An electronic device package in the form of a ball grid array package is formed adding a single layer of conductive material including circuitry having trace lines, wire bond pads, and solder ball pads electrically coupled together. Thin film circuitization techniques are used on a polyimide laminate...http://www.google.es/patents/US5966803?utm_source=gb-gplus-sharePatente US5966803 - Ball grid array having no through holes or via interconnections
Ball grid array having no through holes or via interconnections
