A device integration method and integrated device. The method may include the steps of directly bonding a semiconductor device having a substrate to an element; and removing a portion of the substrate to expose a remaining portion of the semiconductor device after bonding. The element may include one...http://www.google.es/patents/US20030119279?utm_source=gb-gplus-sharePatente US20030119279 - Three dimensional device integration method and integrated device
Three dimensional device integration method and integrated device
Número de solicitud: 10/270,318 Número de publicación: US 2003/0119279 A1 Fecha de presentación: 15 Oct 2002 Patente emitida: US7037755 ( Fecha de emisión 2 May 2006)
