A method with three embodiments of manufacturing metal lines and solder bumps using electroless deposition techniques. The first embodiment uses a PdSix seed layer 50 for electroless deposition. The PdSix layer 50 does not require activation. A metal line is formed on a barrier layer 20 and an adhesion...http://www.google.es/patents/US6436816?utm_source=gb-gplus-sharePatente US6436816 - Method of electroless plating copper on nitride barrier
Method of electroless plating copper on nitride barrier
