WO2016179753A1 - Embedded circuit board patch structure and manufacturing method thereof - Google Patents

Embedded circuit board patch structure and manufacturing method thereof Download PDF

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Publication number
WO2016179753A1
WO2016179753A1 PCT/CN2015/078582 CN2015078582W WO2016179753A1 WO 2016179753 A1 WO2016179753 A1 WO 2016179753A1 CN 2015078582 W CN2015078582 W CN 2015078582W WO 2016179753 A1 WO2016179753 A1 WO 2016179753A1
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WO
WIPO (PCT)
Prior art keywords
electronic device
circuit board
board body
pad
mounting space
Prior art date
Application number
PCT/CN2015/078582
Other languages
French (fr)
Chinese (zh)
Inventor
方丽文
林梓梁
Original Assignee
方丽文
林梓梁
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 方丽文, 林梓梁 filed Critical 方丽文
Priority to PCT/CN2015/078582 priority Critical patent/WO2016179753A1/en
Publication of WO2016179753A1 publication Critical patent/WO2016179753A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Definitions

  • the invention belongs to a circuit board chip process and a structural design, and particularly relates to an embedded patch structure.
  • the circuit board chip technology has been a common technology for the connection of circuit devices in electronic products.
  • the circuit board is etched on the plating layer according to the circuit requirements, and then the electronic device is fixed on the circuit board by bonding or the like. The position is connected to the circuit on the circuit board through soldering or wire connection.
  • the current electronic equipment is constantly pursuing a small footprint and ultra-thin, and at the same time requires high sensitivity and high life. Please refer to the figure. As shown in Fig.
  • the usual practice is to thin the electronic device and place the solder joint 3 of the electronic device 1 above the electronic device 1, and then connect the solder joint 4 on the circuit board 2 by means of the wire 5
  • the soldering is connected, and finally the electronic device 1 is covered with a protective layer of epoxy resin or other material, and the height of the epoxy resin covered must be higher than the connecting line 5 between the solder joints 3 and 4, due to the process.
  • Reason connection 5 Higher than the upper surface of the electronic device 1, it is bound to make the epoxy protective layer covered by the surface of the electronic device 1 thicker, such as the electronic device 1 If it is a fingerprint sensor chip, the thickness of the surface protection layer will determine its sensitivity.
  • the electronic device 1a needs to be connected with the circuit board 2a.
  • a solder joint 3a is arranged on the step, and then the solder joint 4a on the circuit board 2a is connected by a wire, and then covered with a protective layer.
  • the wire 5a is lower than the electronic device due to being on the step. 1a
  • the upper surface is designed to protect the connection 5a from compression damage.
  • the cover layer of the upper surface of the electronic device 1a can be made thinner to ensure its sensitivity.
  • the above-mentioned conforming design has the problem that the circuit board and its load electronic device cannot be further thinned, and the method of connecting the wire itself requires high-precision equipment to complete, and the height difference between the electronic device and the circuit board pad connection is high. It is impossible to choose other connectivity options, so the production cost is relatively high.
  • the invention provides an embedded circuit board patch structure
  • the invention aims to solve the problem that the circuit board and its load device in the prior art cannot be further ultra-thin and the cost of the conductive connection is too high.
  • the present invention provides An embedded circuit board patch structure comprising a circuit board body as a carrier, and an electronic device connected to the circuit board body, the circuit board body having a longitudinal thickness or a partial thickness for accommodating the electronic device In the space, the circuit board body is provided with a body pad, and the upper surface of the electronic device is provided with a device pad, and the body pad and the device pad are electrically connected by using a conductive material.
  • the seating space extends longitudinally through the circuit board body.
  • a layer of insulating adhesive tape is disposed on the bottom of the circuit board body.
  • the circuit board is composed of two parts, the upper part is an upper board having a through-type seating space, and the lower part is a common flat substrate, and the upper board is integrated with the substrate.
  • the surface of the substrate located at a lower portion of the seating space is provided with an adhesive material connectable to the device.
  • the upper surface of the electronic device is flush with the upper surface of the circuit board body, and the body pad is on the same plane as the device pad.
  • the circuit board body is placed in a space larger than the electronic device, and a gap between the edge of the electronic device and the edge of the mounting space is provided with a filling material.
  • the electronic device and the circuit board body are covered and protected by an upper cover on the upper surface of the circuit board body, and the upper cover material is made of sapphire or glass or microcrystalline zirconium or plastic or ceramic; or
  • the cover material adopts epoxy resin to cover and protect the electronic device and the circuit board body; or the upper cover material adopts epoxy glue, and the epoxy glue forms a protective layer on the surface of the electronic device and the circuit board body to realize The electronic device and the circuit board body are protected; or the upper cover material is protected by a protective layer on the surface of the electronic device and the circuit board body by spraying.
  • the upper surface of the circuit board body is provided with a plurality of convex fulcrums corresponding to the edge of the upper cover, the fulcrums are consistent in height and higher than the connection between the body pads and the device pads. Conductive material.
  • the thickness of the electronic device is greatly reduced, which is equivalent to the space required for the thickness of the circuit board, and the circuit board and its load electronic device
  • the integrated thickness is minimized, and even the zero thickness of the upper surface of the electronic device and the surface of the circuit board can be achieved, which is a preferred solution for further realizing the ultra-thin circuit board.
  • the invention additionally provides An embedded circuit board patch production method, which adopts the structure described in the above claims, and the specific production steps are:
  • the insulating adhesive tape is attached to the back of the circuit board
  • the electronic device is placed in the mounting space, and the bottom of the electronic device is bonded to the insulating adhesive paper;
  • S5 Protecting the electronic device by forming a bonding technique using sapphire or glass or microcrystalline zirconium or plastic or ceramic covering the electronic device, or by using epoxy resin molding technology to protect the electronic device Alternatively, the electronic device may be protected by using a dispensing molding technique on the surface of the electronic device, or by applying a technique of spraying a protective material on the surface of the electronic device.
  • the conductive material is made of a metal wire or a conductive wire or a conductive paste.
  • the above method adopts a method of embedding the electronic device after milling the circuit board, which is a method adopted in the case where the lower surface of the circuit board does not require too many circuits, of course, this method
  • the steel mesh conduction mode may also be adopted. 4
  • the specific manner may be that a pre-drawn steel mesh or mesh is laid over the circuit board body, and an opening on the stencil or mesh corresponds to the device pad and the body pad, Performing a metallization operation on the steel mesh such that the metal paste covers the device pad and the body pad through the opening of the stencil, the device pad on the electronic device and the body of the circuit board
  • the body pad is conductively connected. It is necessary to fill and smooth the gap between the electronic device and the mounting space before this step.
  • the invention also provides another An embedded circuit board patch production method, which adopts the structure described in the above claims, and the specific production steps are:
  • the substrate is attached to the back surface of the upper plate to form the circuit board body, and a glue or a patch film or an adhesive material is disposed on the substrate corresponding to the seating space;
  • the electronic device is placed in the mounting space, and the bottom of the electronic device is bonded to the upper surface of the substrate;
  • the filling height of the filler needs to be higher than the electronic device and the upper surface of the circuit board body
  • S7 Protecting the electronic device by forming a bonding technique using sapphire or glass or microcrystalline zirconium or plastic or ceramic covering the electronic device, or by using epoxy resin molding technology to protect the electronic device Alternatively, the electronic device may be protected by using a dispensing molding technique on the surface of the electronic device, or by applying a technique of spraying a protective material on the surface of the electronic device.
  • the overall thickness of the circuit board and its load electronic device can be further reduced to realize an ultra-thin circuit board structure, and in addition, since the upper surface of the electronic device and the surface of the circuit board can be set to be flush State, therefore, a cheaper pad conduction connection scheme, that is, stencil printing or a metallurgical paste operation, can be used, which greatly reduces the production cost and solves the problem that the connection in the prior art is fragile and high in cost. Technical problem.
  • Figure 1 is a side view of a circuit board patch provided by the prior art
  • FIG. 2 is a side view of a special electronic device provided by the prior art and a circuit board;
  • Figure 3 is a side view of the product provided in the first embodiment
  • Figure 4 is a side view of another connection structure provided in the first embodiment
  • Figure 5 is a side view of the product provided in the second embodiment
  • Figure 6 is a side view of another connection structure provided by the second embodiment
  • Figure 8 is a top view of a circular product
  • Figure 9 is a top view of a square product
  • Figure 10 is a schematic view of a steel mesh.
  • the present embodiment provides an embedded circuit board chip structure including a circuit board body 20 as a carrier, and an electronic device 10 connected to the circuit board body 20, the circuit board body 20 Having a mounting space for accommodating a longitudinal thickness or a partial thickness of the electronic device, the circuit board body 20 is provided with a body pad 40, and an upper surface of the electronic device 10 is provided with a device pad 30, the body pad The conductive material 50 is turned on between the device pad 30 and the device pad 30.
  • the mounting space extends longitudinally through the circuit board body 20.
  • a layer of insulating adhesive paper 60 is disposed on the bottom of the circuit board body.
  • the electronic device The upper surface is flush with the upper surface of the circuit board body 20, and the body pad 40 is on the same plane as the device pad 30.
  • the circuit board body 20 is placed in a larger space than the electronic device 10 a gap between the edge of the electronic device 10 and the edge of the mounting space is provided with a filling material, the filling material and the upper surface of the electronic device 10, and the board body 20
  • the upper surface is flush, and the purpose is to prevent the metal paste from leaking into the gap when the metal mesh or the wire mesh is used for scraping the metal paste. Referring to FIG. 4, if the body pad 40 is connected by a metal wire or a conductive wire or a conductive paste. In the manner of the device pads 30, then the gaps need not be filled.
  • the protective layer may be covered by epoxy resin or covered with epoxy or covered with a spray protection material, or may be protected by a protective plate. (or referred to as an upper cover) serves as a protective layer for cover protection, and the protective plate 80 may be directly covered by the sapphire or glass or microcrystalline zirconium or plastic or ceramic on the circuit board body 20 and its load electronics 10
  • a fulcrum 70 is disposed on the outer side of the body pad 40 on the circuit board body 20, and the fulcrum 70 is higher than the metal conductive material between the body pad 40 and the device pad 30.
  • the fulcrum 70 is used to support the edge of the protection plate 80 to prevent the protection plate 80 from being pressed against the conductive material 50 between the two pads to avoid affecting the connection effect.
  • the embodiment provides an embedded circuit board patch structure including a circuit board body 20 as a carrier. And an electronic device 10 connected to the circuit board body 20, the circuit board body 20 having a mounting space for accommodating a longitudinal thickness or a partial thickness of the electronic device 10, the circuit board body 20 A body pad 40 is disposed, and the upper surface of the electronic device 10 is provided with a device pad 30, and the body pad 40 and the device pad 30 are electrically connected by a conductive material 50.
  • the board body 20 is composed of two parts, the upper part is an upper plate 21 having a penetrating seating space, and the lower part is a common flat substrate 22 (the substrate is different from the insulating tape described in the first embodiment because the substrate 22
  • the upper and lower sides of the upper and lower surfaces of the upper and lower surfaces of the upper and lower surfaces of the upper and lower surfaces of the upper and lower surfaces of The surface of the substrate 22 is located at a lower portion of the seating space and is provided with the electronic device 10
  • the bonding material 60 is used to fix the electronic device 10, or the bonding material may be omitted. Referring to FIG. 6, the electronic device 10 is directly connected.
  • the gap existing between the electronic device 10 and the mounting space after being placed in the mounting space is filled with a filling material 90, and a material component having a certain solidification bonding in the filling material 90 can be used for the electronic device.
  • the electronic device must be secured.
  • the upper surface is flush with the upper surface of the circuit board body 20, and the body pad 40 is on the same plane as the device pad 30.
  • the electronic device is fixed by a bonding material 60.
  • the surface height of the electronic device 10 is not required, which may be slightly higher than the upper surface of the circuit board body 20, or may be slightly lower than the circuit board body 20 On the upper surface, there is no need to fill the gap, but this will result in higher production costs.
  • the electronic device 10 and the circuit board body 20 The upper surface is covered with a protective layer.
  • the protective layer may be covered by epoxy resin or covered with epoxy or covered with a spray protection material, or may be protected by a protective plate.
  • a fulcrum 70 is disposed on the outer surface of the body pad 40 of the circuit board body 20, and the fulcrum 70 is higher than the metal conductive material between the body pad 40 and the device pad 30.
  • the fulcrum 70 is used to support the edge of the protection plate 80 to prevent the protection plate 80 from being pressed against the conductive material 50 between the two pads to avoid affecting the connection effect.
  • the embodiment provides a method for producing an embedded circuit board patch, which adopts the structure described in the first embodiment, and the specific production steps are:
  • the insulating adhesive tape 60 is attached to the back of the circuit board 20;
  • the electronic device 10 is placed in the mounting space, and the bottom of the electronic device 10 and the insulating adhesive tape 60 Bonding
  • the device pad 30 on the electronic device 10 and the board body 20 are made of a conductive material 50
  • the upper body pad 40 is turned on;
  • the conductive material 50 is made of a metal wire or a conductive wire or a conductive paste.
  • the above method employs a method of embedding the circuit board 20 into the electronic device 10 after the operation of the circuit board 20, and the method is on the circuit board 20 A method used in the case where the lower surface does not require too much circuitry.
  • a steel mesh may also be used. 9
  • the specific manner of step 4 may be to lay a pre-drawn steel mesh or mesh having an opening 91 above the circuit board body 20, and the steel mesh 9 or the wire mesh is opened. hole 91.
  • a metallurgical paste is performed on the steel mesh 9 so that the metal paste covers the device pad through the opening 91 of the steel mesh 9.
  • the body pad 40, the device pad 30 on the electronic device 10 and the body pad 40 on the circuit board body 20 are electrically connected.
  • the electronic device 10 is required before this step Fill and smooth with the gap between the placement space.
  • this embodiment provides additional An embedded circuit board chip production method adopts the structure described in the second embodiment, and the specific production steps are
  • the substrate 22 is attached to the back surface of the upper board 21 to form the circuit board body 20, and the substrate 22 is Providing glue or a patch film or bonding material 60 corresponding to the seating space area;
  • the electronic device 10 is placed in the mounting space, and the bottom of the electronic device 10 and the substrate 22 Bonding the upper surface;
  • the circuit board body 20 and its load electronics 10 can be manufactured by the above production method.
  • the overall thickness is further reduced to achieve an ultra-thin circuit board structure, and in addition, since the upper surface of the electronic device 10 and the circuit board 20 can be The upper surface is set to a flush state, so that a cheaper pad conduction connection scheme, that is, stencil printing or a metallurgical paste operation, can be used, which greatly reduces the production cost and solves the prior art connection.
  • Technical problems with easy and costly lines are provided.

Abstract

An embedded circuit board patch structure comprises a circuit board main body (20) as a carrier, and an electronic device (10) connected to the circuit board main body (20). The embedded circuit board patch structure is characterized in that: the circuit board main body (20) has an accommodating space for accommodating a vertical thickness or a partial vertical thickness of the electronic device (10), and is provided with a main body solder pad (40). An upper surface of the electronic device (10) is provided with a device solder pad (30), and the main body solder pad (40) and the device solder pad (30) are conducted via a conductive material (50). After the electronic device (10) is placed in the preset accommodating space, an exposed thickness of the electronic device (10) is greatly reduced; namely, the space is saved by utilizing the thickness of the circuit board main body (20), such that an integrated thickness of the circuit board (20) and the electronic device (10) carried on the circuit board is reduced to the greatest extent, and the upper surface of the electronic device (10) can even be level with a surface of the circuit board (20) to achieve zero added thickness, thus bringing a preferable solution for further achieving an ultra-thin circuit board.

Description

一种嵌入式电路板贴片结构及其生产方法 Embedded circuit board patch structure and production method thereof 技术领域Technical field
本发明属于电路板贴片工艺及结构设计，尤其涉及一种嵌入式的贴片结构。  The invention belongs to a circuit board chip process and a structural design, and particularly relates to an embedded patch structure.
背景技术Background technique
电路板贴片技术已经是目前电子产品中电路器件连接普遍应用的一种技术，通常是将电路板根据电路需要在镀层上进行蚀刻加工，然后电子器件通过粘贴等贴合方式固定在电路板相应位置，通过焊接或者搭线连接等连接方式与电路板上电路进行连通，而目前的电子设备在不断的追求占用空间小、超薄，同时又要求灵敏度高，寿命高，请参照图 1 所示，通常做法是将电子器件超薄化，并且将电子器件 1 的焊点 3 置于电子器件 1 的上方，然后通过搭导线 5 的方式与电路板 2 上的焊点 4 进行焊接连通，最后在所述电子器件 1 上覆盖一层环氧树脂或其它材料保护层，而所覆盖的环氧树脂的高度必须高于焊点 3 、 4 之间的连线 5 ，由于工艺原因连线 5 高于电子器件 1 上表面，那么势必会使电子器件 1 表面所覆盖的环氧树脂保护层更厚，例如电子器件 1 如果是指纹感应芯片，那么其表面保护层的厚度会决定其灵敏度，其他器件也会增加整体电路板表面厚度的，但如果表面厚度太薄，又容易致使连线 5 长期使用后受损而报废，目前为了解决此技术问题，市场上出现一种台阶式的电子器件，如图 2 所示，该电子器件 1a 需要与电路板 2a 焊点连接处设有台阶，台阶上设有焊点 3a ，然后通过搭线连接电路板 2a 上的焊点 4a ，再进行覆盖保护层处理，连线 5a 由于处于台阶上，低于电子器件 1a 上表面，这样设计即可保护连线 5a 不受压迫损害，电子器件 1a 上表面的覆盖保护层又可以做到最薄，保证其灵敏度。 The circuit board chip technology has been a common technology for the connection of circuit devices in electronic products. Generally, the circuit board is etched on the plating layer according to the circuit requirements, and then the electronic device is fixed on the circuit board by bonding or the like. The position is connected to the circuit on the circuit board through soldering or wire connection. However, the current electronic equipment is constantly pursuing a small footprint and ultra-thin, and at the same time requires high sensitivity and high life. Please refer to the figure. As shown in Fig. 1, the usual practice is to thin the electronic device and place the solder joint 3 of the electronic device 1 above the electronic device 1, and then connect the solder joint 4 on the circuit board 2 by means of the wire 5 The soldering is connected, and finally the electronic device 1 is covered with a protective layer of epoxy resin or other material, and the height of the epoxy resin covered must be higher than the connecting line 5 between the solder joints 3 and 4, due to the process. Reason connection 5 Higher than the upper surface of the electronic device 1, it is bound to make the epoxy protective layer covered by the surface of the electronic device 1 thicker, such as the electronic device 1 If it is a fingerprint sensor chip, the thickness of the surface protection layer will determine its sensitivity. Other devices will increase the thickness of the overall circuit board surface, but if the surface thickness is too thin, it will easily cause the connection. After long-term use, it is damaged and scrapped. At present, in order to solve this technical problem, a stepped electronic device appears on the market. As shown in Fig. 2, the electronic device 1a needs to be connected with the circuit board 2a. There is a step at the joint of the solder joint, and a solder joint 3a is arranged on the step, and then the solder joint 4a on the circuit board 2a is connected by a wire, and then covered with a protective layer. The wire 5a is lower than the electronic device due to being on the step. 1a The upper surface is designed to protect the connection 5a from compression damage. The cover layer of the upper surface of the electronic device 1a can be made thinner to ensure its sensitivity.
但上述贴合设计均存在无法更进一步使电路板及其负载电子器件超薄的问题，而且本身搭线连接的方式需要高精密的设备才能完成，电子器件与电路板的焊盘连接存在高度差，无法选择其他连通方案，所以生产成本相对来说比较高。 However, the above-mentioned conforming design has the problem that the circuit board and its load electronic device cannot be further thinned, and the method of connecting the wire itself requires high-precision equipment to complete, and the height difference between the electronic device and the circuit board pad connection is high. It is impossible to choose other connectivity options, so the production cost is relatively high.
技术问题technical problem
本发明提供 一种嵌入式电路板贴片结构 ，旨在解决现有技术中电路板及其负载器件无法进一步超薄以及导通连接方式成本过高的问题。  The invention provides an embedded circuit board patch structure The invention aims to solve the problem that the circuit board and its load device in the prior art cannot be further ultra-thin and the cost of the conductive connection is too high.
技术解决方案Technical solution
为了解决上述问题，本发明提供 一种嵌入式电路板贴片结构，包括作为载体的电路板本体，以及与所述电路板本体相连的电子器件，所述电路板本体具有可容纳所述电子器件的纵向厚度或部分厚度的安放空间，所述电路板本体设有本体焊盘，所述电子器件上表面设有器件焊盘，所述本体焊盘与所述器件焊盘之间利用导电材料导通。 In order to solve the above problems, the present invention provides An embedded circuit board patch structure comprising a circuit board body as a carrier, and an electronic device connected to the circuit board body, the circuit board body having a longitudinal thickness or a partial thickness for accommodating the electronic device In the space, the circuit board body is provided with a body pad, and the upper surface of the electronic device is provided with a device pad, and the body pad and the device pad are electrically connected by using a conductive material.
优选地，所述安放空间纵向贯穿所述电路板本体。 Preferably, the seating space extends longitudinally through the circuit board body.
优选地，所述电路板本体底部设有一层绝缘胶纸。 Preferably, a layer of insulating adhesive tape is disposed on the bottom of the circuit board body.
优选地，所述电路板由两部分构成，上部分为具有贯穿式安放空间的上板，下部分为普通平面基板，所述上板与基板贴合为一体。 Preferably, the circuit board is composed of two parts, the upper part is an upper board having a through-type seating space, and the lower part is a common flat substrate, and the upper board is integrated with the substrate.
优选地，所述基板表面位于所述安放空间下部的区域设有可与所述器件连接的粘接材料。 Preferably, the surface of the substrate located at a lower portion of the seating space is provided with an adhesive material connectable to the device.
优选地，所述电子器件上表面与所述电路板本体上表面平齐，所述本体焊盘与所述器件焊盘在同一平面上。 Preferably, the upper surface of the electronic device is flush with the upper surface of the circuit board body, and the body pad is on the same plane as the device pad.
优选地，所述电路板本体安放空间大于所述电子器件，所述电子器件边缘与所述安放空间边缘之间的缝隙设有填充材料。 Preferably, the circuit board body is placed in a space larger than the electronic device, and a gap between the edge of the electronic device and the edge of the mounting space is provided with a filling material.
优选地，所述电路板本体上方采用上盖对所述电子器件及电路板本体进行覆盖贴合保护，所述上盖材料采用蓝宝石或玻璃或微晶锆或塑胶或陶瓷；亦或者所述上盖材料采用环氧树脂对所述电子器件及电路板本体进行覆盖封装保护；亦或者所述上盖材料采用滴胶，所述滴胶在所述电子器件及电路板本体表面形成保护层从而实现对所述电子器件及电路板本体的保护；亦或者所述上盖材料采用防护材料通过喷涂方式在所述电子器件及电路板本体表面形成保护层进行保护。 Preferably, the electronic device and the circuit board body are covered and protected by an upper cover on the upper surface of the circuit board body, and the upper cover material is made of sapphire or glass or microcrystalline zirconium or plastic or ceramic; or The cover material adopts epoxy resin to cover and protect the electronic device and the circuit board body; or the upper cover material adopts epoxy glue, and the epoxy glue forms a protective layer on the surface of the electronic device and the circuit board body to realize The electronic device and the circuit board body are protected; or the upper cover material is protected by a protective layer on the surface of the electronic device and the circuit board body by spraying.
优选地，所述电路板本体上表面设有多个与所述上盖边缘相对应的凸起式支点，所述支点高度一致且高于所述本体焊盘与所述器件焊盘之间连通的导电材料。 Preferably, the upper surface of the circuit board body is provided with a plurality of convex fulcrums corresponding to the edge of the upper cover, the fulcrums are consistent in height and higher than the connection between the body pads and the device pads. Conductive material.
依借上述技术方案，通过将所述电子器件置入预先设置的所述安放空间后，大幅减小了电子器件的厚度，相当于是向电路板的厚度要空间，将电路板及其负载电子器件的综合厚度做出了最大限度的降低，甚至可以做到所述电子器件上表面与所述电路板表面平齐的零厚度，对于进一步实现超薄化电路板带来了优选方案。 According to the above technical solution, after the electronic device is placed in the pre-set space, the thickness of the electronic device is greatly reduced, which is equivalent to the space required for the thickness of the circuit board, and the circuit board and its load electronic device The integrated thickness is minimized, and even the zero thickness of the upper surface of the electronic device and the surface of the circuit board can be achieved, which is a preferred solution for further realizing the ultra-thin circuit board.
本发明另外还提供了 一种嵌入式电路板贴片生产方法，采用上述权利要求所述结构，具体生产步骤为， The invention additionally provides An embedded circuit board patch production method, which adopts the structure described in the above claims, and the specific production steps are:
S1 ，按照所述电子器件形状在所述电路板本体进行铣孔作业，形成所述安放空间，在所述电路板上表面采用多层堆漆印刷或者贴合实体材料的方式设立支点； S1 Performing a hole-cutting operation on the circuit board body according to the shape of the electronic device to form the mounting space, and setting a fulcrum on the surface of the circuit board by using a multi-layer stacking paint or a physical material;
S2 ，将所述绝缘胶纸贴覆于所述电路板背面； S2, the insulating adhesive tape is attached to the back of the circuit board;
S3 ，将所述电子器件置于所述安放空间中，所述电子器件底部与所述绝缘胶纸粘合； S3, the electronic device is placed in the mounting space, and the bottom of the electronic device is bonded to the insulating adhesive paper;
S4 ，利用导电材料将所述电子器件上的器件焊盘和所述电路板本体上的本体焊盘导通连接； S4, using a conductive material to electrically connect the device pad on the electronic device and the body pad on the circuit board body;
S5 ，通过采用蓝宝石或玻璃或微晶锆或塑胶或陶瓷对所述电子器件覆盖的贴合技术保护所述电子器件完成成型工作，亦或者通过采用环氧树脂塑封成型技术对所述电子器件进行保护，亦或者通过采用在所述电子器件表面滴胶成型技术对所述电子器件进行保护，亦或者通过采用在所述电子器件表面喷涂防护材料的技术对所述电子器件进行保护。 S5 Protecting the electronic device by forming a bonding technique using sapphire or glass or microcrystalline zirconium or plastic or ceramic covering the electronic device, or by using epoxy resin molding technology to protect the electronic device Alternatively, the electronic device may be protected by using a dispensing molding technique on the surface of the electronic device, or by applying a technique of spraying a protective material on the surface of the electronic device.
优选地，所述导电材料选用金属导线或者导电排线或者导电胶。 Preferably, the conductive material is made of a metal wire or a conductive wire or a conductive paste.
上述方法采用的是将所述电路板铣孔作业后，嵌入所述电子器件的方法，此方法是在电路板下表面不需要太多电路的情形下采用的一种方式，当然了，此方法中，如果所述电子器件上表面与所述电路板上表面平齐的情况下，也可以采用钢网导通方式，步骤 4 的具体方式可以采用在所述电路板本体上方铺设预先刻画好的钢网或丝网，所述钢网或丝网上的开孔对应连通所述器件焊盘和所述本体焊盘，在所述钢网上进行刮金属膏作业，使金属膏通过所述钢网的开孔覆盖所述器件焊盘和所述本体焊盘，将所述电子器件上的器件焊盘和所述电路板本体上的本体焊盘导通连接。在该步骤之前需要将所述电子器件与安放空间之间的缝隙进行填充并打磨平整。 The above method adopts a method of embedding the electronic device after milling the circuit board, which is a method adopted in the case where the lower surface of the circuit board does not require too many circuits, of course, this method In the case that the upper surface of the electronic device is flush with the surface of the circuit board, the steel mesh conduction mode may also be adopted. 4 The specific manner may be that a pre-drawn steel mesh or mesh is laid over the circuit board body, and an opening on the stencil or mesh corresponds to the device pad and the body pad, Performing a metallization operation on the steel mesh such that the metal paste covers the device pad and the body pad through the opening of the stencil, the device pad on the electronic device and the body of the circuit board The body pad is conductively connected. It is necessary to fill and smooth the gap between the electronic device and the mounting space before this step.
本发明还提供了另外 一种嵌入式电路板贴片生产方法，采用上述权利要求所述结构，具体生产步骤为， The invention also provides another An embedded circuit board patch production method, which adopts the structure described in the above claims, and the specific production steps are:
S1 ，按照所述电子器件形状对所述电路板本体的上板进行铣孔作业，形成所述安放空间，在所述电路板上表面采用多层堆漆印刷或者贴合实体材料的方式设立支点； S1 Performing a hole-cutting operation on the upper plate of the circuit board body according to the shape of the electronic device to form the mounting space, and setting a fulcrum on the surface of the circuit board by using multi-layer stacking printing or laminating physical materials;
S2 ，将所述基板贴覆于所述上板背面形成所述电路板本体，并在所述基板对应所述安放空间区域设置胶水或者贴片膜或者粘接材料； S2 And the substrate is attached to the back surface of the upper plate to form the circuit board body, and a glue or a patch film or an adhesive material is disposed on the substrate corresponding to the seating space;
S3 ，将所述电子器件置于所述安放空间中，所述电子器件底部与所述基板上表面粘合； S3, the electronic device is placed in the mounting space, and the bottom of the electronic device is bonded to the upper surface of the substrate;
S4 ，向所述电子器件与所述安放空间之间的缝隙内注入填充料，所述填充料的填充高度需要高于所述电子器件和所述电路板本体上表面； S4 Filling a filler into the gap between the electronic device and the mounting space, the filling height of the filler needs to be higher than the electronic device and the upper surface of the circuit board body;
S5 ，待所述填充料干燥硬化后对其进行表面打磨，经过打磨使所述填充料与所述电子器件和所述电路板本体上表面平齐； S5 After the filler is dried and hardened, it is surface-polished, and the filler is polished to be flush with the electronic device and the upper surface of the circuit board body;
S6 ，在所述电路板本体上方铺设预先刻画好的钢网或丝网，所述钢网或丝网上的开孔对应连通所述器件焊盘和所述本体焊盘，在所述钢网上进行刮金属膏作业，使金属膏通过所述钢网的开孔覆盖所述器件焊盘和所述本体焊盘，将所述电子器件上的器件焊盘和所述电路板本体上的本体焊盘导通连接； S6 Laying a pre-drawn steel mesh or mesh over the circuit board body, the opening on the stencil or mesh correspondingly connecting the device pad and the body pad, and scraping on the steel mesh Metal paste operation, such that the metal paste covers the device pad and the body pad through the opening of the stencil, and the device pad on the electronic device and the body pad on the circuit board body are guided Connected
S7 ，通过采用蓝宝石或玻璃或微晶锆或塑胶或陶瓷对所述电子器件覆盖的贴合技术保护所述电子器件完成成型工作，亦或者通过采用环氧树脂塑封成型技术对所述电子器件进行保护，亦或者通过采用在所述电子器件表面滴胶成型技术对所述电子器件进行保护，亦或者通过采用在所述电子器件表面喷涂防护材料的技术对所述电子器件进行保护。 S7 Protecting the electronic device by forming a bonding technique using sapphire or glass or microcrystalline zirconium or plastic or ceramic covering the electronic device, or by using epoxy resin molding technology to protect the electronic device Alternatively, the electronic device may be protected by using a dispensing molding technique on the surface of the electronic device, or by applying a technique of spraying a protective material on the surface of the electronic device.
有益效果Beneficial effect
通过上述生产方法，可以将电路板及其负载电子器件的整体厚度进一步降低，实现超薄化电路板结构，另外，由于可以将所述电子器件上表面与所述电路板上表面设置到平齐状态，故此，可以采用更为廉价的焊盘导通连接方案，也就是钢网印刷或者称之为刮金属膏作业，大大降低了生产成本，解决了现有技术中连线易断且成本高的技术问题。 Through the above production method, the overall thickness of the circuit board and its load electronic device can be further reduced to realize an ultra-thin circuit board structure, and in addition, since the upper surface of the electronic device and the surface of the circuit board can be set to be flush State, therefore, a cheaper pad conduction connection scheme, that is, stencil printing or a metallurgical paste operation, can be used, which greatly reduces the production cost and solves the problem that the connection in the prior art is fragile and high in cost. Technical problem.
附图说明DRAWINGS
图 1 是现有技术提供的电路板贴片侧视图 Figure 1 is a side view of a circuit board patch provided by the prior art
图 2 是现有技术 提供的特殊电子器件与电路板贴合后的侧视图； 2 is a side view of a special electronic device provided by the prior art and a circuit board;
图 3 是实施例一所提供的产品侧视图； Figure 3 is a side view of the product provided in the first embodiment;
图 4 是实施例一所提供的另一中连接结构侧视图； Figure 4 is a side view of another connection structure provided in the first embodiment;
图 5 是实施例二所提供的产品侧视图； Figure 5 is a side view of the product provided in the second embodiment;
图 6 是实施例二所提供的另一中连接结构侧视图； Figure 6 is a side view of another connection structure provided by the second embodiment;
图 7 是实施例二所提供的产品厚度数据展示示意图； 7 is a schematic view showing the product thickness data provided in the second embodiment;
图 8 是圆形产品俯视图； Figure 8 is a top view of a circular product;
图 9 是方形产品俯视图； Figure 9 is a top view of a square product;
图 10 是钢网示意图。 Figure 10 is a schematic view of a steel mesh.
本发明的实施方式Embodiments of the invention
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。 The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
实施例一， Embodiment 1,
参照图 3 并结合图 8 到 10 所示，本实施例提供一种嵌入式电路板贴片结构，包括作为载体的电路板本体 20 ，以及与所述电路板本体 20 相连的电子器件 10 ，所述电路板本体 20 具有可容纳所述电子器件的纵向厚度或部分厚度的安放空间，所述电路板本体 20 设有本体焊盘 40 ，所述电子器件 10 上表面设有器件焊盘 30 ，所述本体焊盘 40 与所述器件焊盘 30 之间利用导电材料 50 导通。所述安放空间纵向贯穿所述电路板本体 20 。所述电路板本体底部设有一层绝缘胶纸 60 。所述电子器件 10 上表面与所述电路板本体 20 上表面平齐，所述本体焊盘 40 与所述器件焊盘 30 在同一平面上。所述电路板本体 20 安放空间大于所述电子器件 10 ，所述电子器件 10 边缘与所述安放空间边缘之间的缝隙设有填充材料，所述填充材料与所述电子器件 10 上表面、电路板本体 20 上表面平齐，目的是防止在使用钢网或者丝网进行刮金属膏时金属膏漏入缝隙中。参照图 4 ，如果采用搭金属导线或者导电排线或者导电胶连接所述本体焊盘 40 与所述器件焊盘 30 的方式，那么则并不需要对所述缝隙进行填充。焊盘之间导通完毕后，所述电子器 ,10 和电路板本体 20 上表面覆盖一层保护层，具体地，保护层可由环氧树脂覆盖或采用滴胶覆盖或者采用喷涂保护材料覆盖来形成，还可以由保护板 80 （或称为上盖）充当保护层进行覆盖保护，所述保护板 80 可由蓝宝石或玻璃或微晶锆或塑胶或陶瓷直接覆盖在所述电路板本体 20 及其负载电子器件 10 表面，所述电路板本体 20 上的本体焊盘 40 外侧设有支点 70 ，所述支点 70 高于所述本体焊盘 40 和器件焊盘 30 之间的金属导电材料 50 ，所述支点 70 用来支撑所述保护板 80 的边缘防止保护板 80 压迫到两焊盘之间的导电材料 50 ，避免影响其连接效果。 Refer to Figure 3 and combine Figures 8 to 10 As shown, the present embodiment provides an embedded circuit board chip structure including a circuit board body 20 as a carrier, and an electronic device 10 connected to the circuit board body 20, the circuit board body 20 Having a mounting space for accommodating a longitudinal thickness or a partial thickness of the electronic device, the circuit board body 20 is provided with a body pad 40, and an upper surface of the electronic device 10 is provided with a device pad 30, the body pad The conductive material 50 is turned on between the device pad 30 and the device pad 30. The mounting space extends longitudinally through the circuit board body 20. A layer of insulating adhesive paper 60 is disposed on the bottom of the circuit board body. The electronic device The upper surface is flush with the upper surface of the circuit board body 20, and the body pad 40 is on the same plane as the device pad 30. The circuit board body 20 is placed in a larger space than the electronic device 10 a gap between the edge of the electronic device 10 and the edge of the mounting space is provided with a filling material, the filling material and the upper surface of the electronic device 10, and the board body 20 The upper surface is flush, and the purpose is to prevent the metal paste from leaking into the gap when the metal mesh or the wire mesh is used for scraping the metal paste. Referring to FIG. 4, if the body pad 40 is connected by a metal wire or a conductive wire or a conductive paste. In the manner of the device pads 30, then the gaps need not be filled. After the pads are turned on, the electronic device, 10 and the board body 20 The upper surface is covered with a protective layer. Specifically, the protective layer may be covered by epoxy resin or covered with epoxy or covered with a spray protection material, or may be protected by a protective plate. (or referred to as an upper cover) serves as a protective layer for cover protection, and the protective plate 80 may be directly covered by the sapphire or glass or microcrystalline zirconium or plastic or ceramic on the circuit board body 20 and its load electronics 10 A fulcrum 70 is disposed on the outer side of the body pad 40 on the circuit board body 20, and the fulcrum 70 is higher than the metal conductive material between the body pad 40 and the device pad 30. The fulcrum 70 is used to support the edge of the protection plate 80 to prevent the protection plate 80 from being pressed against the conductive material 50 between the two pads to avoid affecting the connection effect.
实施例二， Embodiment 2,
参照图 5 所示，本实施例提供一种嵌入式电路板贴片结构，包括作为载体的电路板本体 20 ，以及与所述电路板本体 20 相连的电子器件 10 ，所述电路板本体 20 具有可容纳所述电子器件 10 的纵向厚度或部分厚度的安放空间，所述电路板本体 20 设有本体焊盘 40 ，所述电子器件 10 上表面设有器件焊盘 30 ，所述本体焊盘 40 与所述器件焊盘 30 之间利用导电材料 50 导通。所述电路板本体 20 由两部分构成，上部分为具有贯穿式安放空间的上板 21 ，下部分为普通平面基板 22 ，（所述基板与实施例一中所述的绝缘胶纸不同，因为基板 22 的上下两面还是可以设置电路连接的）所述上板 21 与基板 22 贴合为一体。所述基板 22 表面位于所述安放空间下部的区域设有可与所述电子器件 10 连接的粘接材料 60 ，所述粘接材料 60 的作用是固定所述电子器件 10 ，也可以省略此粘接材料，参照图 6 所示，而是直接将所述电子器件 10 置入所述安放空间后对所述电子器件 10 与安放空间之间所存在的缝隙利用填充材料 90 进行填充，填充材料 90 中具有一定凝固粘接的材料成分可将所述电子器件 10 进行固定。如果导电材料 50 选用金属导线或者导电排线或者导电胶，那么为了减少工作复杂度，就选用粘接材料 60 从所述电子器件 10 底部进行粘接，如果导电材料 50 选用金属膏，用刮金属膏的方式导通的话，那么必须要对所述电子器件 10 与安放空间之间的缝隙进行填充，以免金属膏流入所述缝隙中，同时也对所述电子器件 10 进行了固定处理。但如果采用刮金属膏进行导通连接的方式就必须保证所述电子器件 10 上表面与所述电路板本体 20 上表面平齐，所述本体焊盘 40 与所述器件焊盘 30 在同一平面上。而采用粘接材料 60 固定所述电子器件 10 ，则不要求所述电子器件 10 的表面高度，其可以略高于所述电路板本体 20 上表面，也可以略低于所述电路板本体 20 上表面，也不用进行填充缝隙的作业，但这样做会导致生产成本增高。所述电子器件 10 和电路板本体 20 上表面覆盖一层保护层，具体地，保护层可由环氧树脂覆盖或采用滴胶覆盖或者采用喷涂保护材料覆盖来形成，还可以由保护板 80 （或称为上盖）充当保护层进行覆盖保护，所述保护板 80 可由蓝宝石或玻璃或微晶锆或塑胶或陶瓷直接覆盖在所述电路板本体 20 及其负载电子器件 10 表面，所述电路板本体 20 上本体焊盘 40 外侧设有支点 70 ，所述支点 70 高于所述本体焊盘 40 和器件焊盘 30 之间的金属导电材料 50 ，所述支点 70 用来支撑所述保护板 80 的边缘防止保护板 80 压迫到两焊盘之间的导电材料 50 ，避免影响其连接效果。 Referring to FIG. 5, the embodiment provides an embedded circuit board patch structure including a circuit board body 20 as a carrier. And an electronic device 10 connected to the circuit board body 20, the circuit board body 20 having a mounting space for accommodating a longitudinal thickness or a partial thickness of the electronic device 10, the circuit board body 20 A body pad 40 is disposed, and the upper surface of the electronic device 10 is provided with a device pad 30, and the body pad 40 and the device pad 30 are electrically connected by a conductive material 50. The board body 20 is composed of two parts, the upper part is an upper plate 21 having a penetrating seating space, and the lower part is a common flat substrate 22 (the substrate is different from the insulating tape described in the first embodiment because the substrate 22 The upper and lower sides of the upper and lower surfaces of the upper and lower surfaces of the upper and lower surfaces of the upper and lower surfaces of The surface of the substrate 22 is located at a lower portion of the seating space and is provided with the electronic device 10 The bonding material 60 is used to fix the electronic device 10, or the bonding material may be omitted. Referring to FIG. 6, the electronic device 10 is directly connected. The gap existing between the electronic device 10 and the mounting space after being placed in the mounting space is filled with a filling material 90, and a material component having a certain solidification bonding in the filling material 90 can be used for the electronic device. 10 Fix it. If the conductive material 50 is made of a metal wire or a conductive wire or a conductive paste, in order to reduce the work complexity, the bonding material 60 is selected from the electronic device 10 Bonding is performed at the bottom. If the conductive material 50 is made of a metal paste and is turned on by a metal paste, then the electronic device must be applied. The gap between the space and the seating space is filled to prevent the metal paste from flowing into the gap, and the electronic device 10 is also fixed. However, if a conductive metal paste is used for the conductive connection, the electronic device must be secured. The upper surface is flush with the upper surface of the circuit board body 20, and the body pad 40 is on the same plane as the device pad 30. The electronic device is fixed by a bonding material 60. The surface height of the electronic device 10 is not required, which may be slightly higher than the upper surface of the circuit board body 20, or may be slightly lower than the circuit board body 20 On the upper surface, there is no need to fill the gap, but this will result in higher production costs. The electronic device 10 and the circuit board body 20 The upper surface is covered with a protective layer. Specifically, the protective layer may be covered by epoxy resin or covered with epoxy or covered with a spray protection material, or may be protected by a protective plate. (or referred to as an upper cover) serves as a protective layer for cover protection, and the protective plate 80 may be directly covered by the sapphire or glass or microcrystalline zirconium or plastic or ceramic on the circuit board body 20 and its load electronics 10 A fulcrum 70 is disposed on the outer surface of the body pad 40 of the circuit board body 20, and the fulcrum 70 is higher than the metal conductive material between the body pad 40 and the device pad 30. The fulcrum 70 is used to support the edge of the protection plate 80 to prevent the protection plate 80 from being pressed against the conductive material 50 between the two pads to avoid affecting the connection effect.
实施例三， Embodiment 3,
参照图 3 、 4 以及 8-10 所示，本实施例提供一种嵌入式电路板贴片生产方法，采用上述实施例一所述结构，具体生产步骤为， Refer to Figures 3, 4 and 8-10 As shown in the figure, the embodiment provides a method for producing an embedded circuit board patch, which adopts the structure described in the first embodiment, and the specific production steps are:
S1 ，按照所述电子器件 10 形状在所述电路板本体 20 上进行铣孔作业，形成所述安放空间，在所述电路板本体 20 上表面采用多层堆漆印刷或者贴合实体材料的方式设立支点 70 ； S1, in the shape of the electronic device 10 on the board body 20 Performing a hole milling operation to form the mounting space, and setting a fulcrum 70 on the upper surface of the circuit board body 20 by using multi-layer stacking printing or laminating a solid material;
S2 ，将所述绝缘胶纸 60 贴覆于所述电路板 20 背面； S2, the insulating adhesive tape 60 is attached to the back of the circuit board 20;
S3 ，将所述电子器件 10 置于所述安放空间中，所述电子器件 10 底部与所述绝缘胶纸 60 粘合； S3, the electronic device 10 is placed in the mounting space, and the bottom of the electronic device 10 and the insulating adhesive tape 60 Bonding
S4 ，利用导电材料 50 将所述电子器件 10 上的器件焊盘 30 和所述电路板本体 20 上的本体焊盘 40 导通连接； S4, the device pad 30 on the electronic device 10 and the board body 20 are made of a conductive material 50 The upper body pad 40 is turned on;
S5 ，通过采用蓝宝石或玻璃或微晶锆或塑胶或陶瓷对所述电子器件覆盖的贴合技术保护所述电子器件 10 完成成型工作，亦或者通过采用环氧树脂塑封成型技术对所述电子器件 10 进行保护，亦或者通过采用在所述电子器件 10 表面滴胶成型技术对所述电子器件 10 进行保护，亦或者通过采用在所述电子器件 10 表面喷涂防护材料的技术对所述电子器件 10 进行保护。 S5, protecting the electronic device by a bonding technique that covers the electronic device with sapphire or glass or microcrystalline zirconium or plastic or ceramic 10 The molding operation is completed, or the electronic device 10 is protected by using an epoxy resin molding technique, or by using an epoxy molding technique on the surface of the electronic device 10 The protection is performed, or the electronic device 10 is protected by a technique of spraying a protective material on the surface of the electronic device 10.
本实施例中所述导电材料 50 选用金属导线或者导电排线或者导电胶。 In the embodiment, the conductive material 50 is made of a metal wire or a conductive wire or a conductive paste.
上述方法采用的是将所述电路板 20 铣孔作业后，嵌入所述电子器件 10 的方法，此方法是在电路板 20 下表面不需要太多电路的情形下采用的一种方式，当然了，此方法中，如果所述电子器件 10 上表面与所述电路板 20 上表面平齐的情况下，也可以采用钢网 9 印刷金属导电材料的导通方式，步骤 4 的具体方式可以采用在所述电路板本体 20 上方铺设预先刻画好的具有开孔 91 的钢网或丝网，所述钢网 9 或丝网上的开孔 91 对应连通所述器件焊盘 30 和所述本体焊盘 40 ，在所述钢网 9 上进行刮金属膏作业，使金属膏通过所述钢网 9 的开孔 91 覆盖所述器件焊盘 30 和所述本体焊盘 40 ，将所述电子器件 10 上的器件焊盘 30 和所述电路板本体 20 上的本体焊盘 40 导通连接。在该步骤之前需要将所述电子器件 10 与安放空间之间的缝隙进行填充并打磨平整。 The above method employs a method of embedding the circuit board 20 into the electronic device 10 after the operation of the circuit board 20, and the method is on the circuit board 20 A method used in the case where the lower surface does not require too much circuitry. Of course, in this method, if the upper surface of the electronic device 10 is flush with the upper surface of the circuit board 20, a steel mesh may also be used. 9 For the manner of conducting the conductive metal conductive material, the specific manner of step 4 may be to lay a pre-drawn steel mesh or mesh having an opening 91 above the circuit board body 20, and the steel mesh 9 or the wire mesh is opened. hole 91. Corresponding to the device pad 30 and the body pad 40, a metallurgical paste is performed on the steel mesh 9 so that the metal paste covers the device pad through the opening 91 of the steel mesh 9. And the body pad 40, the device pad 30 on the electronic device 10 and the body pad 40 on the circuit board body 20 are electrically connected. The electronic device 10 is required before this step Fill and smooth with the gap between the placement space.
实施例四， Embodiment 4,
参照图 5-10 所示，本实施例提供了另外 一种嵌入式电路板贴片生产方法，采用上述实施例二所述结构，具体生产步骤为， Referring to Figures 5-10, this embodiment provides additional An embedded circuit board chip production method adopts the structure described in the second embodiment, and the specific production steps are
S1 ，按照所述电子器件 10 形状对所述电路板本体 20 的上板 21 进行铣孔作业，形成所述安放空间，在所述电路板 20 上表面采用多层堆漆印刷或者贴合实体材料的方式设立支点 70 ； S1, facing the upper plate of the circuit board body 20 according to the shape of the electronic device 10 Performing a hole milling operation to form the seating space, and setting a fulcrum 70 on the upper surface of the circuit board 20 by using multi-layer stacking printing or laminating physical materials;
S2 ，将所述基板 22 贴覆于所述上板 21 背面形成所述电路板本体 20 ，并在所述基板 22 对应所述安放空间区域设置胶水或者贴片膜或者粘接材料 60 ； S2, the substrate 22 is attached to the back surface of the upper board 21 to form the circuit board body 20, and the substrate 22 is Providing glue or a patch film or bonding material 60 corresponding to the seating space area;
S3 ，将所述电子器件 10 置于所述安放空间中，所述电子器件 10 底部与所述基板 22 上表面粘合； S3, the electronic device 10 is placed in the mounting space, and the bottom of the electronic device 10 and the substrate 22 Bonding the upper surface;
S4 ，向所述电子器件 10 与所述安放空间之间的缝隙内注入填充料 90 ，所述填充料 90 的填充高度需要高于或平齐所述电子器件 10 和所述电路板本体 20 上表面； S4, injecting a filler 90 into the gap between the electronic device 10 and the mounting space, the filler 90 The filling height needs to be higher or flatter than the upper surface of the electronic device 10 and the circuit board body 20;
S5 ，待所述填充料 90 干燥硬化后对其进行表面打磨，经过打磨使所述填充料 90 与所述电子器件 10 和所述电路板本体 20 上表面平齐； S5, after the filler 90 is dried and hardened, it is surface-polished, and the filler 90 and the electronic device are polished. 10 and the upper surface of the circuit board body 20 is flush;
S6 ，在所述电路板本体 20 上方铺设预先刻画好的钢网 9 或丝网，所述钢网 9 或丝网上的开孔 91 对应连通所述器件焊盘 30 和所述本体焊盘 40 ，在所述钢网 9 上进行刮金属膏作业，使金属膏通过所述钢网 9 的开孔 91 覆盖所述器件焊盘 30 和所述本体焊盘 40 ，将所述电子器件 10 上的器件焊盘 30 和所述电路板本体 20 上的本体焊盘 40 导通连接； S6, laying a pre-drawn steel mesh 9 or a wire mesh on the circuit board body 20, the steel mesh 9 or the opening on the wire mesh 91. Corresponding to the device pad 30 and the body pad 40, a metallurgical paste is performed on the steel mesh 9 so that the metal paste covers the device pad through the opening 91 of the steel mesh 9. And the body pad 40, the device pad 30 on the electronic device 10 and the body pad 40 on the circuit board body 20 are electrically connected;
S7 ，通过采用蓝宝石或玻璃或微晶锆或塑胶或陶瓷对所述电子器件覆盖的贴合技术保护所述电子器件 10 完成成型工作，亦或者通过采用环氧树脂塑封成型技术对所述电子器件 10 进行保护，亦或者通过采用在所述电子器件 10 表面滴胶成型技术对所述电子器件 10 进行保护，亦或者通过采用在所述电子器件 10 表面喷涂防护材料的技术对所述电子器件 10 进行保护。 S7, protecting the electronic device by a bonding technique that covers the electronic device with sapphire or glass or microcrystalline zirconium or plastic or ceramic 10 The molding operation is completed, or the electronic device 10 is protected by using an epoxy resin molding technique, or by using an epoxy molding technique on the surface of the electronic device 10 The protection is performed, or the electronic device 10 is protected by a technique of spraying a protective material on the surface of the electronic device 10.
通过上述生产方法，可以将电路板本体 20 及其负载电子器件 10 的整体厚度进一步降低，实现超薄化电路板结构，另外，由于可以将所述电子器件 10 上表面与所述电路板 20 上表面设置到平齐状态，故此，可以采用更为廉价的焊盘导通连接方案，也就是钢网印刷或者称之为刮金属膏作业，大大降低了生产成本，解决了现有技术中连线易断且成本高的技术问题。 The circuit board body 20 and its load electronics 10 can be manufactured by the above production method. The overall thickness is further reduced to achieve an ultra-thin circuit board structure, and in addition, since the upper surface of the electronic device 10 and the circuit board 20 can be The upper surface is set to a flush state, so that a cheaper pad conduction connection scheme, that is, stencil printing or a metallurgical paste operation, can be used, which greatly reduces the production cost and solves the prior art connection. Technical problems with easy and costly lines.
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。 The above is only the preferred embodiment of the present invention, and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection of the present invention. Within the scope.

Claims (12)

  1. 一种嵌入式电路板贴片结构，包括作为载体的电路板本体，以及与所述电路板本体相连的电子器件，其特征在于，所述电路板本体具有可容纳所述电子器件的纵向厚度或部分厚度的安放空间，所述电路板本体设有本体焊盘，所述电子器件上表面设有器件焊盘，所述本体焊盘与所述器件焊盘之间利用导电材料导通。 An embedded circuit board patch structure comprising a circuit board body as a carrier, and an electronic device connected to the circuit board body, wherein the circuit board body has a longitudinal thickness capable of accommodating the electronic device or A portion of the thickness of the mounting space, the circuit board body is provided with a body pad, and the upper surface of the electronic device is provided with a device pad, and the body pad and the device pad are electrically connected by using a conductive material.
  2. 如权利要求 1 所述的结构，其特征在于，所述安放空间纵向贯穿所述电路板本体。The structure of claim 1 wherein said seating space extends longitudinally through said circuit board body.
  3. 如权利要求 2 所述的结构，其特征在于，所述电路板本体底部设有一层绝缘胶纸。The structure of claim 2, wherein a layer of insulating adhesive tape is disposed on the bottom of the circuit board body.
  4. 如权利要求 1 所述的结构，其特征在于，所述电路板由两部分构成，上部分为具有贯穿式安放空间的上板，下部分为普通平面基板，所述上板与基板贴合为一体。Claims 1 The structure is characterized in that the circuit board is composed of two parts, the upper part is an upper board having a through-type seating space, and the lower part is a common flat substrate, and the upper board is integrated with the substrate.
  5. 如权利要求 4 所述的结构，其特征在于，所述基板表面位于所述安放空间下部的区域设有可与所述器件连接的粘接材料。Claims 4 The structure is characterized in that an area of the substrate surface located at a lower portion of the seating space is provided with an adhesive material connectable to the device.
  6. 如权利要求 1-5 任一项所述的结构，其特征在于，所述电子器件上表面与所述电路板本体上表面平齐，所述本体焊盘与所述器件焊盘在同一平面上。Claims 1-5 The structure of any one of the preceding claims, wherein the upper surface of the electronic device is flush with the upper surface of the circuit board body, and the body pad is on the same plane as the device pad.
  7. 如权利要求 6 所述的结构，其特征在于，所述电路板本体安放空间大于所述电子器件，所述电子器件边缘与所述安放空间边缘之间的缝隙设有填充材料。Claim 6 The structure is characterized in that the circuit board body is placed in a space larger than the electronic device, and a gap between the edge of the electronic device and the edge of the mounting space is provided with a filling material.
  8. 如权利要求 1 所述的结构，其特征在于，所述电路板本体上方采用上盖对所述电子器件及电路板本体进行覆盖贴合保护，所述上盖材料采用蓝宝石或玻璃或微晶锆或塑胶或陶瓷；亦或者所述上盖材料采用环氧树脂对所述电子器件及电路板本体进行覆盖封装保护；亦或者所述上盖材料采用滴胶，所述滴胶在所述电子器件及电路板本体表面形成保护层从而实现对所述电子器件及电路板本体的保护；亦或者所述上盖材料采用防护材料通过喷涂方式在所述电子器件及电路板本体表面形成保护层进行保护。Claims 1 The structure is characterized in that the electronic device and the circuit board body are covered and protected by an upper cover on the upper surface of the circuit board body, and the upper cover material is made of sapphire or glass or microcrystalline zirconium or plastic or ceramic. Or the cover material is covered with epoxy resin to cover and protect the electronic device and the circuit board body; or the upper cover material is epoxy, the glue is on the electronic device and the circuit board body The surface is formed with a protective layer to protect the electronic device and the circuit board body; or the upper cover material is protected by a protective layer on the surface of the electronic device and the circuit board body by spraying.
  9. 如权利要求 8 所述的结构，其特征在于，所述电路板本体上表面设有多个与所述上盖边缘相对应的凸起式支点，所述支点高度一致且高于所述本体焊盘与所述器件焊盘之间连通的导电材料。According to claim 8 The structure is characterized in that: the upper surface of the circuit board body is provided with a plurality of convex fulcrums corresponding to the edge of the upper cover, the fulcrum height is consistent and higher than the body pad and the A conductive material that communicates between device pads.
  10. 一种嵌入式电路板贴片生产方法，采用上述权利要求所述结构，其特征在于，具体生产步骤为，An embedded circuit board patch production method, using the structure according to the above claims, characterized in that the specific production steps are
    S1 ，按照所述电子器件形状在所述电路板本体进行铣孔作业，形成所述安放空间，在所述电路板上表面采用多层堆漆印刷或者贴合实体材料的方式设立支点；S1 Performing a hole-cutting operation on the circuit board body according to the shape of the electronic device to form the mounting space, and setting a fulcrum on the surface of the circuit board by using a multi-layer stacking paint or a physical material;
    S2 ，将所述绝缘胶纸贴覆于所述电路板背面；S2, the insulating adhesive tape is attached to the back of the circuit board;
    S3 ，将所述电子器件置于所述安放空间中，所述电子器件底部与所述绝缘胶纸粘合；S3, the electronic device is placed in the mounting space, and the bottom of the electronic device is bonded to the insulating adhesive paper;
    S4 ，利用导电材料将所述电子器件上的器件焊盘和所述电路板本体上的本体焊盘导通连接；S4, using a conductive material to electrically connect the device pad on the electronic device and the body pad on the circuit board body;
    S5 ，通过采用蓝宝石或玻璃或微晶锆或塑胶或陶瓷对所述电子器件覆盖的贴合技术保护所述电子器件完成成型工作，亦或者通过采用环氧树脂塑封成型技术对所述电子器件进行保护，亦或者通过采用在所述电子器件表面滴胶成型技术对所述电子器件进行保护，亦或者通过采用在所述电子器件表面喷涂防护材料的技术对所述电子器件进行保护。S5 Protecting the electronic device by forming a bonding technique using sapphire or glass or microcrystalline zirconium or plastic or ceramic covering the electronic device, or by using epoxy resin molding technology to protect the electronic device Alternatively, the electronic device may be protected by using a dispensing molding technique on the surface of the electronic device, or by applying a technique of spraying a protective material on the surface of the electronic device.
  11. 如权利要求 10 所述的生产方法，其特征在于，所述导电材料选用金属导线或者导电排线或者导电胶。The production method according to claim 10, wherein the conductive material is made of a metal wire or a conductive wire or a conductive paste.
  12. 一种嵌入式电路板贴片生产方法，采用上述权利要求所述结构，其特征在于，具体生产步骤为，An embedded circuit board patch production method, using the structure according to the above claims, characterized in that the specific production steps are
    S1 ，按照所述电子器件形状对所述电路板本体的上板进行铣孔作业，形成所述安放空间，在所述电路板上表面采用多层堆漆印刷或者贴合实体材料的方式设立支点；S1 Performing a hole-cutting operation on the upper plate of the circuit board body according to the shape of the electronic device to form the mounting space, and setting a fulcrum on the surface of the circuit board by using multi-layer stacking printing or laminating physical materials;
    S2 ，将所述基板贴覆于所述上板背面形成所述电路板本体，并在所述基板对应所述安放空间区域设置胶水或者贴片膜或者粘接材料；S2 And the substrate is attached to the back surface of the upper plate to form the circuit board body, and a glue or a patch film or an adhesive material is disposed on the substrate corresponding to the seating space;
    S3 ，将所述电子器件置于所述安放空间中，所述电子器件底部与所述基板上表面粘合；S3, the electronic device is placed in the mounting space, and the bottom of the electronic device is bonded to the upper surface of the substrate;
    S4 ，向所述电子器件与所述安放空间之间的缝隙内注入填充料，所述填充料的填充高度需要高于所述电子器件和所述电路板本体上表面；S4 Filling a filler into the gap between the electronic device and the mounting space, the filling height of the filler needs to be higher than the electronic device and the upper surface of the circuit board body;
    S5 ，待所述填充料干燥硬化后对其进行表面打磨，经过打磨使所述填充料与所述电子器件和所述电路板本体上表面平齐；S5 After the filler is dried and hardened, it is surface-polished, and the filler is polished to be flush with the electronic device and the upper surface of the circuit board body;
    S6 ，在所述电路板本体上方铺设预先刻画好的钢网或丝网，所述钢网或丝网上的开孔对应连通所述器件焊盘和所述本体焊盘，在所述钢网上进行刮金属膏作业，使金属膏通过所述钢网的开孔覆盖所述器件焊盘和所述本体焊盘，将所述电子器件上的器件焊盘和所述电路板本体上的本体焊盘导通连接；S6 Laying a pre-drawn steel mesh or mesh over the circuit board body, the opening on the stencil or mesh correspondingly connecting the device pad and the body pad, and scraping on the steel mesh Metal paste operation, such that the metal paste covers the device pad and the body pad through the opening of the stencil, and the device pad on the electronic device and the body pad on the circuit board body are guided Connected
    S7 ，通过采用蓝宝石或玻璃或微晶锆或塑胶或陶瓷对所述电子器件覆盖的贴合技术保护所述电子器件完成成型工作，亦或者通过采用环氧树脂塑封成型技术对所述电子器件进行保护，亦或者通过采用在所述电子器件表面滴胶成型技术对所述电子器件进行保护，亦或者通过采用在所述电子器件表面喷涂防护材料的技术对所述电子器件进行保护。 S7 Protecting the electronic device by forming a bonding technique using sapphire or glass or microcrystalline zirconium or plastic or ceramic covering the electronic device, or by using epoxy resin molding technology to protect the electronic device Alternatively, the electronic device may be protected by using a dispensing molding technique on the surface of the electronic device, or by applying a technique of spraying a protective material on the surface of the electronic device.
PCT/CN2015/078582 2015-05-08 2015-05-08 Embedded circuit board patch structure and manufacturing method thereof WO2016179753A1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5696666A (en) * 1995-10-11 1997-12-09 Motorola, Inc. Low profile exposed die chip carrier package
US6518501B1 (en) * 1999-10-26 2003-02-11 Nrs Technologies Inc. Electronic part and method of assembling the same
CN101165866A (en) * 2006-10-20 2008-04-23 美国博通公司 Integrated circuit package and method of making same
EP2287903A2 (en) * 2009-08-18 2011-02-23 Honeywell International Inc. Suspended lead frame electronic package

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5696666A (en) * 1995-10-11 1997-12-09 Motorola, Inc. Low profile exposed die chip carrier package
US6518501B1 (en) * 1999-10-26 2003-02-11 Nrs Technologies Inc. Electronic part and method of assembling the same
CN101165866A (en) * 2006-10-20 2008-04-23 美国博通公司 Integrated circuit package and method of making same
EP2287903A2 (en) * 2009-08-18 2011-02-23 Honeywell International Inc. Suspended lead frame electronic package

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