Novel processes and apparatus permit lift-off, alignment, and bonding of materials and devices. The processes involve first depositing a device layer on a sacrifical layer situated on a growth substrate. A device may be defined in the device layer. The device layer or the device is coated with a carrier...http://www.google.es/patents/US5465009?utm_source=gb-gplus-sharePatente US5465009 - Processes and apparatus for lift-off and bonding of materials and devices
Processes and apparatus for lift-off and bonding of materials and devices
