An apparatus and method for forming an integrated barrier layer on a substrate is described. The integrated barrier layer comprises at least a first refractory metal layer and a second refractory metal layer. The integrated barrier layer is formed using a dual-mode deposition process comprising a chemical...http://www.google.es/patents/US7867914?utm_source=gb-gplus-sharePatente US7867914 - System and method for forming an integrated barrier layer
System and method for forming an integrated barrier layer
