A semiconductor package comprises a semiconductor component (e.g., a die) and a via at least partially covered by an encapsulant. The encapsulant forms substantially parallel top and bottom surfaces, with at least part of the via being exposed on the top surface. At least one conductive pad is exposed...http://www.google.es/patents/US8106496?utm_source=gb-gplus-sharePatente US8106496 - Semiconductor packaging system with stacking and method of manufacturing thereof
Semiconductor packaging system with stacking and method of manufacturing thereof
