A paste for filling a throughhole, comprises: an epoxy resin; a curing agent; and a metal filler, wherein the metal filler is a powder comprising a base metal, and the curing agent is an imidazole compound represented by the following formula (1): ...http://www.google.es/patents/US6706975?utm_source=gb-gplus-sharePatente US6706975 - Paste for filling throughhole and printed wiring board using same
Paste for filling throughhole and printed wiring board using same
