A lead structure is provided in a semiconductor device, having a body of a lead having at least a part of which is in contact with an adhesive which bonds with an insulation tape, and a protection layer selectively provided on the body of the lead so that the protection layer coats at least the part...http://www.google.es/patents/US6124642?utm_source=gb-gplus-sharePatente US6124642 - Lead structure for a semiconductor device with an isolating protective layer and method of fabricating the same
Lead structure for a semiconductor device with an isolating protective layer ...
