A semiconductor chip package that includes a DC-DC converter implemented with a land grid array (LGA) package for interconnection and surface mounting to a printed circuit board. The LGA package integrates all required active components of the DC-DC power converter, including a synchronous buck PWM controller,...http://www.google.es/patents/US20040212074?utm_source=gb-gplus-sharePatente US20040212074 - DC-DC converter implemented in a land grid array package
DC-DC converter implemented in a land grid array package
Número de solicitud: 10/691,833 Número de publicación: US 2004/0212074 A1 Fecha de presentación: 22 Oct 2003 Patente emitida: US6940724 ( Fecha de emisión 6 Sep 2005)
