A system and method for providing an interconnect on a substrate is disclosed. The method and system include providing a first layer, a first barrier layer, and a second layer. The first layer is subject to electromigration and has a thickness. The thickness of the first layer is smaller than what is...http://www.google.es/patents/US6010960?utm_source=gb-gplus-sharePatente US6010960 - Method and system for providing an interconnect having reduced failure rates due to voids
Method and system for providing an interconnect having reduced failure rates ...
