WO2013039655A1 - Assemblage d'un émetteur-récepteur optique à base de caractéristiques de châssis de brochage - Google Patents
Assemblage d'un émetteur-récepteur optique à base de caractéristiques de châssis de brochage Download PDFInfo
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- WO2013039655A1 WO2013039655A1 PCT/US2012/051778 US2012051778W WO2013039655A1 WO 2013039655 A1 WO2013039655 A1 WO 2013039655A1 US 2012051778 W US2012051778 W US 2012051778W WO 2013039655 A1 WO2013039655 A1 WO 2013039655A1
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- WIPO (PCT)
- Prior art keywords
- alignment feature
- alignment
- semiconductor package
- connector housing
- optical
- Prior art date
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/40—Transceivers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
Definitions
- the present invention relates to the field of optical systems, and more particularly to assembling an optical transceiver based on alignment features.
- devices may communicate via optical means, e.g., using optical cables and optical transceivers. Accordingly, in manufacturing such devices, or, particularly, the chips which perform communication, alignment of the optical sensors is important. However, current solutions often align these sensors using imprecise methods. Accordingly, improvements in alignment of optical sensors are desired.
- a connector housing for a transceiver may be received.
- the connector housing may have been previously manufactured or formed and may be provided to assemble an optical transceiver.
- the connector housing may include a first alignment feature comprised on the connector housing.
- a semiconductor package may be received. Similar to above, the semiconductor package may have been previously manufactured or formed and may be provided to combine with the connector housing to form the optical transceiver.
- the semiconductor package may include a leadframe, e.g., which physically connects or binds the transmitter and receiver together. Additionally, the leadframe may include a second alignment feature that is complementary to the first alignment feature. Note that the semiconductor package may generally be covered in a compound (e.g., plastic or molding) after manufacture. However, at least a portion of the leadframe, e.g., the portion which includes the second alignment feature, may remain exposed, without the compound, in order to perform the alignment discussed below.
- a compound e.g., plastic or molding
- the first alignment feature comprises a first geometric shape
- the second alignment feature may include a second shape that is complementary to at least a first portion of the first geometric shape.
- the first alignment feature may include a cylindrical protrusion.
- the second alignment feature may be a semicircular notch or divot that is complementary with the cylindrical protrusion (e.g., a half circle notch that is complementary to the circle formed by the cylindrical protrusion).
- Other shapes and pairings are envisioned.
- the two may fit together in a two dimensional sense.
- the shapes may fit together in a "puzzle piece" manner, e.g., w r here the two components cannot be combined in the same plane (e.g., horizontal plane) but are combined via approach from a different direction (e.g., along a vertical axis).
- the two shapes may fit together in a three dimensional sense, such as where one or more of the alignment features pair not only on a horizontal plane, but also in a vertical plane (e.g., where grooves or features fit into one or both of the semiconductor package or the connector housing).
- the connector housing may have a plurality of alignment features and the semiconductor package may have a corresponding plurality of alignment features.
- the connector housing may have two similar alignment features (e.g., at the top and bottom of the connecting area) and the semiconductor package may have two similar, complementary alignment features for assembly.
- the alignment features may be inverted.
- the connector housing may have a first alignment feature that protrudes and a second alignment feature that recesses.
- the semiconductor package may have corresponding complementary alignment features such that the two elements may "mate" with the proper orientation.
- the semiconductor package and the connector housing may be combined (e.g., by attaching the semiconductor package to the connector housing) to form the optical transceiver.
- the attachment process may include aligning the second alignment feature of the leadframe of the semiconductor package with the first alignment feature of the connector housing.
- the alignment of these features may result in alignment of an optical axis of at least one of a fiber optic transmitter or a fiber optic receiver with a corresponding fiber optic connector.
- the connector housing may include a receiver port and a transmitter port which allow the receiver and the transmitter to receive and transmit optic signals through an optic connection (e.g., a fiber optic cable).
- aligning the alignment features discussed above may precisely align the ports of the connector housing with the optic portions of the receiver and transmitter (e.g., which control a photodiode and LED respectively), thereby allowing the transceiver to properly perform optic communication.
- This procedure may be particularly more precise and less prone to alignment issues than aligning molded or plastic features (e.g., of the semiconductor package), which may not be as precisely manufactured as the lead frame.
- Figure 1 illustrates an exemplary ring network for a set of devices, according to one embodiment
- Figure 2 illustrates an exemplary system block diagram of a portion of a device, according to one embodiment
- Figures 3 and 4 are block diagrams of exemplary transceivers, according to one embodiment
- Figures 5 is a flowchart diagram illustrating an embodiment of a method for aligning optical sensors based on lead frame features
- Figures 6A-10B are exemplary Figures illustrating alignment of optical sensors according to the method of Figure 5, according to some embodiments.
- Memory Medium Any of various types of memory devices or storage devices.
- the term "memory medium” is intended to include an installation medium, e.g., a CD-ROM, floppy disks 104, or tape device; a computer system memory or random access memory such as DRAM, DDR RAM, SRAM, EDO RAM, Rambus RAM, etc.; a non-volatile memory such as a Flash, magnetic media, e.g., a hard drive, or optical storage; registers, or other similar types of memory elements, etc.
- the memory medium may comprise other types of memory as well or combinations thereof.
- the memory medium may be located in a first computer in which the programs are executed, or may be located in a second different computer which connects to the first computer over a network, such as the Internet. In the latter instance, the second computer may provide program instructions to the first computer for execution.
- the term "memory medium" may include two or more memory mediums which may reside in different locations, e.g., in different computers that are connected over a network.
- Carrier Medium - a memory medium as described above, as well as a physical transmission medium, such as a bus, network, and/or other physical transmission medium that conveys signals such as electrical, electromagnetic, or digital signals.
- a physical transmission medium such as a bus, network, and/or other physical transmission medium that conveys signals such as electrical, electromagnetic, or digital signals.
- Programmable Hardware Element - includes various hardware devices comprising multiple programmable function blocks connected via a programmable interconnect. Examples include FPGAs (Field Programmable Gate Arrays), PLDs (Programmable Logic Devices), FPOAs (Field Programmable Object Arrays), and CPLDs (Complex PLDs).
- the programmable function blocks may range from fine grained (combinatorial logic or look up tables) to coarse grained (arithmetic logic units or processor cores).
- a programmable hardware element may also be referred to as "reconfigurable logic”.
- Hardware Configuration Program a program, e.g., a netlist or bit file, that can be used to program or configure a programmable hardware element.
- Computer System any of various types of computing or processing systems, including a personal computer system (PC), mainframe computer system, workstation, network appliance, Internet appliance, personal digital assistant (PDA), television system, grid computing system, or other device or combinations of devices.
- PC personal computer system
- mainframe computer system workstation
- network appliance Internet appliance
- PDA personal digital assistant
- television system grid computing system, or other device or combinations of devices.
- computer system can be broadly defined to encompass any device (or combination of devices) having at least one processor that executes instructions from a memory medium.
- Optical Device any of various devices which are capable of performing optical communication.
- Automatically - refers to an action or operation performed by a computer system (e.g., software executed by the computer system) or device (e.g., circuitry, programmable hardware elements, ASICs, etc.), without user input directly specifying or performing the action or operation.
- a computer system e.g., software executed by the computer system
- device e.g., circuitry, programmable hardware elements, ASICs, etc.
- An automatic procedure may be initiated by input provided by the user, but the subsequent actions that are performed "automatically” are not specified by the user, i.e., are not performed "manually", where the user specifies each action to perform.
- a user filling out an electronic form by selecting each field and providing input specifying information is filling out the form manually, even though the computer system must update the form in response to the user actions.
- the form may be automatically filled out by the computer system where the computer system (e.g., software executing on the computer system) analyzes the fields of the form and fills in the form without any user input specifying the answers to the fields.
- the user may invoke the automatic filling of the form, but is not involved in the actual filling of the form (e.g., the user is not manually specifying answers to fields but rather they are being automatically completed).
- the present specification provides various examples of operations being automatically performed in response to actions the user has taken.
- Figure 1 illustrates an exemplary ring network 100 having a plurality of devices coupled together in a ring arrangement. More specifically, the network 100 of Figure 1 is an exemplary network involving a plurality of audio devices, e.g., within an automobile. As shown, the network 100 includes a receiver 102 coupled to right front speaker 104, which is in turn coupled to right rear speaker, which is in turn coupled to sub woofer 108, which is in turn coupled to left rear speaker 110, which is in turn coupled to left front speaker 112, which is also coupled to the receiver 102.
- the network 100 may be an optical network where each device communicates over the network 100 using optical communication.
- each device may be coupled to its neighboring devices using an optical connection, such as optical fiber.
- the network 100 may be a MOST network that utilizes the MOST application framework.
- a MOST network may have a maximum of 64 nodes per ring, a maximum distance of 10 m between two nodes, and may be used in a point-to-point optical network, e.g., such as shown in Figure 1.
- the MOST application framework is a set of object oriented, reusable components to design multimedia systems in automotive environment, but also in similar other application areas.
- each device may be controlled by an individual cable, such that the wiring harness will grow with each new device that is added to the system. Accordingly, the devices each have proprietary connections and systems. These proprietary systems force a controlling device to handle many different interfaces and protocols.
- each device may be identified by a unique address and shares various data with a common connection.
- Devices can be controlled by a dedicated master (e.g., the receiver 102), but can also exchange information with each other.
- a dedicated master e.g., the receiver 102
- An advantage of a networked system is that the communication paths are defined. Therefore, developers can focus on the product functionality instead of continuously adapting their interfaces to the HMI.
- the MOST application framework is independent from devices and network, allows use of functional modeling (e.g., fblocks, functions, etc.), provides hierarchical system management (e.g., masters, controllers, slaves, etc.), provides service discovery and plug and play mechanisms, provides modularity and reusability (e.g., of iblocks), and may provide free partitioning and easy repartioning (e.g., of fblocks), among other advantages.
- functional modeling e.g., fblocks, functions, etc.
- hierarchical system management e.g., masters, controllers, slaves, etc.
- service discovery and plug and play mechanisms e.g., provides modularity and reusability (e.g., of iblocks), and may provide free partitioning and easy repartioning (e.g., of fblocks), among other advantages.
- audio data may be provided from the receiver to the left front speaker 112 and/or the right front speaker 104.
- the audio data may include data for one or more (or each of) the right front speaker 104, the right rear speaker 106, the sub woofer 108, the left rear speaker 110, or the left front speaker 112.
- the right front speaker 104 may receive the audio data over the network, determine if any portion of the audio data is addressed or intended for the right front speaker 104 and pass the data on to right rear speaker 106, which may perform the same operations, continuing through the rest of the devices in the network 100. Alternatively, or additionally, the same procedures may be performed starting with the left front speaker 1 12 through the right front speaker 104 in the opposite direction.
- the directionality of data may be clockwise, counter-clockwise, or both in the ring network 100.
- Figure 1 shows a typical ring network
- the network 100 may be configured as a star network (e.g., having a centralized controller or hub) or may be a hybrid network, e.g., where a portion of the network uses a star configuration and another portion uses a ring configuration.
- the particular devices and implementations of Figure 1 are exemplary only. Virtually any type of devices may be used in a ring network, instead of, or in addition to, the audio devices shown in Figure 1.
- the devices in the network could include video devices, GPS devices, cell phones, tablets, computer systems, are any desired device.
- the network 100 and devices shown in Figure 1 are exemplary only and may be implemented according various different configurations and may include any of a variety of desired devices.
- Figure 1 is an exemplary network which includes devices that may operate as described herein.
- Figure 2 illustrates an exemplary block diagram of a device 200, e.g., which may be included in the network 100. More specifically, the block diagram of Figure 2 may apply to any of the devices shown in Figure 1.
- the device 200 may include a network interface chip 210 and a fiber optic transceiver 250.
- the fiber optic transceiver 250 may include a transmitter 260 and a receiver 270, which are coupled to each other.
- the fiber optic transceiver 202 may be coupled to the network interface chip 208 via one or more lines or pins. More specifically, there may be two LVDS lines from the network interface chip 208 and two LVDS lines from the fiber optic transceiver 202. Additionally, there may be a bidirectional line between the transmitter 204 of the fiber optic transceiver 202 and the network interface chip 208 which may provide STATUS information.
- FIG. 3 illustrates one embodiment of a more detailed block diagram of the fiber optic transceiver 250.
- the transceiver includes the receiver 270 (e.g., implemented as a first chip), which may be implemented as a sensitive optical receiver, and the transmitter 260 (e.g., an LED driver).
- the receiver 270 and transmitter 260 may be comprised within the same optical assembly along with a photodiode and LED.
- the receiver 270 and the transmitter 260 are coupled via a serial bus. More specifically, the receiver includes a serial peripheral interface (SPI) 272 which is coupled to the SPI 262 of the transmitter 260.
- SPI serial peripheral interface
- the SPIs 272 and 262 communicate using three lines from the SPI interface 262 to the SPI interface 272, one for SCLK (serial clock), one for MOSI (e.g., for data), and one for SS (slave select).
- SCLK serial clock
- MOSI e.g., for data
- SS slave select
- the transmitter may be directly coupled to the network interface chip 210, while the receiver 270 may not.
- this system allows the two chips to transfer serial data between them across a SPI (e.g., a 3 pin SPI).
- the receiver 270 may be configured to receive important settings from the transmitter 260 that is also configured to serially communicate with the network interface chip 210.
- the network interface chip 210 may be configured to serially send and receive data to and from the transmitter 260 (e.g., via the serial l/O pin), which can then serially shift important settings data to the receiver 270. Since the chip to chip transaction may be performed rarely, the receiver 270 can remain quiet of digital noise and optimize receive sensitivity while monitoring the photodiode.
- the receiver 270 may not perform analog to digital conversion and/or digital to analog conversion (e.g., it may not have circuitry that is able to perform such conversions or such circuits may not be utilized), may not receive clock signals (e.g., from the transmitter 260), may not generate clock signals (e.g., it may not be configured to generate clock signals), may not have state transitions (e.g., such as digital state transitions), may not have flip flop toggling, etc. during normal operation, such as while receiving optical data from devices on the network 100.
- Figure 4 illustrates another embodiment of a more detailed block diagram of the fiber optic transceiver 250.
- the receiver 270 may be configured to determine optical power being received by a photodiode.
- the analog interface 472 may be configured to provide this power reading, e.g., via voltage or current, to the transmitter 260, e.g., via serial I/O interface 462.
- the transmitter 260 may be configured to perform analog to digital conversion of this information and communicate the resulting digital information to the network interface chip 210 through a serial I/O pin (e.g., the STATUS line shown in Figure 2).
- a serial I/O pin e.g., the STATUS line shown in Figure 2.
- the noisy translation of the optical power signal to digital domain may be performed by the transmitter 260 rather than the receiver 270, thereby allowing the receiver 270 to remain quiet and be better able to translate sensitive optical inputs from the photodiode, e.g., without interference from digital oscillations.
- the embodiments of Figures 3 and 4 may be implemented separately, or may be combined, as desired.
- the analog interface 472 of Figure 4 may utilize the SPI interfaces shown in Figure 3 to perform communication. Additionally, or alternatively, the analog interface 472 may be combined or included as a part of the SPI interface 272, as desired.
- the serial I/O interface 462 may be implemented as (e.g., all or a portion of) the SPI interface 262.
- the SPI interfaces 272 and 262 may be modified to include an additional line for providing the optical power information from the receiver 270 to the transmitter 260.
- Figure 5 illustrates a method for alignment of optical sensors based on lead frame features.
- the method shown in Figure 5 may be used in conjunction with any of the computer systems or devices shown in the above Figures, among other devices. More specifically, the method of Figure 5 may be used to manufacture and/or assemble the transceiver 250 discussed above. In various embodiments, some of the method elements shown may be performed concurrently, in a different order than shown, or may be omitted. Additional method elements may also be performed as desired. As shown, this method may operate as follows.
- a connector housing for an optical transceiver may be received.
- the connector housing may have been previously manufactured or formed and may be provided to assemble an optical transceiver.
- the connector housing may include a first alignment feature included on the connector housing.
- the connector housing may include elements which allows optical connections (e.g., fiber optic cable(s)) to interact or couple with the transmitter and receiver.
- the connector housing may include a photodiode which detects incoming optical signals and an LED wiiich is used to transmit optical signals. These may be electrically coupled to the receiver and transmitter, respectively, after assembly.
- the photodiode and LED may be included on the transmitter and receiver of a semiconductor package, discussed below.
- the semiconductor package may be received.
- the semiconductor package may include the circuitry or logic implementing the receiver and transmitter described above. Similar to above, the semiconductor package may have been previously manufactured or formed and may be provided to combine with the connector housing to form the optical transceiver. According to various embodiments, the semiconductor package may have been manufactured by the same manufacturer as the connector housing, or a different manufacturer, as desired.
- the semiconductor package may include a leadframe, e.g., which physically connects or binds the transmitter and receiver together. Additionally, the leadframe may include a second alignment feature that is complementary to the first alignment feature of the connector housing. Note that the semiconductor package may generally be covered in a compound (e.g., plastic or molding) after manufacture. However, at least a portion of the leadframe, e.g., the portion which includes the second alignment feature, may remain exposed, without the compound, in order to perform the alignment discussed below.
- a compound e.g., plastic or molding
- the first alignment feature may include a first geometric shape
- the second alignment feature may include a second shape that is complementary to at least a first portion of the first geometric shape.
- the first alignment feature may include a cylindrical protrusion.
- the second alignment feature may be a semicircular notch or divot that is complementary with the cylindrical protrusion (e.g., a half circle notch that is complementary to the circle formed by the cylindrical protrusion).
- the two may fit together in a two dimensional sense.
- the shapes may fit together in a "puzzle piece" manner, e.g., where the two components cannot be combined within the same plane (e.g., horizontal plane) but are combined via approach from a different direction (e.g., along a vertical axis).
- the two shapes may fit together in a three dimensional sense, such as where one or more of the alignment features pair not only on a horizontal plane, but also in a vertical plane (e.g., where grooves or features fit into one or both of the semiconductor package or the connector housing). Further Fittings between the two alignment features are envisioned.
- the connector housing may have a plurality of alignment features and the semiconductor package may have a corresponding plurality of alignment features.
- the connector housing may have two similar alignment features (e.g., at the top and bottom of the connecting area) and the semiconductor package may have two similar, complementary alignment features for assembly.
- the alignment features may be inverted.
- the connector housing may have a first alignment feature that protrudes and a second alignment feature that recedes.
- the semiconductor package may have corresponding complementary alignment features such that the two elements may "mate" with the proper orientation.
- the semiconductor package and the connector housing may be combined, e.g., by attaching the semiconductor package to the connector housing, to form the optical transceiver.
- the attachment process may include aligning the second alignment feature of the leadframe of the semiconductor package with the first alignment feature of the connector housing.
- the alignment of these features may result in alignment of an optical axis of at least one of a fiber optic transmitter or a fiber optic receiver with a corresponding fiber optic connector.
- the connector housing may include a receiver port and a transmitter port which allow the receiver and the transmitter to receive and transmit optic signals through an optic connection (e.g., a fiber optic cable).
- aligning the alignment features discussed above may precisely align the ports of the connector housing with the optic portions of the receiver and transmitter (e.g., which control a photodiode and LED respectively), thereby allowing the transceiver to properly perform optic communication.
- This procedure may be particularly more precise and less prone to alignment issues than aligning molded or plastic features (e.g., of the semiconductor package), which may not be as precisely manufactured as the lead frame.
- Figures 6A-6D are exemplary Figures illustrating alignment of optical sensors according to the method of Figure 5, according to some embodiments.
- Figure 6A illustrates proper alignment of the semiconductor package with the connector housing. More specifically, as shown, the lead frame 605 of the semiconductor package 600 connects the transmitter 602 and receiver 604. Additionally, as shown, the lead frame 605 includes two alignment features 610 and 620. These alignment features are complementary to the alignment features 660 and 670 of the connector housing 650. In the specific example shown in Figure 6A, the alignment features 610 and 620 are half circle notches which are complementary to the alignment features 660 and 670, which are cylindrical protrusions.
- the optical sensors or elements 680A and 680B of the connector housing and the corresponding optical elements 630A and 630B semiconductor package are also properly aligned.
- proper alignment of the alignment features may result in proper alignment of the optical elements of the connector housing and the semiconductor package.
- Figures 6B-6D illustrate various situations where the alignment features of the semiconductor package and the connector housing are not properly aligned, and correspondingly, the optical elements of the semiconductor package and the connector housing are also not properly aligned. These mis-alignments and corrections are shown with dotted circles and arrows in Figures 6B-6D. As shown, Figure 6B is slightly skewed in a counter clockwise direction and needs to be adjusted in a clockwise manner. Figures 6C and 6D have vertical misalignments and need to be aligned vertically. The alignment features of the package and housing allows this alignment to be performed quickly and accurately.
- Figure 7A is a side view of the semiconductor package 600 and the connector housing 650 during assembly, but prior to completion.
- Figure 7B illustrates the same view with the semiconductor package 600 attached to the connector housing 650.
- the optical elements of the semiconductor package 600 and the connector housing 650 are now properly aligned along the optical axis (shown as a dotted line).
- the transceiver circuitry there is no contact of the transceiver circuitry with the semiconductor housing, as shown.
- Figure 8A is a top down view of the semiconductor package 600 and the connector housing 650 during assembly, but prior to completion.
- Figure 8B illustrates the same view with the optical transceiver fully assembled.
- Figure 9A is another top down view of the semiconductor package 600 and the connector housing 650 during assembly, but prior to completion.
- Figure 9B illustrates the same view with the optical transceiver fully assembled.
- Figure 10A is a side bisected view of the semiconductor package 600 and the connector housing 650 during assembly, but prior to completion. As shown, the optical connector 650 is in the process of being aligned with the corresponding optical element of the semiconductor package 600.
- Figure 10B illustrates the same view with the optical transceiver fully assembled.
- semiconductor packages may utilize additional types of sub- carrier, such as QFN, BGA, etc.
- leadframes having the above- described alignment features
- other materials such as F 4 (e.g., standard PCB material), BT (Bismaleimide-Traizine), polyimide, ceramic, or other custom materials.
- F 4 e.g., standard PCB material
- BT Bismaleimide-Traizine
- polyimide polyimide
- ceramic or other custom materials.
- Such materials may be referred to as a "substrate" of the package, e.g., a "package substrate".
- the substrate may be any material on which an IC is mounted.
- alignment feature(s) of the substrate of the semiconductor package may be used.
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Abstract
La présente invention concerne l'assemblage d'un émetteur-récepteur optique. Un boîtier de connecteur pour un boîtier de semi-conducteur peut être reçu. Le boîtier de connecteur peut comprendre une première caractéristique d'alignement permettant d'assembler l'émetteur-récepteur optique. En outre, un boîtier de semi-conducteur peut être reçu. Il peut comprendre un châssis de brochage qui possède une seconde caractéristique d'alignement complémentaire à la première caractéristique d'alignement. Le boîtier de semi-conducteur peut être fixé au boîtier de connecteur afin de former l'émetteur-récepteur optique par l'alignement de la seconde caractéristique d'alignement du châssis de brochage du boîtier de semi-conducteur sur la première caractéristique d'alignement du boîtier de connecteur. Cet alignement peut servir à l'alignement d'un axe optique d'un émetteur à fibre optique et/ou d'un récepteur à fibre optique sur un connecteur à fibre optique correspondant.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020147008306A KR20140109359A (ko) | 2011-09-16 | 2012-08-22 | 리드 프레임 정렬 기구들에 기초한 광 트랜스시버 조립 방법 |
EP12761838.7A EP2756614A1 (fr) | 2011-09-16 | 2012-08-22 | Assemblage d'un émetteur-récepteur optique à base de caractéristiques de châssis de brochage |
CN201280054597.7A CN104170285A (zh) | 2011-09-16 | 2012-08-22 | 基于引线框架特征组装光学收发器 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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US201161535817P | 2011-09-16 | 2011-09-16 | |
US61/535,817 | 2011-09-16 | ||
US13/406,629 US20130071071A1 (en) | 2011-09-16 | 2012-02-28 | Assembling an Optical Transceiver Based on Lead Frame Features |
US13/406,629 | 2012-02-28 |
Publications (1)
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WO2013039655A1 true WO2013039655A1 (fr) | 2013-03-21 |
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Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
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PCT/US2012/051567 WO2013039651A1 (fr) | 2011-09-16 | 2012-08-20 | Communication entre un récepteur optique et un émetteur optique au moyen d'un bus série |
PCT/US2012/051669 WO2013039652A1 (fr) | 2011-09-16 | 2012-08-21 | Fourniture d'une information de puissance optique en provenance d'un récepteur optique à un émetteur optique au moyen d'un bus série |
PCT/US2012/051778 WO2013039655A1 (fr) | 2011-09-16 | 2012-08-22 | Assemblage d'un émetteur-récepteur optique à base de caractéristiques de châssis de brochage |
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PCT/US2012/051567 WO2013039651A1 (fr) | 2011-09-16 | 2012-08-20 | Communication entre un récepteur optique et un émetteur optique au moyen d'un bus série |
PCT/US2012/051669 WO2013039652A1 (fr) | 2011-09-16 | 2012-08-21 | Fourniture d'une information de puissance optique en provenance d'un récepteur optique à un émetteur optique au moyen d'un bus série |
Country Status (5)
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US (3) | US20130071110A1 (fr) |
EP (3) | EP2756615A1 (fr) |
KR (3) | KR20140106499A (fr) |
CN (3) | CN104185959A (fr) |
WO (3) | WO2013039651A1 (fr) |
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US8942071B2 (en) * | 2011-02-04 | 2015-01-27 | Lucinda Price | Color storage and transmission systems and methods |
US9071364B1 (en) * | 2011-10-18 | 2015-06-30 | Clariphy Communications, Inc. | Coherent optical transceiver with programmable application modes |
CN103326785A (zh) * | 2013-06-28 | 2013-09-25 | 成都思迈科技发展有限责任公司 | 车载光端机 |
CN103346837B (zh) * | 2013-07-04 | 2016-08-24 | 无锡思泰迪半导体有限公司 | 一种集成设计的光端机系统 |
US9780879B2 (en) * | 2015-12-09 | 2017-10-03 | GM Global Technology Operations LLC | Vehicle communication system having self-configuring optical interfaces |
WO2018208675A2 (fr) * | 2017-05-06 | 2018-11-15 | Bisset Anthony | Réseau de haut-parleurs extensible à ouverture commune |
CN115378501A (zh) * | 2022-03-31 | 2022-11-22 | 昂纳信息技术(深圳)有限公司 | 一种车载的数据传输装置及车载数据传输系统 |
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Also Published As
Publication number | Publication date |
---|---|
KR20140106499A (ko) | 2014-09-03 |
WO2013039651A1 (fr) | 2013-03-21 |
EP2756615A1 (fr) | 2014-07-23 |
US8879926B2 (en) | 2014-11-04 |
CN104185959A (zh) | 2014-12-03 |
US20130071125A1 (en) | 2013-03-21 |
CN104160314A (zh) | 2014-11-19 |
US20130071071A1 (en) | 2013-03-21 |
KR20140109359A (ko) | 2014-09-15 |
EP2756614A1 (fr) | 2014-07-23 |
CN104170285A (zh) | 2014-11-26 |
EP2756613A1 (fr) | 2014-07-23 |
WO2013039652A1 (fr) | 2013-03-21 |
KR20140106500A (ko) | 2014-09-03 |
US20130071110A1 (en) | 2013-03-21 |
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