WO2014074977A3 - Heat sink blade pack for device test testing - Google Patents

Heat sink blade pack for device test testing Download PDF

Info

Publication number
WO2014074977A3
WO2014074977A3 PCT/US2013/069409 US2013069409W WO2014074977A3 WO 2014074977 A3 WO2014074977 A3 WO 2014074977A3 US 2013069409 W US2013069409 W US 2013069409W WO 2014074977 A3 WO2014074977 A3 WO 2014074977A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
leg
device test
conduction layer
test testing
Prior art date
Application number
PCT/US2013/069409
Other languages
French (fr)
Other versions
WO2014074977A2 (en
Inventor
Bruce TIRADO
Scott Wu
William Su
David Ganapol
Robert P. ZALDAIN
Reid T. HIRATA
Tom LIM
Original Assignee
Marvell World Trade Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marvell World Trade Ltd. filed Critical Marvell World Trade Ltd.
Priority to CN201380069846.4A priority Critical patent/CN104919325B/en
Publication of WO2014074977A2 publication Critical patent/WO2014074977A2/en
Publication of WO2014074977A3 publication Critical patent/WO2014074977A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/003—Environmental or reliability tests
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling

Abstract

Embodiments of the present disclosure provide an apparatus (100) configured to engage a device (102, 104, 106) for testing the device via automatic test equipment (124). The apparatus (100) includes a heat sink (114), wherein the heat sink (114) comprises a plurality of fins (116) extending from the heat sink (114), and wherein the heat sink (114) is configured to engage the device (102). The apparatus (100) further includes a heat conduction layer (110) coupled to the heat sink (114), a first leg (118) coupled to the heat conduction layer (110), and a second leg (118) coupled to the heat conduction layer (110). The second leg (118) is spaced apart from the first leg (118). A vacuum path (120) is defined through (i) the heat conduction layer (110) and (ii) the heat sink (114). The vacuum path (120) permits the apparatus (100) to engage the device to be tested (102) by the automatic test equipment (124).
PCT/US2013/069409 2012-11-12 2013-11-11 Heat sink blade pack for device test testing WO2014074977A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201380069846.4A CN104919325B (en) 2012-11-12 2013-11-11 Radiator leaf packet for device under test

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201261725241P 2012-11-12 2012-11-12
US61/725,241 2012-11-12
US14/076,058 2013-11-08
US14/076,058 US9244107B2 (en) 2012-11-12 2013-11-08 Heat sink blade pack for device under test testing

Publications (2)

Publication Number Publication Date
WO2014074977A2 WO2014074977A2 (en) 2014-05-15
WO2014074977A3 true WO2014074977A3 (en) 2014-07-17

Family

ID=50681114

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2013/069409 WO2014074977A2 (en) 2012-11-12 2013-11-11 Heat sink blade pack for device test testing

Country Status (4)

Country Link
US (1) US9244107B2 (en)
CN (1) CN104919325B (en)
TW (1) TWI603100B (en)
WO (1) WO2014074977A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108037398B (en) * 2018-01-16 2023-12-05 苏州精濑光电有限公司 Aging test device and aging test method for display module

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020109518A1 (en) * 1998-11-25 2002-08-15 Advantest Corporation Device testing apparatus

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6104203A (en) * 1995-05-16 2000-08-15 Trio-Tech International Test apparatus for electronic components
GB2346703B (en) * 1997-10-07 2002-06-19 Reliability Inc Burn-in board with adaptable heat sink device
IL135485A0 (en) * 1997-10-07 2001-05-20 Reliability Inc Burn-in board capable of high power dissipation
JPH11163066A (en) * 1997-11-29 1999-06-18 Tokyo Electron Ltd Wafer tester
US6019166A (en) * 1997-12-30 2000-02-01 Intel Corporation Pickup chuck with an integral heatsink
US6415858B1 (en) * 1997-12-31 2002-07-09 Temptronic Corporation Temperature control system for a workpiece chuck
US6328096B1 (en) * 1997-12-31 2001-12-11 Temptronic Corporation Workpiece chuck
US6019164A (en) * 1997-12-31 2000-02-01 Temptronic Corporation Workpiece chuck
US6073681A (en) * 1997-12-31 2000-06-13 Temptronic Corporation Workpiece chuck
SG77182A1 (en) * 1998-05-29 2000-12-19 Advanced Systems Automation Ltd Temperature control system for test heads
US6140616A (en) * 1998-09-25 2000-10-31 Aehr Test Systems Wafer level burn-in and test thermal chuck and method
IL131591A (en) * 1999-08-25 2008-03-20 Yuval Yassour Self adaptive vacuum gripping device
US6501290B2 (en) * 1999-09-29 2002-12-31 Intel Corporation Direct to chuck coolant delivery for integrated circuit testing
US6570374B1 (en) * 2000-06-23 2003-05-27 Honeywell International Inc. Vacuum chuck with integrated electrical testing points
US6552561B2 (en) * 2000-07-10 2003-04-22 Temptronic Corporation Apparatus and method for controlling temperature in a device under test using integrated temperature sensitive diode
EP1356499A2 (en) * 2000-07-10 2003-10-29 Temptronic Corporation Wafer chuck with interleaved heating and cooling elements
US6545494B1 (en) * 2000-07-10 2003-04-08 Temptronic Corporation Apparatus and method for controlling temperature in a wafer using integrated temperature sensitive diode
US6965226B2 (en) * 2000-09-05 2005-11-15 Cascade Microtech, Inc. Chuck for holding a device under test
US6703853B1 (en) * 2001-03-19 2004-03-09 Advanced Micro Devices, Inc. Test contact mechanism
US6636062B2 (en) * 2001-04-10 2003-10-21 Delta Design, Inc. Temperature control device for an electronic component
US6628132B2 (en) * 2001-08-10 2003-09-30 Teradyne, Inc. Methods and apparatus for testing a semiconductor structure using improved temperature desoak techniques
JP2005116762A (en) * 2003-10-07 2005-04-28 Fujitsu Ltd Method for protecting semiconductor device, cover for semiconductor device, semiconductor device unit, and packaging structure of semiconductor device
US7852096B2 (en) * 2004-05-18 2010-12-14 Circuit Check Spring-loaded, removable test fixture for circuit board testers
US7567090B2 (en) * 2006-10-23 2009-07-28 International Business Machines Corporation Liquid recovery, collection method and apparatus in a non-recirculating test and burn-in application
JP4906496B2 (en) * 2006-12-25 2012-03-28 新光電気工業株式会社 Semiconductor package
JP4991495B2 (en) * 2007-11-26 2012-08-01 東京エレクトロン株式会社 Inspection holding member and manufacturing method of inspection holding member
US7777514B2 (en) * 2008-01-04 2010-08-17 Texas Instruments Incorporated Methods for transferring integrated circuits to a printed circuit board
TWI405361B (en) * 2008-12-31 2013-08-11 Ind Tech Res Inst Thermoelectric device and process thereof and stacked structure of chips and chip package structure
JP5407749B2 (en) * 2009-10-26 2014-02-05 日本電気株式会社 In-circuit test fixture cooling structure
US8686749B2 (en) * 2010-04-30 2014-04-01 International Business Machines Corporation Thermal interface material, test structure and method of use
US8471575B2 (en) * 2010-04-30 2013-06-25 International Business Machines Corporation Methodologies and test configurations for testing thermal interface materials

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020109518A1 (en) * 1998-11-25 2002-08-15 Advantest Corporation Device testing apparatus

Also Published As

Publication number Publication date
WO2014074977A2 (en) 2014-05-15
TW201437654A (en) 2014-10-01
CN104919325B (en) 2017-10-10
CN104919325A (en) 2015-09-16
TWI603100B (en) 2017-10-21
US9244107B2 (en) 2016-01-26
US20140132296A1 (en) 2014-05-15

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