WO2016163101A1

WO2016163101A1 - Fluidic assembly top-contact led disk

Info

Publication number: WO2016163101A1
Application number: PCT/JP2016/001820
Authority: WO
Inventors: Changqing Zhan; Paul John Schuele; Mark Albert Crowder
Original assignee: Sharp Kabushiki Kaisha
Priority date: 2015-04-07
Filing date: 2016-03-29
Publication date: 2016-10-13
Also published as: CN107431106A; CN107431106B

Abstract

A method is provided for forming a direct emission display. The method provides a transparent substrate with an array of wells formed in its top surface. A fluid stream is supplied to the substrate top surface comprising a plurality of top-contact light emitting diode (LED) disks. The wells are filled with the LED disks. A first array of electrically conductive lines is formed over the substrate top surface to connect with a first contact of each LED disk, and a second array of electrically conductive lines is formed over the substrate top surface to connect with a second contact of each LED disk. An insulator over the disk exposes an upper disk (e.g., p-doped) contact region. A via is formed through the disk, exposing a center contact region of a lower (e.g., n-doped) disk contact region. Also provided are a top-contact LED disk and direct emission display.

Description

FLUIDIC ASSEMBLY TOP-CONTACT LED DISK

This invention generally relates to integrated circuit (IC) fabrication and, more particularly, to a fluidic assembly process for the placement of top-contact light emitting diodes on a transparent display substrate.

There are three major processes in the fabrication of gallium nitride (GaN) micro light emitting diode (μLED) disks for use in direct emission displays. These processes are: GaN μLED disk fabrication; GaN μLED disk distribution onto a transparent substrate; and, GaN μLED disk interconnection.

Since μLED disks distribute themselves randomly inside transparent substrate placement wells, it makes conventional IC style contact hole opening/metal interconnection design extremely challenging. Extra tolerances are required in the (opaque) interconnections to address this random distribution, resulting in a substantial loss in the emission area fill factor. Further, the complexity required to make these connections results in either a poor yield and/or high cost.

Figs. 1A and 1B are plan views of a top-contact LED disk located in a substrate well (prior art). In Fig. 1A, D_d denotes the diameter of the LED (e.g., gallium nitride (GaN)) disk, D_c denotes the diameter of the micro-cavity or well into which the μLED disk has been distributed, and D_p denotes the diameter of the p-doped GaN (p-GaN) area, assuming the p-GaN is formed on the top of the disk. Area 100 is the n-GaN contact, where the p-GaN 102 and MQW have been removed by a reactive ion etch (RIE). The inner circular area 102 is the full LED stack with p-GaN on top. A layer of nickel oxide (NiOx) / indium tin oxide (ITO) may be formed on the surface of area 102. In considering typical photolithography misalignment tolerances (up to 2 microns (μm)), the circular area 102 is off the GaN disk center by 2 μm. Since only the area 102 can emit light, the emission area fill factor is only about 70.6%. Nearly 30% of emission area is lost due to the n-GaN opening 100.

Fig. 1B shows the working area for anode end connection 104 (Dpc). Connects made outside of the 24 μm diameter area 104 are likely to result in either a short circuit or open circuit. Conventional metal interconnection to the n-GaN area 102 further reduces the emission area fill factor. Only 31.4% area of the GaN disk will emit light in this example.

Fig. 2 is a partial cross-sectional view of a bottom cathode contact architecture (prior art). This option avoids the significant emission area fill factor loss associated with a conventional top-contact LED disk. A bottom interconnection electrode 200 is first evaporated and patterned on a substrate 202, followed by micro-cavity (well) 204 formation. A thin layer low melting temperature metal film 206 is then coated on the bottom electrode surface inside the micro-cavity 204. The GaN disk 208 (n-GaN 210 / p-GaN 212) is then distributed into the micro-cavity 204. After the interlayer dielectric film 214 patterning, the top interconnection electrode 216 is evaporated and patterned to complete the whole process flow.

The process flow described by Fig. 2 is relatively simple. The front-side emission area fill factor can possible reach a maximum of 85% with a carefully top metal wiring design. Major challenges of this flow include the bottom contact yield, uniformity, reliability and repeatability, and the tradeoff between the bottom contact yield and the bottom electrode area if a backside emission opening is needed.

It would be advantageous if a high emission area fill factor could be obtained with a top-contact LED using a simple fabrication process.

According to the present invention, there is a provided a top-contact light emitting diode (LED), the LED comprising: a lower disk comprising a material with a dopant selected from a group consisting of a p-dopant or an n-dopant, having a bottom surface and a top surface; a multiple quantum well (MQW) disk overlying the lower disk top surface; an upper disk comprising a material with an unselected dopant, having a bottom surface overlying the MQW disk, a top surface, and a first diameter; an electrical insulator disk overlying the upper disk top surface, having a second diameter smaller than the first diameter, exposing an upper disk contact region; and, a via formed through the electrical insulator disk, upper disk, and MQW disk, exposing a center contact region of the lower disk top surface.

According to the present invention, there is a provided a direct emission display comprising: a transparent substrate with a top surface comprising an array of wells; a top-contact LED formed in each well, each LED comprising: a lower disk comprising a material with a dopant selected from a group consisting of a p-dopant or an n-dopant, having a bottom surface, and a top surface; a multiple quantum well (MQW) disk overlying the lower disk; an upper disk comprising a material with an unselected dopant, having a bottom surface overlying the MQW disk, a top surface, and a first diameter; an electrical insulator disk overlying the upper disk top surface, having a second diameter smaller than the first diameter, exposing an upper disk contact region; a via formed through the electrical insulator disk, upper disk, and MQW disk, exposing a center contact region of the lower disk top surface; a first array of electrically conductive lines connected to the LED lower disk contact regions; a second array of electrically conductive lines connected to the LED upper disk contact regions; and, a dielectric material interposed between the first and second array of electrically conductive lines.

According to the present invention, there is a provided a method for forming a direct emission display: providing a transparent substrate with an array of wells formed in a top surface; supplying a fluid stream to the substrate top surface comprising a plurality of top-contact light emitting diode (LED) disks; filling the wells with the LED disks; forming a dielectric extension overlying a portion of an upper disk contact region of the LEDs; forming a first array of electrically conductive lines over the substrate top surface to connect with a first contact of each LED disk; and, forming a second array of electrically conductive lines over the substrate top surface to connect with a second contact of each LED disk.

Figs. 1A is plan view of a top-contact LED disk located in a substrate well (prior art). Figs. 1B is plan view of a top-contact LED disk located in a substrate well (prior art). Fig. 2 is a partial cross-sectional view of a bottom cathode contact architecture (prior art). Figs. 3A is partial cross-sectional view of a top-contact LED. Figs. 3B is plan view of a top-contact LED. Fig. 4A is a partial cross-sectional view. Figs. 4B is a plan view of a direct emission display. Figs. 4C is a plan view of a direct emission display. Figs. 5A is a partial cross-section view summarizing the major process step in an exemplary display fabrication process. Figs. 5B is a partial cross-section view summarizing the major process step in an exemplary display fabrication process. Figs. 5C is a partial cross-section view summarizing the major process step in an exemplary display fabrication process. Figs. 5D is a partial cross-section view summarizing the major process step in an exemplary display fabrication process. Figs. 5E is a partial cross-section view summarizing the major process step in an exemplary display fabrication process. Figs. 5F is a partial cross-section view summarizing the major process step in an exemplary display fabrication process. Fig. 6 is another plan view depicting of the LED disk situated is a substrate well. Fig.7A is a plan view illustrating eight worst-case positions for an LED disk inside a micro-cavity. Fig.7B is a plan view illustrating eight worst-case positions for an LED disk inside a micro-cavity. Fig.7 C is a plan view illustrating eight worst-case positions for an LED disk inside a micro-cavity. Fig.7D is a plan view illustrating eight worst-case positions for an LED disk inside a micro-cavity. Fig.7E is a plan view illustrating eight worst-case positions for an LED disk inside a micro-cavity. Fig.7F is a plan view illustrating eight worst-case positions for an LED disk inside a micro-cavity. Fig. 7G is a plan view illustrating eight worst-case positions for an LED disk inside a micro-cavity. Fig. 7H is a plan view illustrating eight worst-case positions for an LED disk inside a micro-cavity. Fig. 8 is a flowchart illustrating a method for forming a direct emission display.

Disclosed herein is a light emitting diode (LED) disk and display design that permit the following advantages:
Top connections for both cathode and anode;
A interconnection process flow that is at least as simple as the bottom contact flow process;
A minimum number of interlayer dielectric (ILD) and metal layers; and,
A limited fill factor loss.

The architecture starts with a new LED μdisk structure. Two features help to enable the new approach. One is a center contact opening to the lower (e.g., n-doped) disk of the LED and a dielectric (e.g., tetraethyl orthosilicate (TEOS) SiO₂) isolation pattern in the form of a ring overlying the LED disk, exposing an upper (e.g., n-doped) disk contact region. Comparing to the edge circular opening of the n-GaN disk depicted in Fig. 1A with the same diameter and a 30% fill factor loss, the small center opening of the disk disclosed herein results an emission area fill factor loss as small as 3%. The completed LED μdisks may be harvested using laser liftoff and formed as an ink in solvent for micro fluidic distribution.

Accordingly, a method is provided for forming a direct emission display. The method provides a transparent substrate with an array of wells or micro-cavities formed in its top surface. A fluid stream is supplied to the substrate top surface comprising a plurality of top-contact light emitting diode (LED) disks. The wells are filled with the LED disks. After forming a dielectric extension to cover a portion of an upper disk contact region, a first array of electrically conductive lines is formed over the substrate top surface to connect with a first (e.g., lower disk) contact of each LED disk, and a second array of electrically conductive lines is formed over the substrate top surface to connect with a second (e.g., upper disk) contact of each LED disk.

Each LED disk is made up of a lower disk of material with either a p-dopant or an n-dopant, having a bottom surface, and a top surface. A multiple quantum well (MQW) disk overlies the lower disk. An upper disk made from a material with the opposite of the dopant used in the lower disk, and has a bottom surface overlying the MQW disk, a top surface, and a first diameter. An electrical insulator disk overlies the upper disk top surface, having a second diameter smaller than the first diameter, exposing an upper disk contact region. A via is formed through the electrical insulator disk, upper disk, and MQW disk, exposing a center contact region of the lower disk top surface.

If the substrate wells have a third diameter, the first array of electrically conductive lines form a pair of opposing top disk contact arms overlying each well to form a connection with the upper disk, with each top-contact arm having a length of x extending over the well, where x greater than (the third diameter - first diameter)/2. Further, if the lower disk contact region has a fourth diameter, the second array of electrically conductive lines form a bottom disk contact arm overlying each well. Each bottom disk contact arm has a length of y extending over the well and dielectric extension, where y is greater than (the third diameter + the fourth diameter)/2.

Additional details of the above-described method, a top-contact LED, and direct emission display made from top-contact LEDs are provided below.

Figs. 3A and 3B are partial cross-sectional and plan views, respectively, of a top-contact LED. The LED 300 comprises a lower disk 302 comprising a material with either a p-dopant or an n-dopant, having a bottom surface 304 and a top surface 306. A multiple quantum well (MQW) disk 308 overlies the lower disk top surface 306. The MQW layer 308 may typically be a series of quantum well shells (typically 5 layers - e.g., alternating 5 nm of indium gallium nitride (InGaN) with 9 nm of n-doped GaN (n-GaN)) not shown. There may also be an aluminum gallium nitride (AlGaN) electron blocking layer (not shown) between MQW layers and the p-doped disk. The outer shell may be p-doped GaN (Mg doping) about 200 nm thick. A high-brightness blue LED can be formed, or a green LED if a higher indium content is used in the MQW.

An upper disk 310 comprises a material with the opposite dopant that is used in the lower disk. If the lower dick 302 is p-doped then the upper disk 310 is n-doped. Likewise, if the lower disk 302 is n-doped, the upper disk 310 is p-doped. The upper disk 310 has a bottom surface 312 overlying the MQW disk 308, a top surface 314, and a first diameter 316. The lower disk may be a material such as p-GaN, p-doped aluminum gallium indium phosphide (p-AlGaInP), n-GaN, or n-AlGaInP. The upper disk 310 could be made of the same materials, but oppositely doped. Note: this is not an exhaustive list of material types.

An electrical insulator disk 318 overlies the upper disk top surface 314, having a second diameter 320 smaller than the first diameter 316, exposing an upper disk contact region 322. Typically, the electrical insulator disk 318 is transparent, and may be a dielectric material such as TEOS silicon dioxide. A via 324 is formed through the electrical insulator disk 318, upper disk 310, and MQW disk 308, exposing a center contact region 326 of the lower disk top surface.

In one aspect as shown, the electrical insulator disk 318 has a center 328 overlying the upper disk center 330. The upper disk contact region 322 is formed around a circumference of the upper disk top surface 314.

Fig. 4A is a partial cross-sectional view, and Figs. 4B and 4C are plan views of a direct emission display. Fig. 4B depicts an exemplary layout design of a 2×3 LED disk direct emission display pixel array. Each pixel 430 is composed of four LED disks 300 for brightness and redundancy management. The serpentine extensions of the second array 410 wiring are designed for trimming off “dead” LED disks from the array. However, the design is not dependent upon any particular grouping of LEDs or the shape of the wiring interconnects.

As shown in Fig. 4A, the display 400 comprises a transparent substrate 402 with a top surface 404 comprising an array of wells or micro-cavities 406. A top-contact LED 300 is formed in each well 406. Details of the top-contact LED 300 have been provided above in the explanation of Figs. 3A and 3B, and are not repeated here in the interest of brevity. A first array of electrically conductive lines 408 is connected to the LED lower disk contact regions 326. A second array of electrically conductive lines 410 is connected to the LED upper disk contact regions 322. A dielectric material 412 is interposed between the first array 408 and second array 410 of electrically conductive lines. It should be understood that the overlying order of the conductive arrays is arbitrary. Typically, the electrical insulator disk (see Fig. 3A) and the dielectric 412 are transparent to visible spectrums of light.

Each well 406 has a third diameter 414. The first array of electrically conductive lines forms a pair of opposing top disk contact arms 416 overlying each well 406. Each top disk contact arm 416 has a length 418 of x extending over the well 406, where x greater than (the third diameter 414 - first diameter 316)/2. The lower disk contact region 326 has a fourth diameter 420. The second array of electrically conductive lines forms a bottom disk contact arm 422 overlying each well 406. Each bottom disk contact arm 422 has a length 424 of y extending over the well 406 and a dielectric extension 426, where y is greater than (the third diameter 414 + the fourth diameter 420)/2. As shown, the bottom disk contact arm 422 is typically orthogonal to both top disk contact arms 416 in each well 406.

The fabrication process flow is very similar to the bottom contact option, which has the advantage of simplicity. The fabrication process does not use any more dielectric film or metal film layers than the bottom contact process, and no additional photolithography steps are needed. In fact, the top-contact fabrication process eliminates a low melting temperature metal film coating step (see reference designator 206 of Fig. 2) that is needed for the bottom contact process. In summary, a display fabrication process using the LED disks disclosed herein permits top connections for both cathode and anode of each LED. The interconnection flow is as least as simple as a bottom contact flow process, with a minimum number of ILD and metal layers, and a limited fill factor loss.

Figs. 5A through 5F are partial cross-section views summarizing the major process steps in an exemplary display fabrication process. Fig. 5A depicts a transparent substrate and in Fig. 5B the first array of electrical connections 408 (bottom electrode) is formed. Typically, the array is formed using a conformal deposition, followed by patterning. The size of the cell or pixel may, for example, be 500 microns by 500 microns. In Fig. 5C a dry film 500 is deposited and patterned to form a well 406. In other processes, the well may be formed by etching cavities in the substrate top surface. In Fig. 5D the LED disk 300 is situated in the well 406, typically through a fluidic distribution process. In Fig. 5E a dielectric 426 such as polyimide is deposited and patterned around the edges of the LED, also forming the dielectric extension over the upper disk contact region, as shown in Fig. 4C. In Fig. 5F top metallization forms the bottom disk contact arm 422. The top disk contact arms, not shown in the view, may be formed at this time or in a separate step.

Fig. 6 is another plan view depicting of the LED disk situated is a substrate well. As an example, the center low disk contact may be 5 um and a TEOS SiO₂ insulation disk 318 may have outer (second) diameter 320 of 30 μm. Comparing the edge circular opening to the n-GaN in Fig. 1A (reference designator 100), on the same 50 μm diameter GaN μdisk with 30% fill factor loss, the small center opening depicted here causes as little as a 3% emission area fill factor loss. The dielectric (e.g., polyimide) extension 426 works together with the built-in TEOS SiO2 insulation circular disk 318 to form an electrical isolation bridge for a top metal wiring (bottom disk contact arm 422) to reach the contact 326 in the center of the GaN μdisk. The polyimide extension 426 and the SiO₂ ring 318 on the disk are designed so that no matter how the GaN μdisk is distributed inside the micro-cavity, short circuits are prevented while guaranteeing valid contacts to the LED disk.

Two upper disk contact arms 416 are used. If the LED μdisk is located on-center in the micro-cavity, as shown, both arms 416 form a valid contact to the upper disk 310. Even if the LED disk is located off-center, at least one arm 416 contacts the upper disk 310 to guarantee a connection.

Regarding emission area fill factor, for backside emission applications there is no fill factor loss. For front-side emission applications, the loss is just the total non-transparent metal wiring areas, which in this design is about 18%. This new design has an emission area fill factor similar to the bottom contact architecture for front-side emission, and a significantly superior emission area fill factor for backside emission. This enables more freedom in light management by enabling the use of dummy metal patterns on the bottom, or on the top, or on both.

Figs. 7A through 7H are plan views illustrating eight worst-case positions for an LED disk inside a micro-cavity. In every case, wiring contact is always made with each lower disk contact region 326 of the LED. In every case, the dielectric extension 426 and insulation disk 318 prevent short circuits. In any possible case, at least one upper disk contact arm 416 connects to the upper disk contact region 322 of each LED.

Fig. 8 is a flowchart illustrating a method for forming a direct emission display. Although the method is depicted as a sequence of numbered steps for clarity, the numbering does not necessarily dictate the order of the steps. It should be understood that some of these steps may be skipped, performed in parallel, or performed without the requirement of maintaining a strict order of sequence. Generally however, the method follows the numeric order of the depicted steps and can be better appreciated in context of the explanation of Figs. 3A through 7H. The method starts at Step 800.

Step 802 provides a transparent substrate with an array of wells formed in a top surface. The wells or micro-cavities can be formed by patterned deposition or etching. Step 804 supplies a fluid stream to the substrate top surface comprising a plurality of top-contact LED disks. Otherwise, Step 804 can be enabled using a pick-and-place process. Step 806 fills the wells with the LED disks. Step 808 forms a dielectric extension overlying a portion of an upper disk contact region of the LEDs. Step 810 forms a first array of electrically conductive lines over the substrate top surface to connect with a first contact of each LED disk. Step 812 forms a second array of electrically conductive lines over the substrate top surface to connect with a second contact of each LED disk. Note: Step 812 may be performed before Step 810 in some aspects.

Supplying the LED disks in Step 804 may include supplying LED disks as described above in the description of Figs. 3A and 3B. That is, the LED disks comprise a lower disk comprising a material with a dopant selected to be either a p-dopant or an n-dopant, having a bottom surface and a top surface. A MQW disk overlies the lower disk. An upper disk comprises a material with the unselected dopant, having a bottom surface that overlies the MQW disk, a top surface, and a first diameter. Specific upper and lower disk materials have been mentioned above. An electrical insulator (e.g. transparent) disk overlies the upper disk top surface, having a second diameter smaller than the first diameter. In one aspect, the electrical insulating disk is centered on the upper disk. A via is formed through the electrical insulator disk, upper disk, and MQW disk, exposing a center contact region of the lower disk top surface.

In one aspect, providing the transparent substrate in Step 802 includes providing a substrate with wells having a third diameter. Then, forming the first array of electrically conductive lines in Step 810 includes forming a pair of opposing top disk contact arms overlying each well. Each top disk contact arm has a length of x extending over the well, where x greater than (the third diameter - first diameter)/2.

In another aspect, supplying the LED disks in Step 804 includes the lower disk contact region having a fourth diameter. Then, forming the second array of electrically conductive lines in Step 812 includes forming a bottom disk contact arm overlying each well. Each bottom disk contact arm has a length of y extending over the well and dielectric extension, where y is greater than (the third diameter + the fourth diameter)/2.

An LED disk, direct emission display, and direct emission display fabrication method have been provided. Examples of particular materials and process steps have been presented to illustrate the invention. However, the invention is not limited to merely these examples. Other variations and embodiments of the invention will occur to those skilled in the art.

This application is a Continuation-in-part of an application entitled, COUNTERBORE POCKET STRUCTURE FOR FLUIDIC ASSEMBLY, invented by Changqing Zhan et al., Serial No. 14/530,230, filed 10/31/2014, attorney docket no. SLA3469;
which is a Continuation-in-part of an application entitled, LIGHT EMITTING DIODE (LED) USING THREE-DIMENSIONAL GALLIUM NITRIDE (GaN) PILLAR STRUCTURES, invented by M. Albert Crowder et al., Serial No. 14/088,374, filed 11/23/2013, attorney docket no. SLA3086.2;
which is a Continuation of an application entitled, LIGHT EMITTING DIODE (LED) USING THREE-DIMENSIONAL GALLIUM NITRIDE (GaN) PILLAR STRUCTURES WITH PLANAR SURFACES, invented by M. Albert Crowder et al., Serial No. 13/367,120, filed 2/6/2012, attorney docket no. SLA3086.1;
which is a Continuation-in-Part of an application entitled, METHOD FOR FABRICATING THREE-DIMENSIONAL GALLIUM NITRIDE STRUCTURES WITH PLANAR SURFACES, invented by M. Albert Crowder et al., Serial No. 13/337,843, filed 12/27/2011, attorney docket no. SLA3086. All these applications are incorporated herein by reference.

Claims

A top-contact light emitting diode (LED), the LED comprising:
a lower disk comprising a material with a dopant selected from a group consisting of a p-dopant or an n-dopant, having a bottom surface and a top surface;
a multiple quantum well (MQW) disk overlying the lower disk top surface;
an upper disk comprising a material with an unselected dopant, having a bottom surface overlying the MQW disk, a top surface, and a first diameter;
an electrical insulator disk overlying the upper disk top surface, having a second diameter smaller than the first diameter, exposing an upper disk contact region; and,
a via formed through the electrical insulator disk, upper disk, and MQW disk, exposing a center contact region of the lower disk top surface.
The LED of claim 1 wherein the electrical insulator disk is transparent.
The LED of claim 1 or 2 wherein the lower disk is a material selected from a group consisting of p-doped gallium nitride (p-GaN), p-doped aluminum gallium indium phosphide (p-AlGaInP), n-doped GaN (n-GaN), and n-AlGaInP; and,
wherein the upper disk is an unselected material.
The LED of any one of claims 1 through 3 wherein the electrical insulator disk has a center overlying an upper disk center; and,
wherein the upper disk contact region is formed around a circumference of the upper disk top surface.
A direct emission display comprising:
a transparent substrate with a top surface comprising an array of wells;
a top-contact LED formed in each well, each LED comprising:
a lower disk comprising a material with a dopant selected from a group consisting of a p-dopant or an n-dopant, having a bottom surface, and a top surface;
a multiple quantum well (MQW) disk overlying the lower disk;
an upper disk comprising a material with an unselected dopant, having a bottom surface overlying the MQW disk, a top surface, and a first diameter;
an electrical insulator disk overlying the upper disk top surface, having a second diameter smaller than the first diameter, exposing an upper disk contact region;
a via formed through the electrical insulator disk, upper disk, and MQW disk, exposing a center contact region of the lower disk top surface;
a first array of electrically conductive lines connected to the LED lower disk contact regions;
a second array of electrically conductive lines connected to the LED upper disk contact regions; and,
a dielectric material interposed between the first and second array of electrically conductive lines.
The display of claim 5 wherein the electrical insulator disk and dielectric are transparent.
The display of claim 5 or 6 wherein the lower disk is a material selected from a group consisting of p-doped gallium nitride (p-GaN), p-doped aluminum gallium indium phosphide (p-AlGaInP), n-doped GaN (n-GaN), and n-AlGaInP; and,
wherein the upper disk is an unselected material.
The display of any one of claims 5 through 7 wherein the electrical insulator disk has a center overlying an upper disk center;
wherein the upper disk contact region is formed around a circumference of the upper disk top surface; and,
the display further comprising:
a dielectric extension formed over a region of the upper disk contact region.
The display of any one of claims 5 through 8 wherein each well has a third diameter; and,
wherein the first array of electrically conductive lines form a pair of opposing top disk contact arms overlying each well, each top disk contact arm having a length of x extending over the well, where x greater than (the third diameter - first diameter)/2.
The display of claim 9 wherein the lower disk contact region has a fourth diameter; and,
wherein the second array of electrically conductive lines form a bottom disk contact arm overlying each well, each bottom disk contact arm having a length of y extending over the well and the dielectric extension, where y is greater than (the third diameter + the fourth diameter)/2.
The display of claim 10 wherein the bottom disk contact arm is orthogonal to both top disk contact arms in each well.
The display of claim 5 where the electrical insulator disk is transparent.
A method for forming a direct emission display:
providing a transparent substrate with an array of wells formed in a top surface;
supplying a fluid stream to the substrate top surface comprising a plurality of top-contact light emitting diode (LED) disks;
filling the wells with the LED disks;
forming a dielectric extension overlying a portion of an upper disk contact region of the LEDs;
forming a first array of electrically conductive lines over the substrate top surface to connect with a first contact of each LED disk; and,
forming a second array of electrically conductive lines over the substrate top surface to connect with a second contact of each LED disk.
The method of claim 13 wherein supplying the LED disks includes each LED disk comprising:
a lower disk comprising a material with a dopant selected from a group consisting of a p-dopant or an n-dopant, having a bottom surface, and a top surface;
a multiple quantum well (MQW) disk overlying the lower disk;
an upper disk comprising a material with an unselected dopant, having a bottom surface overlying the MQW disk, a top surface, and a first diameter;
an electrical insulator disk overlying the upper disk top surface, having a second diameter smaller than the first diameter; and,
a via formed through the electrical insulator disk, upper disk, and MQW disk, exposing a center contact region of the lower disk top surface.
The method of claim 14 wherein providing the transparent substrate includes providing a substrate with wells having a third diameter; and,
wherein forming the first array of electrically conductive lines includes forming a pair of opposing top disk contact arms overlying each well, each top disk contact arm having a length of x extending over the well, where x greater than (the third diameter - first diameter)/2.
The method of claim 15 wherein supplying the LED disks includes the lower disk contact region having a fourth diameter; and,
wherein forming the second array of electrically conductive lines includes forming a bottom disk contact arm overlying each well, each bottom disk contact arm having a length of y extending over the well and dielectric extension, where y is greater than (the third diameter + the fourth diameter)/2.
The method of any one of claims 14 through 16 wherein the lower disk is a material selected from a group consisting of p-doped gallium nitride (p-GaN), p-doped aluminum gallium indium phosphide (p-AlGaInP), n-doped GaN (n-GaN), and n-AlGaInP; and,
wherein the upper disk is an unselected material.
The method of any one of claims 14 through 17 wherein the electrical insulator disk has a center overlying a upper disk center; and,
wherein the upper disk contact region is formed around a circumference of the upper disk top surface.
The method of claim 16 wherein the bottom disk contact arm is orthogonal to both top disk contact arms in each well.
The method of any one of claims 14 through 19 where the electrical insulator disk is transparent.