A method of making a circuitized substrate wherein a chip-accommodating cavity is formed along with a plurality of conductive elements (e.g., pads, lines, etc.) which form part of the substrate's circuitry. Metallization is facilitated by the use of a photoimageable member that allows for initial removal...http://www.google.es/patents/US6225028?utm_source=gb-gplus-sharePatente US6225028 - Method of making an enhanced organic chip carrier package
Method of making an enhanced organic chip carrier package
