A bonding method and apparatus that uses a position detection camera which takes images of a workpiece and a light path conversion device which directs the image of an area near the lower end of a capillary to the position detection camera. The image acquired by the position detection camera is processed,...http://www.google.es/patents/US20030098426?utm_source=gb-gplus-sharePatente US20030098426 - Wire bonding method and apparatus
Número de solicitud: 10/307,050 Número de publicación: US 2003/0098426 A1 Fecha de presentación: 27 Nov 2002 Patente emitida: US6945446 ( Fecha de emisión 20 Sep 2005)
