WO2016099962A3 - Sensor array packaging solution - Google Patents

Sensor array packaging solution Download PDF

Info

Publication number
WO2016099962A3
WO2016099962A3 PCT/US2015/064002 US2015064002W WO2016099962A3 WO 2016099962 A3 WO2016099962 A3 WO 2016099962A3 US 2015064002 W US2015064002 W US 2015064002W WO 2016099962 A3 WO2016099962 A3 WO 2016099962A3
Authority
WO
WIPO (PCT)
Prior art keywords
sensor array
array packaging
packaging system
packaging solution
backside
Prior art date
Application number
PCT/US2015/064002
Other languages
French (fr)
Other versions
WO2016099962A2 (en
Inventor
James E. Bishop
Allan Johnson
Brian Kaplun
Steven E. MCELWAIN, Jr.
David L. Vos
Original Assignee
Lockheed Martin Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lockheed Martin Corporation filed Critical Lockheed Martin Corporation
Priority to CA2970644A priority Critical patent/CA2970644C/en
Priority to JP2017532945A priority patent/JP6462884B2/en
Priority to AU2015363022A priority patent/AU2015363022B2/en
Priority to EP15870686.1A priority patent/EP3234981B1/en
Publication of WO2016099962A2 publication Critical patent/WO2016099962A2/en
Publication of WO2016099962A3 publication Critical patent/WO2016099962A3/en
Priority to IL252794A priority patent/IL252794B/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01DMEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24Housings ; Casings for instruments
    • G01D11/245Housings for sensors
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/04Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings formed by bundles of fibres
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4298Coupling light guides with opto-electronic elements coupling with non-coherent light sources and/or radiation detectors, e.g. lamps, incandescent bulbs, scintillation chambers

Abstract

A gigahertz sensor array packaging solution for harsh operating environments is disclosed. The sensor array packaging system includes a structural core body comprising sensor mounting features on a surface thereof and an alignment through hole extending from the surface to a backside thereof which incorporates finned features providing cooling and stiffness. The sensor array packaging system further includes one or more electro-optical components mounted to the backside of the structural core body. The sensor array packaging system further includes a wiring board comprising a plurality of sensor array elements contacting walls of the spiral ribbon configuration, each having a cable extending through the through hole to at least one of the one or more electro-optical components.
PCT/US2015/064002 2014-12-17 2015-12-04 Sensor array packaging solution WO2016099962A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CA2970644A CA2970644C (en) 2014-12-17 2015-12-04 Sensor array packaging solution
JP2017532945A JP6462884B2 (en) 2014-12-17 2015-12-04 Sensor array packaging solution
AU2015363022A AU2015363022B2 (en) 2014-12-17 2015-12-04 Sensor array packaging solution
EP15870686.1A EP3234981B1 (en) 2014-12-17 2015-12-04 Sensor array packaging solution
IL252794A IL252794B (en) 2014-12-17 2017-06-08 Sensor array packaging solution

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/573,496 2014-12-17
US14/573,496 US9389103B1 (en) 2014-12-17 2014-12-17 Sensor array packaging solution

Publications (2)

Publication Number Publication Date
WO2016099962A2 WO2016099962A2 (en) 2016-06-23
WO2016099962A3 true WO2016099962A3 (en) 2016-09-01

Family

ID=56127816

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2015/064002 WO2016099962A2 (en) 2014-12-17 2015-12-04 Sensor array packaging solution

Country Status (7)

Country Link
US (1) US9389103B1 (en)
EP (1) EP3234981B1 (en)
JP (1) JP6462884B2 (en)
AU (1) AU2015363022B2 (en)
CA (1) CA2970644C (en)
IL (1) IL252794B (en)
WO (1) WO2016099962A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220075056A1 (en) * 2020-09-08 2022-03-10 Anduril Industries Inc. Millimeter wavelength radar antenna for drone interception

Citations (3)

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Publication number Priority date Publication date Assignee Title
US20110222307A1 (en) * 2010-08-18 2011-09-15 Kong Kyung-Il Lamp device
US20130235449A1 (en) * 2010-10-29 2013-09-12 Furukawa Electric Co., Ltd. Optical Amplifier and Optical Transmission System
US20140146497A1 (en) * 2012-11-26 2014-05-29 Huan WANG Helix substrate and three-dimensional package with same

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US2984773A (en) 1960-03-09 1961-05-16 Cottrell Res Inc Alternating current rectifying assembly
US4833568A (en) 1988-01-29 1989-05-23 Berhold G Mark Three-dimensional circuit component assembly and method corresponding thereto
JPH03289705A (en) * 1990-04-05 1991-12-19 Toshiba Corp Antenna system
CA2126064A1 (en) 1993-06-17 1994-12-18 Jean-Francois Meunier Apparatus and method for converting a visible image of an object into a digital representation
JPH1013147A (en) * 1996-06-26 1998-01-16 Nippon Telegr & Teleph Corp <Ntt> Satellite mount phased array feeding equipment
US6061245A (en) * 1998-01-22 2000-05-09 International Business Machines Corporation Free standing, three dimensional, multi-chip, carrier package with air flow baffle
US6477479B1 (en) 1998-12-11 2002-11-05 Symyx Technologies Sensor array for rapid materials characterization
JP2003110330A (en) * 2001-10-02 2003-04-11 Mitsubishi Electric Corp Antenna device
US6781560B2 (en) * 2002-01-30 2004-08-24 Harris Corporation Phased array antenna including archimedean spiral element array and related methods
US6881189B2 (en) * 2002-03-26 2005-04-19 Fuji Photo Film Co., Ltd. Ultrasonic receiving apparatus and ultrasonic receiving method
JP2006098672A (en) * 2004-09-29 2006-04-13 Toppan Printing Co Ltd Flexible optical board
US20080007617A1 (en) 2006-05-11 2008-01-10 Ritchey Kurtis J Volumetric panoramic sensor systems
EP1988580A1 (en) 2007-05-04 2008-11-05 STMicroelectronics (Research & Development) Limited Optical device cooling apparatus and method
CN102281701A (en) 2011-08-16 2011-12-14 吴广毅 Three-dimensional extension helical circuit board on light emitting diode (LED) lamp and manufacturing method for three-dimensional extension helical circuit board
CN102662132B (en) * 2012-05-30 2015-09-09 华北电力大学(保定) A kind of local discharge of electrical equipment localization method and system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110222307A1 (en) * 2010-08-18 2011-09-15 Kong Kyung-Il Lamp device
US20130235449A1 (en) * 2010-10-29 2013-09-12 Furukawa Electric Co., Ltd. Optical Amplifier and Optical Transmission System
US20140146497A1 (en) * 2012-11-26 2014-05-29 Huan WANG Helix substrate and three-dimensional package with same

Also Published As

Publication number Publication date
CA2970644C (en) 2019-01-08
EP3234981A2 (en) 2017-10-25
US9389103B1 (en) 2016-07-12
IL252794A0 (en) 2017-08-31
EP3234981B1 (en) 2019-07-17
IL252794B (en) 2022-04-01
JP6462884B2 (en) 2019-01-30
AU2015363022A1 (en) 2017-06-22
JP2018508747A (en) 2018-03-29
AU2015363022B2 (en) 2018-08-09
CA2970644A1 (en) 2016-06-23
EP3234981A4 (en) 2018-07-11
US20160178410A1 (en) 2016-06-23
WO2016099962A2 (en) 2016-06-23

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