A semiconductor device with a package size close to its chip size is, apart from a stress absorbing layer, such as to effectively absorb thermal stresses. A semiconductor device (150) has a semiconductor chip provided with electrodes (158), a resin layer (152) forming a stress relieving layer provided...http://www.google.es/patents/US6255737?utm_source=gb-gplus-sharePatente US6255737 - Semiconductor device and method of making the same, circuit board, and electronic instrument
Semiconductor device and method of making the same, circuit board, and ...
