WO2014001483A1

WO2014001483A1 - Semiconductor lighting device with a heat pipe

Info

Publication number: WO2014001483A1
Application number: PCT/EP2013/063586
Authority: WO
Inventors: Christian Kiefer; Michael Rosenauer
Original assignee: Osram Gmbh
Priority date: 2012-06-29
Filing date: 2013-06-28
Publication date: 2014-01-03
Also published as: DE102012211279A1

Abstract

Semiconductor lighting device with a heat pipe. The semiconductor lighting device (11) has at least one semiconductor light source (16) and at least one light-permeable cover (20) for the at least one semiconductor light source (16), wherein the cover (20) is a heat pipe and is designed as a hollow body with at least one closed chamber (21) which is inserted therein and is filled with coolant (K).

Description

description

The invention relates to a semiconductor light-emitting device, comprising at least one semiconductor light source and a light-transmitting cover for the at least one

Semiconductor light source. The invention is particular

Applicable to lamps, in particular Ersatzmittel- or

Retrofit lamps.

WO 2011/095616 A2 relates to an LED lamp having at least one LED mounted on a support, a housing spanning the support forming a cavity housing the LED and one of the emitting surface of the LED

opposite transparent wall portion, and a heat pipe for dissipating the heat generated by the operation of the LED, wherein the heat pipe is formed by the cavity, this is hermetically sealed from the environment and containing a working medium, which at the operating temperature of the LED gaseous and in the

Operating temperature of the housing is liquid.

DE 10 2007 041 852 A1 discloses an LED module which has a transparent carrier on which electrode structures are applied. At least one LED is by means of

Contacted electrode structures. A hollow body is arranged above the carrier, the hollow body spanning the carrier on the side of the LEDs and containing a vaporizable refrigerant through the hollow body and the carrier.

It is the object of the present invention to at least partially overcome the disadvantages of the prior art, and in particular to provide a possibility for effective heat dissipation from a semiconductor lighting device, which is simple and versatile. This object is achieved according to the characteristics of the independent

Claims solved. Preferred embodiments are

in particular the dependent claims. The object is achieved by a semiconductor lighting device, comprising at least one

Semiconductor light source and at least one light-transmitting cover for the at least one semiconductor light source, wherein the cover is or represents a heat pipe and wherein the cover as a hollow body with at least one incorporated therein, with refrigerant

filled cavity is formed.

In contrast to known semiconductor light-emitting devices, the at least one semiconductor light source is now not arranged in the cavity. Rather, the cavity is particularly hermetically sealed in the cover. As a result, the cover can be used without further adjustments, for example of the refrigerant to the semiconductor light sources, which allows a more versatile selection of refrigerants. Also, the cover does not need more

hermetically mounted, which results in easier assembly and allows greater variety of attachment methods. In addition, occurs in an accidental detachment of the cover no refrigerant. At the same time, a very good

Heat conduction achieved. The cover thus corresponds

in particular alone a heat pipe, in particular, the free outer surface of the cover is used as a cool side or cooling surface.

In contrast to the known semiconductor light-emitting devices according to WO 2011/095616 A2 or DE 10 2007 041 852 AI, the heat pipe serving as a hollow body in the present

Semiconductor lighting device not only used as a heat conducting body for dissipating the heat to a dedicated heat sink, but also as a heat sink. ^

This is possible in particular because of the

Heat transfer (heat pipe effect) the temperature at the free surface only slightly different from the temperature at or near the heat source (semiconductor light source (s), etc.) or their heat sink. Depending on the version of the

Lighting device can almost double the entire cooling surface.

The refrigerant may also be referred to as working fluid and in particular allow heat conduction using its heat of vaporization. In general, heat pipes are generally well known, so that their operation here need not be described in detail. Under a

Heat pipe can be understood in particular the variant in which the liquid refrigerant through

Capillary force to its warmer side or area

(Evaporator area) returns. However, the heat pipe may basically be configured as a thermosyphon in which the liquid refrigerant returns by gravity to its warmer side or region.

Preferably, the at least one

Semiconductor light source at least one light emitting diode. at

If several LEDs are present, they can be lit in the same color or in different colors. A color may be monochrome (e.g., red, green, blue, etc.) or multichrome (e.g., white). This can also be done by the at least one

LED emitted light is an infrared light (IR LED) or an ultraviolet light (UV LED). Several

Light emitting diodes can produce a mixed light; e.g. a white mixed light. The at least one light-emitting diode may contain at least one wavelength-converting phosphor

(Conversion LED). The at least one light-emitting diode can be in the form of at least one individually housed light-emitting diode or in the form of at least one LED chip. Several LED chips can be mounted on a common substrate ("submount"). The at least one light emitting diode may be provided with at least one own and / or common optics for beam guidance be equipped, eg at least one Fresnel lens,

Collimator, and so on. Instead of or in addition to inorganic light emitting diodes, e.g. based on InGaN or AlInGaP, organic LEDs (OLEDs, for example polymer OLEDs) can generally also be used. Alternatively, the at least one semiconductor light source may be e.g. have at least one diode laser.

The translucent cover can in particular a

Be cover, which at least partially or

partially translucent. In particular, the cover may have partial areas which are not

are translucent. The cover may be transparent or translucent (opaque) translucent. The

translucent cover may in particular be completely translucent and therefore translucent

Materials exist.

The cover may for example be made of (diffused or

transparent) glass or plastic.

It is an embodiment that at least one cavity has a full-volume basic shape. A full-volume basic form is understood in particular to mean a shape which expands at least regionally in all three dimensions significantly or in the same order of magnitude. The full-volume basic form can also be used as a (practical)

be called three-dimensional basic form. These

Design makes it possible to provide a particularly large and / or multi-shaped cavity.

It is a development that the full-volume basic form is a spherical cap-shaped basic shape, which provides a large volume for curved covers, eg for incandescent retrofit lamps. Alternatively, the full-volume basic form may be, for example, a cuboid basic shape. It is still an embodiment that at least one cavity has a flat basic shape. A flat basic shape is understood in particular to mean a (curved and / or plane) shape which expands significantly or in the same order of magnitude only in two dimensions, but is smaller in its height extent. Such a basic form comprises in particular the case that the maximum height extent is not more than 20%, in particular not more than 10 -6, of a maximum extent in the other dimensions (the

curved and / or plan "level"). The area

Basic form can also be used as a (practical)

two-dimensional basic form. These

Design allows provision of a particularly thin cavity.

It is a development that the flat basic shape is a spherical shell-shaped basic shape, which is suitable for curved flat covers cavity or volume

provides, e.g. for incandescent retrofit lamps. In one alternative, the flat basic shape may have a tubular shape

Be basic form, e.g. for tubular retrofit lamps. In another alternative, the flat basic shape likes a flat

Basic shape (with an extension in the plane which is significantly larger than an extension perpendicular thereto) and, e.g. be used with a halogen lamp retrofit lamp.

It is an embodiment of the cover having a flat basic shape and with its concave side arching over the at least one semiconductor light source. Consequently, the cover and the overarched at least one semiconductor light source are spaced from each other. This gives as an advantage that the cover can be lighter. In addition, such a mechanical contact of the

Semiconductor light source can be safely avoided.

This embodiment, for example, as a double wall piston (wherein on the inner wall of the phosphor region is arranged and on the outer wall, for example, are a capillary structure can), also reduces the unwanted color impression (eg yellow impression) of the phosphor area in the

switched off state, without the positive properties of the heat decoupling of the phosphor region and the

Affect semiconductor light source.

It is yet another embodiment that at least one cavity has at least one capillary structure on its wall. By means of the capillary action brought about by the capillary structure, a flow of liquid refrigerant can take place

(e.g., a return of refrigerant condensed on the colder side to a warmer one)

cooling side). This reinforces a circulation of

Refrigerant and consequently a heat transfer. This can be particularly advantageous in the event that the

Illuminant is oriented in operation so that its side to be cooled is not in relation to the gravitational bottom side, the liquid refrigerant must therefore flow there without help or even against gravity. The

Capillary structure is to prevent it to a strong light attenuation (light absorption) or to a strong light backscatter to the at least one

Semiconductor light source comes, in particular a transparent capillary structure.

The wall has the capillary structure in particular

all over, giving a particularly strong and / or

allows differently directed flow direction of the refrigerant. In other words, the cavity is then provided on its surface or wall over its entire area with the capillary structure.

It is an embodiment of that at least one

Capillary structure at least one in the wall

introduced elongated trench (also referred to as longitudinal groove, groove or channel markable). By means of at least one such trench structure, the liquid refrigerant portion can be transported effectively and in a highly directional manner. Of the At least one trench can be produced for example by hot stamping, for example by means of a stamp, for example in

Plastic or glass. It is a development of the fact that the trench structure introduced in the wall has several elongated trenches

having. This can increase a capillary action.

It is still a further development that the trench structure introduced in the wall has a plurality of elongated trenches running parallel to each other. This enhances capillary action in a direction dictated by the orientation of the trenches. In particular, the elongated ones like

Ditches then run between the colder side and the warmer side. For example, the elongated trenches between a (colder) outer free surface of the

Cover (which is exposed to outdoor air) and a (warmer) in contact with an area or side of the cover to be warmed body or part of the lighting device run.

It is also an embodiment that at least one

Capillary structure at least one introduced in the wall trench structure with at least one elongated trench

has, whose side walls are formed at least approximately parallel to each other. As a result, light penetrating into a trench can unimpededly leave the cover due to total reflection on the side walls. This effect can also be used to obtain a partial reflection and thus a diffuse light impression by selectively setting an angle of the side walls (eg with respect to a common floor or also to each other) or by deliberately adjusting the shape of the side walls or the incident light so to divert that an omnidirectional radiation (eg also to the rear or in the rearward direction) results from the cover. It is still a development that the introduced in the wall trench structure has intersecting elongated trenches. Intersecting trenches may be formed in particular perpendicular to each other. Such

Trench structure has the advantage of being a directional

Liquid transport due to capillary action in several directions is possible. This can be a heat dissipation

for example, support both a vertical orientation as well as a horizontal orientation of the lighting device.

It is still a further development that the trench structure introduced in the wall is a honeycomb trench structure, which is even more of an orientation or

Installation direction of the lighting device allows independent reflux of the liquid portion of the refrigerant.

It is generally preferred for an effective cooling effect by the cover that the at least one

Capillary structure, a return flow of the liquid portion of the refrigerant at least largely independent of one

Installation direction (horizontal, vertically upright, vertically hanging or upside down, etc.)

is guaranteed.

It is also an embodiment that at least one capillary structure has a porous region. The porous area also supports capillary transport of the liquid portion of the refrigerant. This can

advantageously done without a preferred direction, so that the heat dissipation can be at least substantially independent of a mounting direction of the lighting device can be amplified. The porous region can be, for example, by a

Surface treatment of the wall are introduced, for example by etching the wall, in particular if the cover is made of glass. Alternatively, it is e.g.

possible, on the wall of the cavity a porous

Apply transparent plastic layer. "

Another alternative is to apply transparent plastic, ceramic or glass granules (including powder) to the wall of the cavity. It can be so sintered or glued that it sticks there and still remains porous. The granules preferably have a refractive index similar to the liquid refrigerant. Depending on the thickness of the capillary layer thus produced, its scattering property (diffusivity) is influenced and, in particular, can also be adjusted in a targeted manner.

It is yet another embodiment that at least one capillary structure, in particular a porous structure, has a fabric or a fabric structure. this is a

comparatively easy way, a capillary

Transport of the liquid portion of the refrigerant without a preferred direction provided. Because the tissue can, for example, similar to a wick, soak with the liquid refrigerant and transport it.

The fabric is preferably translucent, e.g. similar to a transparent adhesive plaster. To the

To obtain required transparency, can be used in particular as fibers plastics, the one

Have refractive index near the refractive index of the liquid refrigerant used. Because of the similar

Refractive indices can be the transitions of the fibers to the

Liquid optically almost be suppressed and thus become virtually invisible to the light to be transmitted. It is a development that the fabric or its fibers made of fluorocarbon (fluorocarbon), which has a similar refractive index as water.

It is also an embodiment that at least one

Capillary structure one with a translucent,

in particular transparent, layer occupied area

, wherein at least two points of the layer, a passage from an interface of the layer to a free surface of the layer is present. The capillary effect can here by the typically not hermetically close superimposed, but at least partially permeable to the refrigerant

(cleaved) interface of the layer with its backing (e.g., the wall or other layer). This gap can generate high capillary forces because of its small width. The passages serve to pass the liquid refrigerant from the cavity to the interface, and vice versa. At least two of the

(At least two) bushings are preferably arranged on the colder side or on the warmer side of the cavity. The capillary structures described above can be combined. For example, on a micro-embossed trench structure granules can be additionally sintered up to form the granules

Increase capillary action. Especially in a combination of capillary structures, the diffuse impression (the appearance of the cover) is particularly versatile

adjust and adjust.

It is yet another embodiment that at least one phosphor region is present on the cover. A phosphor region may, in particular, be understood as meaning a region which has at least one phosphor (also called "remote phosphor") which is at a distance from the at least one semiconductor light source

at least one semiconductor light source incident on him (excitation or primary) light at least partially in

Convert (secondary) light of different, especially larger, wavelength. This can be a through the

Lighting device adjustable (sum) color location can be increased. Due to the spaced arrangement, a heating of the phosphor in the form of the so-called. Stokes heat low

which are otherwise reduced

Conversion efficiency and a shift in the

Wavelength of the converted light (so-called "Stokes shift") would lead. The application to the cover serving as a heat pipe allows a further heat dissipation and consequently cooling of the (at least one) phosphor of the (at least one) phosphor region.

The phosphor can e.g. one on the main body

adhered body, e.g. a ceramic one

Phosphor lamina or a luminescent plate as filler of a transparent matrix material (e.g.

Silicone). The phosphor may also be or have a metal phosphate. The phosphor can, for example, also sintered on the cover, blown up, by means of

Hydrogen bonds are applied, sprayed, printed (e.g., by knife coating), etc. by means of EPD (using, for example, an optically transparent, conductive intermediate layer such as an ITO layer), etc.

In a further development, the phosphor can be located in the wall or in at least one area thereof or integrated therein. In this area, the phosphor may be present as an admixture, which can be carried out for example by means of a sol / gel process. This gives the advantage that the phosphor is well protected against external influences. In addition, less

Components needed. This also provides a particularly good thermal connection to the wall.

It is also an embodiment that at least one

Fluorescent area on an outside of the cover

is available. This allows for easy attachment of the (at least one) phosphor of the phosphor region.

In addition, the phosphor need not be compatible with the refrigerant.

It is an alternative or additional embodiment that at least one phosphor region is present in the (ie, at least one) cavity of the cover. this makes possible a particularly effective cooling and protection against external influences.

It is also an embodiment that both the at least one semiconductor light source and the translucent cover rest on a common heat sink. Thereby, an effective heat transfer from the at least one semiconductor source via the heat sink to the contact surface of the cover can be achieved, which in turn results in a

Support surface well defined localized heat side with high temperature conditions. In addition, so in a simple way, an increased heat dissipation from others with the

Heatsink thermally connected heat sources (e.g., a driver, for example, in a driver cavity of the

Heatsink may be accommodated) possible.

It is an embodiment that the lighting device is a lamp. The lamp may in particular be a replacement illuminant or retrofit (retrofit lamp). Especially at

Retrofit lamps of the usual standards, e.g. with E27 sockets, are an installation space and thereby usable space for

Electronics, semiconductor light source and cooling strongly limited.

In particular, the retrofit lamp may be a replacement lamp for a conventional incandescent lamp (incandescent retrofit lamp). Become incandescent retrofit lamp

In terms of their appearance often modeled on the classic light bulbs, which usually a pear-shaped design and a dome-shaped piston as a light exit surface

have. In incandescent retrofit lamps, the bulb is usually a simple plastic or glass shade used, which additionally serves as a diffuser and scattering agent. The resulting problem is that the piston usually has only a poor thermal coupling to the

Has semiconductor light source and is therefore lost as a cooling surface. This problem can be solved by now

provided cover and light device are overcome. The now provided cover has as Another advantage that it allows a similar (glassy) appearance as a piston of a conventional light bulb. By using the cover as a cooling surface can also reduce the size of the heat sink and the incandescent retrofit lamp mainly as a glass body

To run .

The above-described characteristics, features and advantages of this invention as well as the manner in which they are achieved will become clearer and more clearly understood

In connection with the following schematic description of exemplary embodiments that are associated with the

Drawings are explained in more detail. It can to

Clarity identical or equivalent elements must be provided with the same reference numerals.

Fig.l shows a sectional view in side view a

LED incandescent retrofit lamp according to a first

Embodiment;

2 shows a sectional side view of a

LED incandescent retrofit lamp according to a second

Embodiment;

3 shows a plan view of a linear parallel

extending trench-shaped capillary structure;

4 shows the linearly parallel trench-shaped

Capillary structure as a sectional view in

Side view;

5 shows a top view of a cross-shaped trench-shaped capillary structure; and

FIG. 6 shows in plan view a honeycomb-shaped trench-shaped capillary structure.

FIG. 1 shows a sectional side view of a semiconductor light-emitting device in the form of a LED light-bulb retrofit lamp 11 according to a first exemplary embodiment. The LED incandescent retrofit lamp 11 is for replacement of a

provided conventional light bulb and points to

Power supply at its rear or rear end a socket 12 for connection to a socket of a lamp or the like. The base 12 may be, for example, a bipin socket or an Edison socket. The base 12 is followed

Heat sink 13, e.g. made of aluminum, on. The heat sink 13 has a driver cavity 14 with a driver 15 received therein. The driver 15 has one or more electrical and / or electronic components, which serve to convert electrical signals fed in via the base 12 into the operation of at least one light-emitting diode 16 serving as a semiconductor light source. The at least one

Light-emitting diode 16 is arranged on a front side 17 of the heat sink 13, in this case in a recess 18.

The front side 17 of the heat sink 13 is of a

transparent cover 20 is covered, which is seated flat on the heat sink 13 and with this example. by means of gluing, latching, screwing and / or

Deadlock, etc. may be connected. The cover 20 is thermally well connected to the heat sink 13, e.g. reinforced by an interposed therebetween thermal interface material (TIM, "Thermal Interface Material") such as a thermal adhesive, a thermal grease, etc. The cover 20 here has a basic shape or outer contour of a

Kugelkalotte, so that the LED incandescent retrofit lamp 11 is similar in shape to a conventional light bulb. The

Cover 20 may be made of translucent, for example

(transparent or opaque) glass, plastic or ceramic, etc., and is formed as a hollow body with a hermetically sealed cavity 21. A through the

Material of the cover 20 formed body 19

thus corresponds to a spherical cap-shaped, shell-like body.

The cavity 21 has a full-volume, spherical cap-shaped basic shape and is filled with refrigerant K (part), which is suitable for forming the cover 20 as a heat pipe. The cover 20 as such is thus a heat pipe or has its function. The rear, the heat sink 13 overlapping side 22 corresponds to the (to be cooled) warm / warmer side of the cover 20 and the base body 19, while the front-side free surface 23 of the

Cover 20 corresponds to the cool / cooler side. Consequently, in cavity 21 opposite or in the area

Evaporate (evaporator portion 24) of the rear side 22 located refrigerant K and opposite or in the area

(Condensation region 25) of the free surface 23

Condensate refrigerant K condense. The condensed refrigerant K can flow back to the warmer rear side 22 where it is evaporated again, etc. The

at least one light-emitting diode 16 is thus not arranged in the cavity 21. For effectively enabling the reflux of the refrigerant K from the condensation region 25 of the cavity 21 to its evaporator region 24 in different installation orientations, the cavity 21 has on its wall 27, in particular at least at its condensation region 25 a

Capillary structure 26 on. The capillary structure 26 is to prevent strong light attenuation (light absorption) or strong light backscattering from the at least one semiconductor light source, a transparent capillary structure, and in particular may be achieved by surface shaping of the wall 27.

On the outside of the rear side 22 of the cover 20 and the base body 19 above the recess 18, a phosphor region 28 having at least one phosphor is present. The phosphor region 28 may be, for example, a ceramic phosphor wafer affixed to the cover 20. Through the cover 20, the Stokes heat generated during wavelength conversion in the phosphor region 28 can also be dissipated effectively. In order to obtain a high luminous efficacy, the recess 18 (diffuse or specular) may be reflective. The cover 20 is used in addition to the heat sink 13 as an additional heat sink.

The LED incandescent retrofit lamp 11 may be made of, for example, a half shell and a circular plate, which have been manufactured separately and then sealed together at their free edge.

2 shows a sectional side view of an LED incandescent retrofit lamp 31 according to a second

Embodiment. The LED incandescent retrofit lamp 31 is constructed similarly to the LED incandescent retrofit lamp 11, but has a different heat sink 32 without a dedicated recess and a different one

Cover 33 on. In order to avoid that the cover 33 rests directly on the at least one light-emitting diode 16, the cover 33 has a spherical shell-shaped basic shape, which has a flat (practically two-dimensional), spherical shell-shaped cavity 34. In particular, a height of the cavity 34 does not measure more than 10 ~ 6 of its extent in the curved (spherical shell) plane.

The cavity 34 may otherwise be configured similar to the cavity 21 and in particular with refrigerant K.

(Part) filled and have a capillary structure. The cover 33 vaulted with its concave underside 35, the at least one light emitting diode 16 and lies with its edge 36 on the heat sink 32. Consequently, the cover 33 and the at least one light emitting diode 16 are spaced apart. The warm side 24 of the cover 33 can in particular the

Edge 36 and the concave bottom 35 include, while the convex free surface 23 continues to represent the cold side. A phosphor region 37 can be located in particular on the concave underside 35, in particular there

full surface. The LED incandescent retrofit lamp 31 may be made, for example, from two separately manufactured half-shells which are tightly connected together at their free edge.

Again, the cover 33 next to the heat sink 32 serves as an additional heat sink.

3 shows in plan view a possible capillary structure 26 in the form of a capillary structure 41 with a plurality of linearly and mutually parallel trenches 42 (or longitudinal grooves,

Grooves, etc.). This capillary structure 41 can be introduced, for example, by hot stamping, micromachining, etc.

In particular, the cover may be multi-part and / or in

Several steps are made so that, for example, the capillary structure 41 can be introduced before a closure of the cavity.

For example, in the cover 20 or 33, the trenches 42 may extend vertically (from a rearward position to a frontward position). The trenches 42 may be equally distributed in the circumferential direction in the wall 27 and converge at a foremost point of the cavity 21 and the condensation region 25. Also the

Evaporator section 24 may be equipped with trenches 42 for improved distribution of the refrigerant K. These

For example, heat-side trenches 42 may be star-shaped or radial-departing from a center of the evaporator region 24, e.g. to the trenches 42 of the condensation region 25

connect.

Such an arrangement of the trenches 42 is suitable, in particular, for a (as shown) vertically upright orientation or for a 180 ° rotated, perpendicularly suspended orientation of the incandescent retrofit lamp 11 or 31.

4 shows the linearly parallel trenches 42 as a sectional view in side view. Side walls 43 of the Trenches 42 are formed at least approximately parallel to each other. As a result, in a trench penetrating light L unhindered by total reflection on the side walls 43 leave the cover 20 or 33. This effect can also be used specifically by adjusting an angle of the side walls 43 to an associated bottom 44 or

alternatively to one another or by deliberately adjusting the shape of the side walls 43 to obtain a partial reflection and consequently a diffuse light impression or to redirect the incident light L out of the cover 20 or 33 for omnidirectional radiation.

5 shows a top view of a possible capillary structure 26 in the form of a capillary structure 51 with elongated, cross-shaped trenches 52.

Such a capillary structure 51 has the advantage that a directed liquid transport due to the

Capillary action in two different directions is possible here. This can be an effective heat dissipation

for example, even at a weird or even

Horizontal orientation of LED incandescent retrofit lamp 11 or 31 support. 6 shows in plan view a possible capillary structure 26 in the form of a capillary structure 61 with a honeycomb shape

extending trenches 62. This allows an even more independent of an orientation or installation direction of the LED light bulb retrofit lamp 11 or 31 backflow of the

condensed refrigerant.

Although the invention is shown in detail by the

While embodiments have been further illustrated and described, the invention is not so limited and other variations can be derived therefrom by those skilled in the art without departing from the scope of the invention. Thus, the capillary structure 26 may have curved or curved trenches running parallel or not parallel to each other. Furthermore, the capillary structure 26 may be porous or have at least one porous region. Another alternative is, as capillary structure 26 transparent plastic, ceramic or glass granules (including

Powder) on the wall of the cavity. The

Capillary structure 26 may also have tissue or a tissue structure. It is also possible that the capillary structure 26 with a light-transmissive, in particular

transparent, layer occupied area, wherein at least two locations of the layer, a passage from an interface of the layer to a free surface of the layer is present. The different types of

Capillary structure 26 can be combined.

Also, alternatively or in addition to the outside phosphor region, at least one phosphor region may be present in the (ie, at least one) cavity of the cover.

^ "

Reference sign list

11 semiconductor lighting device

12 sockets

13 heat sink

14 driver cabotage

15 drivers

16 semiconductor light source

17 front side

18 deepening

19 basic body

20 translucent cover

21 cavity

22 page

23 surface

24 evaporator area

25 condensation area

26 capillary structure

27 wall

28 fluorescent area

31 semiconductor light-emitting device

32 heat sinks

33 cover

34 cavity

35 concave underside

36 edge

37 air fabric area

41 capillary structure

42 ditch

43 side wall

44 soil

51 capillary structure

52 ditch

61 capillary structure dig

Refrigerant light

Claims

Semiconductor lighting device (11; 31), comprising at least one semiconductor light source (16) and

at least one light-transmitting cover (20; 33) for the at least one semiconductor light source (16), wherein the cover (20; 33) is a heat pipe and as a hollow body with at least one enclosed, filled with refrigerant (K) cavity (21; 34) is formed.

Semiconductor lighting device (11) according to claim 1, wherein at least one cavity (21) is a full-volume,

in particular spherical cap-shaped, basic shape.

Semiconductor lighting device (31) according to claim 1, wherein at least one cavity (34) has a flat, in particular spherical shell-shaped, basic shape.

Semiconductor lighting device (31) according to claim 3, wherein the cover (33) has a flat, in particular

Has spherical shell-shaped, basic shape and with its concave underside (37), the at least one

Vaulted semiconductor light source (16).

Semiconductor lighting device (11; 31) according to any one of the preceding claims, wherein at least one cavity (21; 34) on its wall (27) at least one

Capillary structure (26), in particular

full surface.

A semiconductor light-emitting device (11; 31) according to claim 5, wherein at least one capillary structure (26, 41).

at least one in the wall (27) introduced

Trench structure with several parallel to each other

extending, elongated trenches (42).

7. The semiconductor lighting device (11; 31) according to claim 5, wherein at least one of

Capillary structure (26, 41; 26, 51; 26, 61) at least one trench structure introduced in the wall with at least one elongate trench (42; 52; 62).

has, whose side walls (43) are formed parallel to each other.

8. semiconductor lighting device (11; 31) according to one of

Claims 5 to 7, wherein at least one

Capillary structure (26) has a porous region.

9. semiconductor light-emitting device (11; 31) according to one of

Claims 5 to 8, wherein at least one

Capillary structure (26) has a tissue.

10. A semiconductor light-emitting device (11; 31) according to one of

Claims 5 to 9, wherein at least one

Capillary structure (26) has a region covered with a light-transmissive layer, wherein at least two locations of the layer, a passage from an interface of the layer to a free surface of the layer is present. 11. A semiconductor light-emitting device (11, 31) according to one of

preceding claims, wherein on the cover (20; 33) at least one phosphor region (28; 37) is present. 12. semiconductor lighting device (11; 31) after a

Claim 11, wherein at least one phosphor region (28; 37) is provided on an outer side (17; 35) of the cover (20; 33). 13. A semiconductor light-emitting device according to any one of claims 11 to 12, wherein at least one phosphor region is present in the cavity of the cover. Semiconductor lighting device (11; 31) according to one of the preceding claims, wherein both the at least one semiconductor light source (16) and the

transparent cover (20; 33) resting on a common heat sink (13).