An adhesive film is formed on an electrode film, and a coating film is formed thereon. Nickel, chrome, molybdenum, tungsten, aluminum or an alloy of them is used as a constituent material of the adhesive film. Gold, silver, platinum or an alloy of them is used as a constituent material of the coating...http://www.google.es/patents/US7405484?utm_source=gb-gplus-sharePatente US7405484 - Semiconductor device containing stacked semiconductor chips and manufacturing method thereof
Semiconductor device containing stacked semiconductor chips and ...
