A molding machine for encapsulating electronic devices mounted on one side of a substrate, and having a ball-grid array, pin-grid array, or land-grid array on the opposite side, has a two member biased floating plate apparatus to compensate for variations in substrate thickness, and a gas collection/venting...http://www.google.es/patents/US6472252?utm_source=gb-gplus-sharePatente US6472252 - Methods for ball grid array (BGA) encapsulation mold
Methods for ball grid array (BGA) encapsulation mold
