A bumped semiconductor component includes bumped contacts, a semiconductor die having die contacts, and a redistribution circuit having conductors for establishing electrical communication between the die contacts and the bumped contacts. The redistribution circuit also includes test contacts in electrical...http://www.google.es/patents/US6954000?utm_source=gb-gplus-sharePatente US6954000 - Semiconductor component with redistribution circuit having conductors and test contacts
Semiconductor component with redistribution circuit having conductors and ...
