Disclosed is an interposer comprising a silicon substrate (20). A plurality of conductive holes (27) penetrating the silicon substrate (20) are formed by dry etching, and at least one end of each conductive hole (27) is provided with a probe (12) via a pad (45). Since conductive holes are formed in a...http://www.google.es/patents/US20080171452?utm_source=gb-gplus-sharePatente US20080171452 - Interposer, Probe Card and Method for Manufacturing the Interposer
Interposer, Probe Card and Method for Manufacturing the Interposer
Número de solicitud: 11/884,075 Número de publicación: US 2008/0171452 A1 Fecha de presentación: 9 Feb 2006 Patente emitida: US7891090 ( Fecha de emisión 22 Feb 2011)
