WO2016099962A2 - Sensor array packaging solution - Google Patents
Sensor array packaging solution Download PDFInfo
- Publication number
- WO2016099962A2 WO2016099962A2 PCT/US2015/064002 US2015064002W WO2016099962A2 WO 2016099962 A2 WO2016099962 A2 WO 2016099962A2 US 2015064002 W US2015064002 W US 2015064002W WO 2016099962 A2 WO2016099962 A2 WO 2016099962A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sensor array
- packaging system
- core body
- structural core
- array packaging
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/04—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings formed by bundles of fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4298—Coupling light guides with opto-electronic elements coupling with non-coherent light sources and/or radiation detectors, e.g. lamps, incandescent bulbs, scintillation chambers
Definitions
- the invention is directed to a sensor array packaging system. More particularly, the invention is directed to a gigahertz sensor array packaging solution for harsh operating environments.
- a sensor array is a group of sensors deployed in a certain geometric arrangement.
- the sensor array pattern is designed to increase antenna gain in the direction of the signal while decreasing the gain in the directions of noise and interferences. In this way, the sensor array pattern is designed to increase signal-to-noise ratio.
- the sensor array is deployed in array signal processing systems.
- array signal processing systems include, for example, radar/sonar, wireless communications, seismology, machine condition monitoring and fault diagnosis, etc.
- Radar and sonar applications are typically implemented in aviation environments, including military applications. These environments can be harsh environments, for example, presenting high vibration loads, as well as extreme thermal and other environmental conditions such as high moisture conditions.
- the array signal processing systems e.g., sensors, back end electronics, power supplies, etc. generate a tremendous amount of heat.
- packaging of the sensors and other electro-optical components must protect the components from harsh environmental conditions, while still providing stiffness, relative position, and alignment of the optical interface to the camera, as well as providing heat dissipation in the smallest possible package.
- a sensor array packaging system comprises a structural core body comprising a predetermined configuration on a surface thereof and a through hole extending from the surface to a backside thereof.
- the sensor array packaging system further comprises one or more electro-optical components mounted to the backside of the structural core body.
- the sensor array packaging system further comprises a wiring board comprising a plurality of sensor array elements contacting walls of the predetermined configuration, each having a cable extending through the through hole to at least one of the one or more electro -optical components.
- a sensor array packaging system comprises a structural core body comprising: a spiral ribbon configuration on a surface thereof; a plurality of fins on the backside thereof and covered by a cover attached to the structural core body; and a through hole at a center of the spiral ribbon configuration extending from the surface to the cover.
- the sensor array packaging system further comprises one or more electro-optical components mounted to the cover.
- the sensor array packaging system further comprises a plurality of sensor array elements mounted directly to walls of the spiral ribbon configuration, where each sensor element of the plurality of sensor array elements has a fiber optical cable which is provided within the spiral ribbon configuration and passes through the through hole to at least one of the one or more electro-optical components.
- a sensor array packaging system comprises: a structural core body comprising a spiral ribbon configuration on a surface thereof, and a fin arrangement forming channels from an air inlet to an air outlet on a backside; a cover mounted to the backside of the structural core body, covering the fin arrangement; a through hole extending from the surface of the structural core body to the cover; electro-optical components mounted to the cover on the backside of the structural core body; a wiring board comprising a plurality of sensor array elements directly contacting walls of the spiral ribbon configuration, each having a cable extending through the through hole to the electro-optical components; a radome cover mounted to the structural core body which protects the wiring board and the plurality of sensor array elements; and a back cover mounted to the cover on the backside of the structural core body which protects the one or more electro-optical components.
- FIG. 1 shows a perspective view of a heat exchanger and structural support for a sensor array packaging solution in accordance with aspects of the present invention
- FIG. 2 shows a plan view of the heat exchanger and structural support for the sensor array packaging solution in accordance with aspects of the present invention
- FIG. 3 shows a cut away view of the heat exchanger and structural support, along line A-A of FIG. 2;
- FIG. 4 shows an implementation of a plurality of sensor array elements on a printed wiring board, PWB, which can be mounted to the heat exchanger and structural support shown in FIGS. 1-3;
- FIG. 5 shows an assembly process of the printed wiring board to the heat exchanger and structural support in accordance with aspects of the present invention
- FIG. 6 shows an assembled sensor array packaging solution in accordance with aspects of the present invention.
- FIGS. 7a-7d show additional array patterns for a heat exchanger and structural support in accordance with aspects of the present invention.
- the invention is directed to a sensor array packaging system. More particularly, the invention is directed to a gigahertz sensor array packaging solution for harsh operating environments. In even more specific embodiments, the invention is directed to a thermal heat exchanger and structural support for electro-optical subassemblies, e.g., sensor array elements and related optical and processing components for a sensor array.
- the thermal heat exchanger and structural support includes a core structure, preferably of metal, which includes a spiral ribbon configuration (or other configurations) for mounting of sensor array elements, e.g., front end optical module and related components mounted on a printed wiring board (PWB).
- PWB printed wiring board
- the spiral ribbon configuration or other configurations provide several advantages, including: (i) heat dissipation (heat transfer); (ii) relative location and alignment of the sensor array elements to related optical and processing components; and (iii) electrical and optical interconnects for the sensor array elements to back end electronics and optical equipment.
- the sensor array packaging system provides a packaging solution for harsh environments including, e.g., aviation and marine applications.
- the sensor array packaging system is well suited for military applications including helicopter applications which present challenging high vibration environments.
- the sensor array packaging system is robust, able to withstand harsh physical vibration and thermal environments, e.g., helicopter flight, as well as exhibits ease of manufacturing and repair.
- the sensor array packaging system also is designed with minimum mass, compared to conventional systems.
- the sensor array packaging system and, more specifically, the heat exchanger thereof can dissipate large quantities of heat generation, e.g., on the order of -330 watts or more.
- FIGS. 1 and 2 show a heat exchanger and structural support for a sensor array packaging solution in accordance with aspects of the present invention. More specifically, FIG. 1 shows a perspective view of a heat exchanger and structural support 10 for a sensor array packaging solution; whereas, FIG. 2 shows a plan view of the heat exchanger and structural support 10 for a sensor array packaging solution.
- the heat exchanger and structural support 10 includes a core structural body 15.
- the core structural body 15 acts as a main thermal and structural element of the sensor array packaging system of the present invention.
- the core structural body 15 provides thermal management and stiff structural support for electro-optical subassemblies, and supports composite housing/radome pieces that provide protection from external environments.
- the core structural body 15 minimizes structural requirements on the radome and rear cover of the assembly (see, e.g., FIG. 6).
- the core structural body 15 can be an aluminum body; although other materials are also contemplated by the present invention.
- the core structural body 15 (and other components of the heat exchanger and structural support 10) can comprise other metals, alloys, etc. which exhibit high thermal conductivity (W/(m*K)).
- the material of the heat exchanger and structural support 10 should also exhibit a high stiffness, e.g., minimal deflection on the order of about 0.0001 inch or no deflection, as well as a low mass in order to reduce weight carried by a vehicle, e.g., aircraft.
- the core structural body 15 includes a spiral ribbon configuration 20 provided on a front face thereof.
- the spiral ribbon configuration 20 can be machined from the core structural body 15, as an example; although other configurations are also contemplated by the present invention, e.g., welding or other types of bonding or attachment mechanisms.
- the structure can be manufactured in additional manners including additive manufacturing techniques and 3-D printing as further examples.
- the spiral ribbon configuration 20 and the core structural body 15 can be a single, unitary (e.g., integral) structure, hence improving heat transfer and structural support capabilities.
- other configurations are also contemplated by the present invention such as those shown in FIGS. 7a-7d, as described further herein.
- the spiral ribbon configuration 20 is configured and structured so as to provide support for a plurality of sensor array elements 50, e.g., 220 sensor array elements, and their respective fiber optical cables 55. To this end, the spiral walls of the spiral ribbon configuration 20 are spaced apart to
- the sensor array elements 50 can be thermally and structurally bonded directly to the core structural body 15, and more specifically directly to the walls of the spiral ribbon configuration 20 (or the additional configurations shown in FIGS. 7a-7d). This will, in turn, improve heat dissipation and alignment processes of the sensor array elements 50 with other electro-optical components.
- the spiral ribbon configuration 20 can also minimize deflection in critical optical image processing components.
- the spiral ribbon configuration 20 will further accommodate a wide variety of sensor patterns including the "cosine squared example shown while providing a thermal path to the heat sink, e.g., core structural body 15.
- the fiber optical cables 55 of the sensor array elements 50 can be draped and mounted to an inside curvature of the spiral ribbon configuration 20, allowing all the fiber optical cables to have equal length.
- the fiber optical cables 55 can be fed through holes in each of the spiral walls, until it reaches a center location 20a.
- the fiber optical cables 55 would also be configured to have equal length.
- the different configurations provide for a more compact and efficient method of feeding the fiber optical cables 55 of the sensor element 50 to other electronic components, compared to conventional systems.
- the fiber optical cables 55 can be wound in a spiral configuration to the center 20a of the spiral ribbon configuration 20, where they can then be fed through a machined through hole 45 (see FIG. 2) to a backside of the core structural body 15.
- the fiber optical bundles 55 terminate (co-located) into a fiber optical comb disk 55a (as shown in the inset of FIG. 2) at the center 20a of the spiral ribbon configuration 20 (or the configurations shown in FIGS. 7a- 7d).
- the fiber optical comb disk 55a can then be inserted through the machined through hole 45 in the center 20a of the spiral ribbon configuration 20.
- the fiber optical comb disk 55a can be fed to, for example, an optical camera or other electro-optical devices mounted on a backside of the core structural body 15 (see, e.g., FIG. 6).
- the machined through hole 45 is a tight-tolerance machined tube 45 with spline cuts 45a in order to maintain proper optical alignment between the optical fibers 55 and the optical camera or other electro-optical devices.
- the tight-tolerance machined tube 45 can also minimize deflections.
- a plurality of additional heat sink fins 25 can be provided on the surface of the core structural body 15.
- the heat sink fins 25 are provided remotely from the spiral ribbon configuration 20.
- these heat sink fins 25 are shown on each corner of the core structural body 15, other configurations/patterns are also contemplated by the present invention.
- the heat sink fins 25 can be placed at edges of the core structural body 15 or at alternate or other combinations of corners and sides of the core structural body 15.
- the heat sink fins 25 can be machined directly from the core structural body 15, much like the spiral ribbon configuration 20.
- the heat exchanger and structural support 10 further includes a forced convection system integrated into the core structural body 15.
- the forced convection system includes a fan system comprising one or more fans 30, air inlets 35 at a first side or edge of the core structural body 15 and air outlets 40 positioned remotely from the air inlets 35.
- the one or more fans 30 should preferably be located remotely from the air inlets 35 and adjacent to the air outlets 40.
- the present invention also contemplates other configurations such as a single fan at a first side of the core structural body 15, with the air inlets 35 at another side of the core structural body 15.
- the heat exchanger can also be designed to use forced convection from rotor downwash of a helicopter; however, the use of the forced convection system of the present invention may enable operation during ground maintenance without rotors turning.
- FIG. 3 shows a cut-away view of the heat exchanger and structural support 10, along line A-A of FIG. 2.
- the back cover of the heat exchanger and structural support 10 is removed to show the forced convection system integrated into the core structural body 15.
- the forced convection system includes a plurality of fins 35 extending from the air inlets 35 to the one or more fans 30.
- the plurality of fins 35a increases the surface area of the heat exchanger for maximum heat dissipation, while also directly channeling air to the one or more fans 30 by way of channels 35b.
- a lightweight back cover e.g., aluminum, can be provided over the plurality of fins 35.
- the fins 35a can be provided in a fanned configuration, although other configurations are also contemplated by the present invention, depending on the location of the air inlets 35 and the one or more fans 30.
- the plurality of fins 35a can create parallel channels, when the one or more fans are located on an opposite side of the air inlets 35.
- the plurality of fins 35a are positioned (e.g., routed) so as to not interfere with the feed through of the fiber optical comb disk 55a through the machined through hole 45 (which extends through the cover).
- the plurality of fins 35a can be machined from the core structural body 15, much like the spiral ribbon configuration 20.
- FIG. 4 shows a plurality of sensor array elements 50 on a printed wiring board, PWB, 60.
- the sensor array elements 50 are provided as discrete elements in a spiral pattern alignment, to match with the spiral ribbon configuration 20 of the core structural body 15.
- the spiral ribbon configuration 20 or other patterns shown in FIGS. 7a-7d
- the PWB 60 includes 220+ sensor array elements 50 held in a spiral pattern alignment, each with a fiber optical cable represented at reference numeral 55.
- the fiber optical cable 55 from each sensor element 50 should have a uniform length and terminate in a tightly tolerance array (e.g., fiber optical comb disk 55a as shown in FIG. 2) aligned with an optical camera.
- FIG. 5 shows the assembly process of the PWB 60 to the heat exchanger and structural support 10, i.e., core structural body 15.
- the sensor array elements 50 of the PWB 60 are aligned with the spiral ribbon configuration 20 (or other configurations described herein).
- the sensor array elements 50 of the PWB 60 will then be lowered and bonded directly to the walls of the spiral ribbon configuration 20.
- the PWB 60 will also be mounted directly to the front face of the core structural body 15.
- the assembly process will also include the feeding of the fiber optical cables 55 about the spiral ribbon configuration 20, extending through the machined through hole 45 as a fiber optical comb disk 55a.
- Processing/power components 65 and electro-optical components 70 can be mounted to the back cover 15a of the core structural body 15, with appropriate connection to the fiber optical comb disk 55a.
- the sensors configuration 20 may be populated prior to attachment to the heat exchanger to aid in manufacturing and repair.
- the sensors and optical fibers may be soldered to the PWB prior to attachment to the heat exchanger, and still be able to unsolder for repair of individual sensor/fiber elements within the array.
- FIG. 6 shows an assembled sensor array packaging solution in accordance with aspects of the present invention. More specifically, as shown in FIG. 6, the PWB 60 is mounted to the heat exchanger and structural support 10, i.e., core structural body 15. The sensor array elements 50 of the printed wiring board 60 are mounted directly to the walls of the spiral ribbon configuration 20, and the PWB 60 is directly mounted to the core structural body 15. The PWB 60 can be bolted to the core structural body 15;
- fastening mechanisms e.g., adhesive bond, solder, clips, screws, welding, etc.
- the fiber optical comb disk 55a is provided through the machined through hole 45 (and the cover 15a), and coupled to the back end electronics 70, via camera optics and related components.
- the back end electronics 70, e.g., electro- optical elements, and the power/processing unit 65 are mounted to the back cover 15a of the core structural body 15.
- the back end electronics 70, e.g., electro- optical elements, and the power/processing unit 65 can be bolted to the core structural body 15; although other fastening mechanisms are also contemplated by the present invention, e.g., clips, screws, etc.
- a rear cover 75 is mounted to the core structural body 15; whereas, a radome 80 is mounted to a front face of the core structural body 15.
- the rear cover 75 and radome 80 can be mounted by bolts, in a pattern dictated by electromagnetic interference (EMI).
- EMI electromagnetic interference
- FIGS. 7a-7d show different configurations as contemplated by the present invention. These different configurations include, e.g., modified spiral or radial configuration (FIGS. 7a and 7c), enlarged sunburst configuration (FIG. 7b) and compact stunburst configuration (FIG. 7d). It should be understood that the features/elements described with regard to FIGS. 1-6 can also equally be implemented in these different configurations, e.g., fiber optical comb disk, machined through hole (tight-tolerance machined tube with spline cuts), heat sink fins, etc.
- the walls can be intermittently spaced apart walls; although or can be solid walls.
- the different ribbon configurations are configured and structured so as to provide support for a plurality of sensor array elements 50, and their respective fiber optical cables.
- the walls of the each configuration are spaced apart to accommodate the sensor array elements 50 directly mounted to the walls, and their respective fiber optical cables 55.
- the sensor array elements 50 can be thermally and structurally bonded directly to the core structural body 15, and more specifically directly to the walls of the different configurations. This will, in turn, improve heat dissipation and alignment processes of the sensor array elements 50 with other electro-optical components.
- FIGS. 7a-7d can also minimize deflection in critical optical image processing components, and will further accommodate a wide variety of sensor patterns including the "cosine squared example shown while providing a thermal path to the heat sink, e.g., core structural body 15.
- the fiber optical cables 55 of the sensor array elements 50 can be draped and mounted to curvature of the configuration 20, allowing all the fiber optical cables to have equal length.
- the fiber optical cables 55 can be fed through holes in each of the walls, until it reaches a center location 20a.
- the fiber optical cables 55 would also be configured to have equal length.
- the different configurations provide for a more compact and efficient method of feeding the fiber optical cables 55 of the sensor element 50 to other electronic components, compared to conventional systems.
- the fiber optical cables 55 can be wound in the appropriate configuration to the center 20a of the each different configuration, where they can then be fed through a machined through hole 45 (see FIG. 2) to a backside of the core structural body 15.
- the present invention provides many advantages over conventional systems.
- the sensor array packaging solution of the present invention provides an integration of electro-optical integration of components into a single package which minimizes mass and assembly labor.
- the core structural body 15 becomes the "central spine" for mounting the front radome, as well as sensor array elements, fiber optics, camera, supporting electronics, cooling fans, and rear cover.
- a lightweight back cover and front radome materials are only required to protect the assembly from external environments, allowing for minimum weight.
- the integration of thermal and structural solutions into one component also minimizes mass while withstanding the harsh physical vibration and thermal environments of, e.g., helicopter flight.
- the front surface e.g., spiral ribbon
- thermoelectric configuration of the heat exchanger also provides relative location as well as electrical connection for the sensor array elements.
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA2970644A CA2970644C (en) | 2014-12-17 | 2015-12-04 | Sensor array packaging solution |
JP2017532945A JP6462884B2 (en) | 2014-12-17 | 2015-12-04 | Sensor array packaging solution |
AU2015363022A AU2015363022B2 (en) | 2014-12-17 | 2015-12-04 | Sensor array packaging solution |
EP15870686.1A EP3234981B1 (en) | 2014-12-17 | 2015-12-04 | Sensor array packaging solution |
IL252794A IL252794B (en) | 2014-12-17 | 2017-06-08 | Sensor array packaging solution |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/573,496 | 2014-12-17 | ||
US14/573,496 US9389103B1 (en) | 2014-12-17 | 2014-12-17 | Sensor array packaging solution |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2016099962A2 true WO2016099962A2 (en) | 2016-06-23 |
WO2016099962A3 WO2016099962A3 (en) | 2016-09-01 |
Family
ID=56127816
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2015/064002 WO2016099962A2 (en) | 2014-12-17 | 2015-12-04 | Sensor array packaging solution |
Country Status (7)
Country | Link |
---|---|
US (1) | US9389103B1 (en) |
EP (1) | EP3234981B1 (en) |
JP (1) | JP6462884B2 (en) |
AU (1) | AU2015363022B2 (en) |
CA (1) | CA2970644C (en) |
IL (1) | IL252794B (en) |
WO (1) | WO2016099962A2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220075056A1 (en) * | 2020-09-08 | 2022-03-10 | Anduril Industries Inc. | Millimeter wavelength radar antenna for drone interception |
Family Cites Families (18)
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US2984773A (en) | 1960-03-09 | 1961-05-16 | Cottrell Res Inc | Alternating current rectifying assembly |
US4833568A (en) | 1988-01-29 | 1989-05-23 | Berhold G Mark | Three-dimensional circuit component assembly and method corresponding thereto |
JPH03289705A (en) * | 1990-04-05 | 1991-12-19 | Toshiba Corp | Antenna system |
CA2126064A1 (en) | 1993-06-17 | 1994-12-18 | Jean-Francois Meunier | Apparatus and method for converting a visible image of an object into a digital representation |
JPH1013147A (en) * | 1996-06-26 | 1998-01-16 | Nippon Telegr & Teleph Corp <Ntt> | Satellite mount phased array feeding equipment |
US6061245A (en) * | 1998-01-22 | 2000-05-09 | International Business Machines Corporation | Free standing, three dimensional, multi-chip, carrier package with air flow baffle |
US6477479B1 (en) | 1998-12-11 | 2002-11-05 | Symyx Technologies | Sensor array for rapid materials characterization |
JP2003110330A (en) * | 2001-10-02 | 2003-04-11 | Mitsubishi Electric Corp | Antenna device |
US6781560B2 (en) * | 2002-01-30 | 2004-08-24 | Harris Corporation | Phased array antenna including archimedean spiral element array and related methods |
US6881189B2 (en) * | 2002-03-26 | 2005-04-19 | Fuji Photo Film Co., Ltd. | Ultrasonic receiving apparatus and ultrasonic receiving method |
JP2006098672A (en) * | 2004-09-29 | 2006-04-13 | Toppan Printing Co Ltd | Flexible optical board |
US20080007617A1 (en) | 2006-05-11 | 2008-01-10 | Ritchey Kurtis J | Volumetric panoramic sensor systems |
EP1988580A1 (en) | 2007-05-04 | 2008-11-05 | STMicroelectronics (Research & Development) Limited | Optical device cooling apparatus and method |
US8297790B2 (en) * | 2010-08-18 | 2012-10-30 | Lg Innotek Co., Ltd. | Lamp device |
CN103155309B (en) * | 2010-10-29 | 2016-06-01 | 古河电气工业株式会社 | Optical amplification device and light conveying system |
CN102281701A (en) | 2011-08-16 | 2011-12-14 | 吴广毅 | Three-dimensional extension helical circuit board on light emitting diode (LED) lamp and manufacturing method for three-dimensional extension helical circuit board |
CN102662132B (en) * | 2012-05-30 | 2015-09-09 | 华北电力大学(保定) | A kind of local discharge of electrical equipment localization method and system |
CN103839896A (en) | 2012-11-26 | 2014-06-04 | 飞思卡尔半导体公司 | Spiral substrate and three-dimensional packaging element having the same |
-
2014
- 2014-12-17 US US14/573,496 patent/US9389103B1/en active Active
-
2015
- 2015-12-04 JP JP2017532945A patent/JP6462884B2/en not_active Expired - Fee Related
- 2015-12-04 AU AU2015363022A patent/AU2015363022B2/en not_active Ceased
- 2015-12-04 WO PCT/US2015/064002 patent/WO2016099962A2/en active Application Filing
- 2015-12-04 EP EP15870686.1A patent/EP3234981B1/en not_active Not-in-force
- 2015-12-04 CA CA2970644A patent/CA2970644C/en not_active Expired - Fee Related
-
2017
- 2017-06-08 IL IL252794A patent/IL252794B/en unknown
Also Published As
Publication number | Publication date |
---|---|
CA2970644C (en) | 2019-01-08 |
EP3234981A2 (en) | 2017-10-25 |
US9389103B1 (en) | 2016-07-12 |
IL252794A0 (en) | 2017-08-31 |
EP3234981B1 (en) | 2019-07-17 |
IL252794B (en) | 2022-04-01 |
JP6462884B2 (en) | 2019-01-30 |
AU2015363022A1 (en) | 2017-06-22 |
JP2018508747A (en) | 2018-03-29 |
AU2015363022B2 (en) | 2018-08-09 |
CA2970644A1 (en) | 2016-06-23 |
EP3234981A4 (en) | 2018-07-11 |
WO2016099962A3 (en) | 2016-09-01 |
US20160178410A1 (en) | 2016-06-23 |
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