A stacked die package includes a substrate or interposer board that includes a contact area on a top surface and landing pads surrounding the contact area. Solder pads are disposed on an opposite side of the substrate. The solder pads are electrically connected with the landing pads by inner board wiring....http://www.google.es/patents/US7545048?utm_source=gb-gplus-sharePatente US7545048 - Stacked die package
