A flip chip on chip method for forming a flip chip assembly including a first flip chip; a second flip chip directly connected to the top of the first flip chip; and electrically conductive epoxy means disposed between the second flip chip and the top of the first flip chip to form an electrical connection...http://www.google.es/patents/US6098278?utm_source=gb-gplus-sharePatente US6098278 - Method for forming conductive epoxy flip-chip on chip
Method for forming conductive epoxy flip-chip on chip
