A method for forming a nickel cap layer over copper metalized bond pad is disclosed in which the phosphorous content of the nickel cap, and particularly the surface of the nickel cap, may be controlled. The phosphorous content of the surface of the nickel cap is suitably determined such that oxidation...http://www.google.es/patents/US7186636?utm_source=gb-gplus-sharePatente US7186636 - Nickel bonding cap over copper metalized bondpads
