Semiconductor dies are bonded to contact pads formed in a substrate's cavity. Vias through the substrate open into the cavity. Conductive lines passing through the vias connect the contact pads in the cavity to contact pads on another side of the substrate. A passage in the substrate opens into the cavity...http://www.google.es/patents/US6787916?utm_source=gb-gplus-sharePatente US6787916 - Structures having a substrate with a cavity and having an integrated circuit bonded to a contact pad located in the cavity
Structures having a substrate with a cavity and having an integrated circuit ...
