A chip-to-chip optical interconnect includes a substrate, an optoelectronic die, and a waveguide structure. The substrate includes an optical via passing through the substrate. The optoelectronic die is disposed on the substrate and aligned to optically communicate through the optical via. A waveguide...http://www.google.es/patents/US7373033?utm_source=gb-gplus-sharePatente US7373033 - Chip-to-chip optical interconnect
