Provided is a printed circuit board having a bump interconnection structure that improves reliability between interconnection layers. Also provided is a method of fabricating the printed circuit board and semiconductor package using the printed circuit board. According to one embodiment, the printed...http://www.google.es/patents/US20080054462?utm_source=gb-gplus-sharePatente US20080054462 - PRINTED CIRCUIT BOARD HAVING RELIABLE BUMP INTERCONNECTION STRUCTURE, METHOD OF FABRICATING THE SAME, AND SEMICONDUCTOR PACKAGE USING THE SAME
PRINTED CIRCUIT BOARD HAVING RELIABLE BUMP INTERCONNECTION STRUCTURE, METHOD ...
Número de solicitud: 11/850,576 Número de publicación: US 2008/0054462 A1 Fecha de presentación: 5 Sep 2007 Patente emitida: US7759795 ( Fecha de emisión 20 Jul 2010)
