The present invention generally relates to filling of a feature by depositing a barrier layer, depositing a seed layer over the barrier layer, and depositing a conductive layer over the seed layer. In one embodiment, the seed layer comprises a copper alloy seed layer deposited over the barrier layer....http://www.google.es/patents/US7352048?utm_source=gb-gplus-sharePatente US7352048 - Integration of barrier layer and seed layer
