-17 2001-12-18 Avansys, Llc Methods and apparatus for thermally processing wafers
US20020195128A1 (en) * 2001-06-22 2002-12-26 S.E.S. Company Limited Single wafer type substrate cleaning method and apparatus
US6770424B2 (en) * 2002-12-16 2004-08-03 Asml Holding N.V. Wafer track apparatus and methods for dispensing fluids with rotatable dispense arms
WO2004084278A1 (en) * 2003-03-20 2004-09-30 Sez Ag Device and method for wet treating disc-shaped articles
US7187002B2 (en) * 2004-02-02 2007-03-06 Matsushita Electric Industrial Co., Ltd. Wafer collective reliability evaluation device and wafer collective reliability evaluation method

Also Published As

Publication number Publication date
TWI569345B (en) 2017-02-01
WO2013005155A2 (en) 2013-01-10
TW201304041A (en) 2013-01-16
KR102007546B1 (en) 2019-08-05
US20130008602A1 (en) 2013-01-10
KR20140040208A (en) 2014-04-02

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