An apparatus for packing a filler of conductive material into through-holes in a printed circuit board comprises a packing nozzle, an mask and a covering plate. The packing nozzle delivers a filler of conductive material through a delivery opening, and a delivery valve is mounted at the delivery opening....http://www.google.es/patents/US5145691?utm_source=gb-gplus-sharePatente US5145691 - Apparatus for packing filler into through-holes or the like in a printed circuit board
Apparatus for packing filler into through-holes or the like in a printed ...
