There is provided a method for fabricating semiconductor devices including resin packages sealing semiconductor elements and external connection terminals respectively resin projections formed on the resin packages and metallic film parts provided to the resin projections. The semiconductor elements...http://www.google.es/patents/US6159770?utm_source=gb-gplus-sharePatente US6159770 - Method and apparatus for fabricating semiconductor device
Method and apparatus for fabricating semiconductor device
