A method of making a circuitized substrate wherein fill material is forced into the substrate's holes to thus provide additional support for conductive circuitry or the like thereon, thus increasing the final product's circuit density. The fill is provided in a substantially uncured state, following...http://www.google.es/patents/US6009620?utm_source=gb-gplus-sharePatente US6009620 - Method of making a printed circuit board having filled holes
Method of making a printed circuit board having filled holes
