A method of making a circuitized substrate in which conductors are formed in such a manner that selected ones of the conductors include solder while others do not and are thus adapted for receiving a different form of connection (e.g., wire-bond) than the solder covered conductors. In one embodiment,...http://www.google.es/patents/US7910156?utm_source=gb-gplus-sharePatente US7910156 - Method of making circuitized substrate with selected conductors having solder thereon
Method of making circuitized substrate with selected conductors having ...
