A stackable semiconductor chip package, methods of fabricating the chip package, and a stacked semiconductor chip module are disclosed. In the chip package or the chip module, lateral surfaces of each semiconductor chip are insulated with insulation regions that are formed while the chip is still part...http://www.google.es/patents/US6124149?utm_source=gb-gplus-sharePatente US6124149 - Method of making stackable semiconductor chips to build a stacked chip module
Method of making stackable semiconductor chips to build a stacked chip module
