In a flip-chip type semiconductor device, a pad electrode and a passivation film are formed on a semiconductor substrate. An insulating resin layer is formed on the passivation film, and an opening is formed above the electrode. A pad electrode adhesive metal film is formed on the substrate like a re-wiring...http://www.google.es/patents/US6734566?utm_source=gb-gplus-sharePatente US6734566 - Recyclable flip-chip semiconductor device
