A wiring board where an electronic component is mounted on a main surface via a bump and at least a part of the periphery of the electronic component is covered with resin, the wiring board includes a dam provided at least at a part of the periphery of an area where the electronic component is mounted,...http://www.google.es/patents/US7880276?utm_source=gb-gplus-sharePatente US7880276 - Wiring board and semiconductor device
